IP Library › Granted Patent US 10,388,910
Granted Patent B2
US 10,388,910 · App. 15/977,447 · Granted Aug 20, 2019

Display device including a barrier layer and method for manufacturing the same

Inventors: Injun Bae (Seoul, KR); Junhee Lee (Hwaseong-si, KR)
Assignee: SAMSUNG DISPLAY CO., LTD.
H01L51/5253G09G3/3266G09G3/3291H01L27/3246H01L27/3262H01L27/3276H01L51/5203H01L51/56
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Quick Facts
Patent No.
US 10,388,910
App. No.
15/977,447
Granted
Aug 20, 2019
Kind
B2
Abstract

A display device includes a first substrate and a barrier layer disposed on the first substrate. A thin film transistor is on the barrier layer. An organic light emitting element is connected to the thin film transistor. The barrier layer includes a metal including at least one of Al, Ag, Cu, Mo, Cr, or Ta.

Claims (52)

1. A display device comprising:

a first substrate;

a barrier layer disposed on the first substrate;

a thin film transistor on the barrier layer; and

an organic light emitting element connected to the thin film transistor,

wherein the barrier layer comprises a metal including at least one of Al, Ag, Cu, Mo, Cr, or Ta;

wherein the barrier layer further includes an oxide the metal; and

wherein the oxide of the metal has an increasingly higher density along a direction away from the first substrate.

2. The display device of claim 1 , wherein the oxide of the metal has the increasingly higher density in a direction toward the organic light emitting element.

3. The display device of claim 1 , further comprising a second substrate on a lower surface of the first substrate.

4. The display device of claim 1 , further comprising an auxiliary buffer layer between the barrier layer and the first substrate.

5. The display device of claim 1 , further comprising a wiring electrically connected to a power supply portion and electrically connected to the thin film transistor and the organic light emitting element, wherein the power supply portion is configured to provide a substantially constant voltage to the thin film transistor and the organic light emitting element, and

wherein the wiring is electrically connected to the barrier layer.

6. The display device of claim 5 , wherein the wiring comprises at least one of a common power line, a high potential line, or an initialization line.

7. The display device of claim 1 , wherein the barrier layer has a thickness of about 800 Å or more.

8. The display device of claim 1 , wherein the organic light emitting element comprises:

a first electrode on the barrier layer,

a light emitting layer on the first electrode; and

a second electrode on the light emitting layer.

9. The display device of claim 1 , further comprising a thin film encapsulation layer on the organic light emitting element.

10. The display device of claim 9 , wherein the thin film encapsulation layer comprises:

at least one inorganic layer on the organic light emitting element; and

at least one organic layer on the inorganic layer.

11. A method of manufacturing a display device, the method comprising:

forming a barrier layer on a first substrate;

forming a thin film transistor on the barrier layer;

forming an organic light emitting element on the thin film transistor; and

forming a thin film encapsulation layer on the organic light emitting element,

wherein forming of the barrier layer on the first substrate comprises:

depositing a metal; and

substantially simultaneously depositing the metal and an oxygen gas.

12. The method of claim 11 , wherein a metal oxide included in the barrier layer has an increasingly higher density in a direction toward the organic light emitting element.

13. The method of claim 11 , further comprising, before forming the barrier layer on the first substrate:

disposing the first substrate on a second substrate.

14. The method of claim 13 , further comprising, before forming the barrier layer on the first substrate:

forming a first auxiliary buffer layer on the second substrate; and

disposing the first substrate on the first auxiliary buffer layer.

15. The method of claim 11 , wherein depositing the metal comprises depositing the metal through sputtering.

16. The method of claim 11 , wherein the metal comprises at least one of Al, Ag, Cu, Mo, Cr, or Ta.

17. A display device comprising:

a substrate;

an auxiliary buffer layer disposed on the substrate;

a barrier layer disposed on the auxiliary buffer layer;

a buffer layer disposed on the barrier layer;

a thin film transistor disposed on the barrier layer; and

a light emitting element positioned above the thin film transistor, wherein the light emitting element overlaps the thin film transistor along a direction orthogonal to an upper surface of the substrate,

wherein the barrier layer comprises an oxide of Al, Ag, Cu, Mo, Cr, or Ta, and wherein a density of the oxide increases in a direction toward the light emitting element.

18. The display device of claim 17 , wherein the light emitting element is an organic light emitting element.

19. The display device of claim 18 , further comprising a wiring electrically connected to a power supply portion and electrically connected to the thin film transistor and the light emitting element,

wherein the power supply portion is configured to provide a substantially constant voltage to the thin film transistor and the light emitting element, and

wherein the wiring is electrically connected to the barrier layer.

20. The display device of claim 19 , the wiring comprises at least one of a common power line, a high potential line, or an initialization line.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2018
From: BAE, INJUN; LEE, JUNHEE
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 045780/0350 →
Priority Claims (1)
KR 10-2017-0124097 · Sep 26, 2017 · national
Continuity (1)
Related Publication 20190097170A1 · Mar 28, 2019
Cited By (1)
US 12,457,863