IP Library Granted Patent US 10,361,187
Granted Patent B1
US 10,361,187 · App. 15/975,791 · Granted Jul 23, 2019

Electrostatic discharge protection device

Inventors: Ruei-Siang Syu (Hsinchu, TW); Wen-Chu Lo (Hsinchu, TW); Chih-Feng Lin (Taipei, TW)
Assignee: Powerchip Semiconductor Manufacturing Corporation
H01L27/0262H01L27/0255H01L27/0292H01L27/067H01L29/0692H01L29/0834H01L29/0839H01L29/7436
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Quick Facts
Patent No.
US 10,361,187
App. No.
15/975,791
Granted
Jul 23, 2019
Kind
B1
Abstract

An electrostatic discharge (ESD) protection device including a silicon controlled rectifier and a diode string arranged along a first direction is provided. The silicon controlled rectifier includes an anode and a cathode disposed separately from each other. The anode and the cathode respectively include doped regions. The doped regions in the anode are arranged along a second direction. The doped regions in the cathode are arranged along the second direction. The first direction intersects the second direction.

Claims (32)

1. An electrostatic discharge protection device, comprising a silicon controlled rectifier and a diode string arranged along a first direction, wherein

the silicon controlled rectifier comprises an anode and a cathode disposed separately from each other,

the anode and the cathode respectively comprise doped regions,

the doped regions in the anode are arranged along a second direction,

the doped regions in the cathode are arranged along the second direction, and

the first direction intersects the second direction.

2. The electrostatic discharge protection device according to claim 1 , wherein the anode is located between the cathode and the diode string.

3. The electrostatic discharge protection device according to claim 1 , wherein the doped regions in the anode are disposed separately from each other, and the doped regions in the cathode are disposed separately from each other.

4. The electrostatic discharge protection device according to claim 1 , wherein

the doped regions in the anode comprise at least one first N-type doped region and at least one first P-type doped region, and

the doped regions in the cathode comprise at least one second N-type doped region and at least one second P-type doped region.

5. The electrostatic discharge protection device according to claim 4 , wherein the at least one first N-type doped region and the at least one first P-type doped region are coupled to each other, and the at least one second N-type doped region and the at least one second P-type doped region are coupled to each other.

6. The electrostatic discharge protection device according to claim 4 , wherein in the anode, a total area of the at least one first P-type doped region is larger than a total area of the at least one first N-type doped region.

7. The electrostatic discharge protection device according to claim 6 , wherein in the anode, a ratio of the total area of the at least one first P-type doped region to a total area of the at least one first N-type doped region and the at least one first P-type doped region is larger than 50% and less than or equal to 70%.

8. The electrostatic discharge protection device according to claim 4 , wherein in the cathode, a total area of the at least one second N-type doped region is larger than a total area of the at least one second P-type doped region.

9. The electrostatic discharge protection device according to claim 8 , wherein in the cathode, a ratio of the total area of the at least one second N-type doped region to a total area of the at least one second N-type doped region and the at least one second P-type doped region is larger than 50% and less than or equal to 70%.

10. The electrostatic discharge protection device according to claim 1 , wherein the silicon controlled rectifier further comprises:

an N-type well region, wherein the doped regions in the anode are located in the N-type well region; and

a P-type well region, wherein the doped regions in the cathode are located in the P-type well region.

11. The electrostatic discharge protection device according to claim 1 , wherein the diode string comprises diodes connected in series, wherein the diodes are arranged along the second direction.

12. The electrostatic discharge protection device according to claim 11 , wherein the diodes respectively comprise an N-type doped region and a P-type doped region.

13. The electrostatic discharge protection device according to claim 12 , wherein the N-type doped region and the P-type doped region are disposed separately from each other.

14. The electrostatic discharge protection device according to claim 11 , wherein the diode string further comprises N-type well regions, wherein the diodes are respectively located in the N-type well regions.

15. The electrostatic discharge protection device according to claim 1 , wherein the silicon controlled rectifier is coupled to the diode string.

16. The electrostatic discharge protection device according to claim 15 , wherein the anode of the silicon controlled rectifier is coupled to an input terminal of the diode string, and the cathode of the silicon controlled rectifier is coupled to an output terminal of the diode string.

17. An electrostatic discharge protection device, comprising a silicon controlled rectifier and a diode string arranged along a first direction, wherein

the diode string comprises diodes connected in series,

the diodes are arranged along a second direction, and

the first direction intersects the second direction.

18. The electrostatic discharge protection device according to claim 17 , wherein the diodes respectively comprise an N-type doped region and a P-type doped region.

19. The electrostatic discharge protection device according to claim 17 , wherein the diode string further comprises N-type well regions, wherein the diodes are respectively located in the N-type well regions.

20. The electrostatic discharge protection device according to claim 17 , wherein the silicon controlled rectifier is coupled to the diode string.

Assignments (2)
CHANGE OF NAME Recorded May 7, 2019
From: MAXCHIP ELECTRONICS CORP.
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049095/0648 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2018
From: SYU, RUEI-SIANG; LO, WEN-CHU; LIN, CHIH-FENG
To: MAXCHIP ELECTRONICS CORP.
Reel/Frame 045775/0256 →
Priority Claims (1)
TW 107105108 A · Feb 13, 2018 · national