Composite electronic component
A composite electronic component includes a multilayer capacitor including a capacitor body, which includes first and second internal electrodes facing each other and a plurality of dielectric layers each interposed therebetween and first and second external electrodes disposed on opposing ends of the capacitor body, a high-rigidity chip including a substrate disposed on a lower side of the multilayer capacitor and first and second discharge electrodes disposed on the substrate and spaced apart from each other, the first and second discharge electrodes being connected to the first and second external electrodes, respectively, and extending to an upper or lower surface of the substrate, and an sealing part covering the first and second discharge electrodes and including a space portion, which is provided between the first and second discharge portions.
1. A composite electronic component comprising:
a multilayer capacitor including a capacitor body, which includes first and second internal electrodes facing each other and a plurality of dielectric layers each interposed therebetween, and first and second external electrodes disposed on opposing ends of the capacitor body;
a high-rigidity chip including a substrate disposed on a lower side of the multilayer capacitor and first and second discharge electrodes disposed on the substrate and spaced apart from each other, the first and second discharge electrodes being connected to the first and second external electrodes, respectively, and extending to both side and upper surfaces of the substrate or extending to both side and lower surfaces of the substrate;
a sealing part covering the first and second discharge electrodes and including a space portion, which is provided between the first and second discharge electrodes; and
first and second terminal electrodes disposed on an exterior side of the multilayer capacitor and the high-rigidity chip,
wherein the first and second discharge electrodes are spaced apart from the first and second terminal electrodes, respectively.
2. The composite electronic component of claim 1 , wherein
the capacitor body includes first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other,
each of the first and second internal electrodes has one end exposed to the third and fourth surfaces, respectively, and
the first and second external electrodes include a first connection portion and a second connection portion disposed on the third and fourth surfaces of the capacitor body, respectively, and a first band portion and a second band portion extending from the first and second connection portions, respectively, to portions of the first and second surfaces and portions of the fifth and sixth surfaces of the capacitor body, the first and second connection portions being connected to the first and second discharge electrodes, respectively.
3. The composite electronic component of claim 2 , wherein
the first terminal electrode covers portions of the first connection portion, the first band portion disposed on the first surface of the capacitor body, one end surface of the sealing part, and a portion of a lower surface of the sealing part; and
the second terminal electrode covers portions of the second connection portion, the second band portion disposed on the first surface of the capacitor body, another end surface of the sealing part, and a portion of the lower surface of the sealing part.
4. The composite electronic component of claim 1 , wherein
the high-rigidity chip is formed of alumina.
5. The composite electronic component of claim 1 , wherein
portions of the first and second discharge electrodes are disposed on a lower surface of the substrate.
6. The composite electronic component of claim 1 , wherein
portions of the first and second discharge electrodes are disposed on an upper surface of the substrate.
7. The composite electronic component of claim 1 , further comprising:
an electrostatic discharge (ESD) functional member disposed in the space portion and connecting the first and second discharge electrodes.
8. The composite electronic component of claim 7 , wherein
portions of the first and second discharge electrodes and the ESD functional member are disposed on a lower surface of the substrate.
9. The composite electronic component of claim 7 , wherein
portions of the first and second discharge electrodes and the ESD functional member are disposed on an upper surface of the substrate.
10. The composite electronic component of claim 1 , wherein
a gap between the first and second discharge electrodes in the space portion is 1 to 20 μm.
11. The Composite electronic component of claim 1 , wherein the sealing part is arranged between the first discharge electrode and the first terminal electrode, and between the second discharge electrode and the second terminal electrode.