IP Library › Granted Patent US 10,434,748
Granted Patent B2
US 10,434,748 · App. 15/977,773 · Granted Oct 8, 2019

Conductive film

Inventors: Koju Ito (Minamiashigara, JP); Souichi Kohashi (Minamiashigara, JP); Hiroshi Yabu (Sendai, JP); Kuniaki Nagamine (Sendai, JP); Matsuhiko Nishizawa (Sendai, JP)
Assignee: FUJIFILM Corporation
B32B7/02B32B3/12C08J9/26C08J9/28C08J9/36C08J9/365H01B5/14H05K9/00C08J2201/0502C08J2309/00C08J2383/04C08J2400/26C08J2433/26Y10T428/24967
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Quick Facts
Patent No.
US 10,434,748
App. No.
15/977,773
Granted
Oct 8, 2019
Kind
B2
Abstract

There is provided a conductive film having conductivity in a surface direction, being deformable, having excellent durability, and transmitting visible light. A conductive film includes a film substrate and a conductive material layer. The conductive material layer is provided on a first substrate surface of the film substrate. A plurality of through holes penetrating the film substrate and the conductive material layer in a thickness direction are formed in the conductive film. The conductive material layer has a plurality of conductive portions, and the conductive portions are present between adjacent layer opening portions. The number of the conductive portion is 400 per 1 mm 2 , and an opening ratio of the conductive material layer is at least 40%.

Claims (15)

1. A conductive film comprising:

a film substrate; and

a conductive material layer provided on a film substrate surface on one side of the film substrate,

wherein a plurality of through holes penetrating the film substrate and the conductive material layer in a thickness direction are formed,

wherein the conductive material layer has conductive portions between adjacent opening portions, the number of conductive portions is at least 400 per 1 mm 2 , and an opening ratio of the conductive material layer is at least 40%, and

wherein the film substrate includes a hydrophobic polymer, and the hydrophobic polymer includes any one of polybutadiene, polyisoprene, a polydimethylsiloxane derivative, or polyisobutylene.

2. The conductive film according to claim 1 , wherein a thickness of the film substrate is in a range of 0.2 μm to 20 μm.

3. The conductive film according to claim 1 , wherein the plurality of through holes are regularly arranged along the film substrate surface on one side.

4. The conductive film according to claim 3 , wherein the film substrate has a honeycomb-like structure in a case of being seen in a vertical direction of the film substrate surface on one side.

5. The conductive film according to claim 4 , wherein a thickness of a partition between the adjacent through holes gradually decreases toward a center of the film substrate in a thickness direction.

6. The conductive film according to claim 5 , wherein the partition has a partition wall opening portion on the center of the film substrate in the thickness direction.

7. The conductive film according to claim 1 , wherein the conductive material layer is formed of gold, and a thickness of the conductive material layer is in a range of 10 nm to 50 nm.

8. The conductive film according to claim 1 , wherein the conductive material layer is a member formed by a sputtering method.

9. The conductive film according to claim 1 , further comprising:

a gel layer or an elastomer layer on a film substrate surface on the other side of the film substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 14, 2018
From: ITO, KOJU; KOHASHI, SOUICHI; YABU, HIROSHI; NAGAMINE, KUNIAKI; NISHIZAWA, MATSUHIKO
To: FUJIFILM CORPORATION
Reel/Frame 045796/0119 →
Priority Claims (1)
JP 2015-222972 · Nov 13, 2015 · national
Continuity (2)
Continuation PCTJP2016083170 · Nov 9, 2016
Related Publication 20180257336A1 · Sep 13, 2018