Resistive random-access memory array with reduced switching resistance variability

1. A method for fabricating a memory device, comprising:

forming a stack structure on a substrate, wherein the stack structure comprises a plurality of insulating layers and horizontal electrode layers, wherein each horizontal electrode layer is disposed between two insulating layers in the stack structure;

forming an array of vertical via structures which extend through the stack structure, wherein each vertical via structure comprises an inner metallic core, and an outer insulating layer which surrounds the inner metallic core, wherein the outer insulating layer comprises a metal-oxide material which exhibits a resistive switching behavior;

wherein a resistive memory device is formed within the stack structure at each cross-point between the vertical via structures and the horizontal electrode layers, wherein the horizontal electrode layers and the inner metallic cores of the vertical via structures serve as device electrodes of the resistive memory devices, and wherein the outer insulating layers of the vertical via structures serve as resistive switching layers of the resistive memory devices; and

forming upper metal lines on an upper surface of the stack structure, wherein each upper metal line is connected to a separate group of vertical via structures to thereby form separate vertical via groups and to thereby define a three-dimensional (3D) array of resistive memory cells;

wherein each resistive memory cell comprises a group of parallel-connected resistive memory devices which intersect a same horizontal electrode layer and which are commonly connected to a same one of the upper metal lines;

wherein each group of parallel-connected resistive memory devices is configured to function as a single resistive memory cell having a total switching resistance equal to an average of switching resistances of the parallel-connected resistive memory devices that form the single resistive memory cell.

2. The method of claim 1 , wherein forming the array of vertical via structures which extend through the stack structure, comprises:

etching the stack structure to form an array of vertical via openings that extend through the stack structure;

depositing a conformal layer of metal-oxide material to line sidewall surfaces of the vertical via openings with the metal-oxide material;

depositing a conformal layer of conductive material over the conformal layer of metal-oxide material;

depositing a layer of metallic material to fill the vertical via openings with the metallic material; and

removing overburden portions of the conformal layer of metal-oxide material, the conformal layer of conductive material, and the layer of metallic material, to expose an upper surface of the stack structure;

wherein the portions of the conformal layer of metal-oxide material which line the sidewall surfaces of the vertical via openings form the outer insulating layers of the vertical via structures; and

wherein the portions of the conformal layer of conductive material and the layer of metallic material disposed within the vertical via openings collectively form the inner metallic cores of the vertical via structures.

3. The method of claim 1 , wherein the metal-oxide material comprises a transition metal-oxide material including at least one of hafnium oxide and tantalum oxide.

4. The method of claim 1 , wherein the inner metallic cores of the vertical via structures each comprise a multilayer core structure comprising a first layer of conductive material surrounding a second layer of conductive material, wherein the first layer of conductive material serves as a reactive electrode for the resistive memory devices, wherein the second layer of conductive material comprises a low-resistivity metallic material which serves as a word line of the 3D array of resistive memory cells, and wherein the horizontal electrode layers serve as bit lines of the 3D array of resistive memory cells.

5. The method of claim 4 , wherein the first layer of conductive material of the multi-layer core structure comprises one of titanium nitride and an aluminum-containing alloy, and wherein the second layer of conductive material comprises one of copper and tungsten.

6. The method of claim 1 , wherein forming the stack structure on the substrate comprises forming alternating layers of insulating material and metallic material as part of a back-end-of-line (BEOL) process to form the stack structure as part of a BEOL interconnect structure.

7. The method of claim 1 , wherein each of the insulating layers of the stack structure comprises a multilayer insulating stack structure comprising a low-k dielectric insulating layer disposed between diffusion barrier layers.

8. The method of claim 7 , wherein the low-k dielectric insulating layer comprises silicon oxide and wherein the diffusion barrier layers comprise silicon nitride films.

9. The method of claim 1 , wherein the horizontal electrode layers of the stack structure comprise one of titanium nitride, tungsten and copper.

10. The method of claim 1 , wherein forming the upper metal lines on the upper surface of the stack structure comprises depositing and patterning a layer of metallic material to form the upper metal lines, wherein the upper metal lines comprise one of copper, tungsten, and aluminum.

11. The method of claim 1 , wherein each of the upper metal lines is connected to a same number of vertical via structures such that each via group comprises the same number of vertical via structures.

12. The method of claim 1 , wherein the memory device comprises a 3D resistive random-access memory (RRAM) crossbar array.

13. The method of claim 1 , wherein each resistive memory cell in the 3D array of resistive memory cells comprises a same number of parallel-connected resistive memory devices.