Solid-state imaging device including microlenses on a substrate and method of manufacturing the same

1. A solid-state imaging device, comprising:

a substrate having a surface;

a plurality of microlenses formed on the surface; and

a concave lens formed between adjacent ones of the plurality of microlenses and having a concave shape directed toward the surface of the substrate, the concave lens having a curved shape with a curvature radius of 100 nm or less in a 45-degree cross section along a direction which is inclined by 45 degrees relative to a first direction on the substrate and is parallel to a thickness direction of the substrate.

2. The solid-state imaging device of claim 1 , wherein the concave lens is one of a plurality of concave lenses formed in a square lattice pattern and arrayed in two directions on the surface of the substrate such that each of the plurality of concave lenses is formed between adjacent ones of the plurality of microlenses,

each of the plurality of concave lenses has a curvature radius of 100 nm or less in a lateral cross section along the first direction of the two directions and is parallel to the thickness direction of the substrate, and

each of the plurality of concave lenses has a curvature radius of 100 nm or less in a 45-degree cross section along the direction which is inclined by 45 degrees relative to the first direction on the substrate and is parallel to the thickness direction of the substrate.

3. A solid-state imaging device, comprising:

a plurality of photoelectric transducers formed on a substrate in a square lattice pattern and arrayed in two directions on the substrate;

a plurality of color filters formed respectively on the plurality of photoelectric transducers; and

a plurality of microlenses formed respectively on the plurality of color filters, the plurality of microlenses including adjacent microlenses having a valley portion formed therebetween,

wherein the valley portion is one of a plurality of valley portions formed in the square lattice pattern and arrayed in the two directions such that each of the plurality of valley portions is formed between adjacent microlenses of the plurality of microlenses,

each of the plurality of valley portions has a curvature radius of 100 nm or less in a lateral cross section along a direction which is one of the two directions and is parallel to a thickness direction of the substrate, and

each of the plurality of valley portions has a curvature radius of 100 nm or less in a 45-degree cross section along a direction which is inclined by 45 degrees relative to the one of the two directions on the substrate and is parallel to the thickness direction of the substrate.

4. The solid-state imaging device of claim 3 , wherein each of the plurality of microlenses has a shape of an arc, a parabola, or a sine wave in the lateral cross section parallel to the thickness direction of the substrate.

5. A method of manufacturing the solid-state imaging device of claim 1 , comprising:

forming the plurality of microlenses simultaneously with concave lenses by photolithography using a gray-tone mask.

6. The method of claim 5 , further comprising:

forming a photoelectric transducer on the surface of the substrate before the forming of the plurality of microlenses.

7. The method of claim 5 , wherein the forming of the plurality of microlenses includes

placing a photosensitive microlens material on a side of the substrate, and

patterning the photosensitive microlens material by the photolithography using the gray-tone mask.

8. The method of claim 5 , wherein the forming of the plurality of microlenses includes

forming a transparent resin layer on the surface of the substrate,

forming a photosensitive sacrificing layer on the transparent resin layer,

patterning the photosensitive sacrificing layer by the photolithography using the gray-tone mask such that a microlens mold is formed, and

etching the microlens mold and the transparent resin layer.

9. The method of claim 6 , further comprising:

forming a plurality of color filters on the photoelectric transducer before the forming of the plurality of microlenses,

wherein the forming of the photoelectric transducer includes forming a plurality of photoelectric transducers in a two-dimensional square lattice pattern on the substrate, and the forming of the plurality of microlenses includes

forming a transparent resin layer on the color filters,

forming a microlens mold on an upper side of the transparent resin layer by photolithography using a gray-tone mask, and

transferring the microlens mold to a lower side of the transparent resin layer by dry-etching transfer such that the plurality of microlenses are formed respectively on the color filters.

10. The method of claim 8 , wherein the forming of the microlens mold is conducted by the photolithography used in the forming of the plurality of microlenses such that a shape of the microlens mold is controlled.

11. The method of claim 8 , wherein the transferring of the microlens mold is conducted such that each of the concave lenses has a curvature radius of 100 nm or less in a lateral cross section along the direction which is one of the two directions and is parallel to the thickness direction of the substrate, and

each of the concave lenses has a curvature radius of 100 nm or less in a 45-degree cross section along the direction which is inclined by 45 degrees relative to the one of the two directions on the substrate and is parallel to the thickness direction of the substrate.

12. The method of claim 8 , wherein the forming of the plurality of microlenses includes forming an upper surface of the plurality of microlenses by the photolithography using the gray-tone mask and forming a lower surface of the plurality of microlenses by dry-etching transfer.

13. The method of claim 5 , wherein the photolithography employs an i-ray or KrF laser as ultraviolet light.