Method for electrically connecting an electronic module and electronic assembly

1. An electronic assembly, comprising:

an electronic module comprising an electric terminal, the electric terminal including a press-fit section that comprises at least one of the following alloys: CuFeP; CuZr; CuCrZr; CuMg; CuCrTiSi; CuCrAgFeTiSi; and CuNiSiMg;

an electric part comprising a contact hole; and

a press-fit connection between the press-fit section and the electric part in which the press-fit section is plastically deformed and both mechanically and electrically contacts the electric part.

2. The electronic assembly of claim 1 , wherein the contact hole has a minimum diameter of at least 0.9 mm and of less than or equal to 1.1 mm.

3. The electronic assembly of claim 1 , wherein the electric terminal or at least the press-fit section comprises:

a core region consisting of or comprising one of the following alloys: CuFeP; CuZr; CuCrZr; CuMg; CuCrTiSi; CuCrAgFeTiSi; and CuNiSiMg; and

at least in the press-fit section, a surface coating applied to the core region.

4. The electronic assembly of claim 3 , wherein the surface coating comprises at least one of:

a first coating layer comprising nickel; and

a second coating layer comprising tin.

5. The electronic assembly of claim 1 , wherein:

the electronic module comprises a substrate with a dielectric layer and a substrate metallization layer attached to the dielectric layer; and

the electric terminal comprises a module connection section which is

inserted in an electrically conductive sleeve mounted on and electrically connected to the substrate metallization layer; or

electrically and mechanically connected to the substrate metallization layer by a joining layer that adjoins both the module connection section and the substrate metallization layer; or

directly welded to the substrate metallization layer.

6. The electronic assembly of claim 1 , wherein the electric part is or comprises a circuit board or a metal plate.

7. The electronic assembly of claim 1 , wherein the electric terminal comprises a straight shaft having at least one of:

a tensile strength in a range from 520 MPa to 720 MPa;

an ultimate strain elongation at break in a range from 2% to 8%.

8. The electronic assembly of claim 1 ,

wherein CuFeP means Cu a Fe b P c R d with:

a≥96.82 weight %;

b=2.1 to 2.6 weight %;

c=0.015 to 0.15 weight %;

d=0 to 0.43 weight %;

a+b+c+d=100 weight %; and

R designates one or more additional alloying constituents,

wherein CuZr means Cu a Zr b R c with:

a≥99.7 weight %;

b=0.1 to 0.2 weight %;

c=0 to 0.1 weight %;

a+b+c=100 weight %; and

R designates one or more additional alloying constituents,

wherein CuCrZr means Cu a Cr b Zr c R d with:

a≥98.32 weight %;

b=0.5 to 1.2 weight %;

c=0.03 to 0.3 weight %;

d=0 to 0.18 weight %;

a+b+c+d=100 weight %; and

R designates one or more additional alloying constituents,

wherein CuMg means Cu a Mg b R c with:

a≥98.6 weight %;

b=0.08 to 0.8 weight %;

c=0 to 0.6 weight %;

a+b+c=100 weight %; and

R designates one or more additional alloying constituents,

wherein CuCrTiSi means Cu a Cr b Ti c Si d R e with:

a≥99.0 weight %;

b=0.15 to 0.4 weight %;

c=0.1 to 0.4 weight %;

d=0.02 to 0.07 weight %;

e=0 to 0.82 weight %;

a+b+c+d+e=100 weight %; and

R designates one or more additional alloying constituents,

wherein Cu a Cr b Ag c Fe d Ti e Si f R g with:

a≥98.73 weight %;

b=0.2 to 0.7 weight %;

c=0.01 to 0.3 weight %;

d=0.02 to 0.2 weight %;

e=0.01 to 0.15 weight %;

f=0.01 to 0.1 weight %;

g=0 to 0.2 weight %;

a+b+c+d+e+f+g=100 weight %; and

R designates one or more additional alloying constituents,

wherein CuNiSiMg means Cu a Ni b Si c Mg d R e with:

a≥93.25 weight %;

b=2.2 to 4.2 weight %;

c=0.25 to 1.2 weight %;

d=0.05 to 0.3 weight %;

e=0 to 3.75 weight %;

a+b+c+d+e=100 weight %; and

R designates one or more additional alloying constituents.

9. The electronic assembly of claim 1 , wherein the electronic module further comprises a substrate having a substrate metallization layer, wherein the electric terminal further comprises a module connection section electrically connected to the substrate metallization layer of the substrate, and wherein the module connection section and the press-fit section of the electric terminal comprise the same material.

10. The electronic assembly of claim 9 , wherein the electronic module further comprises a housing, wherein the module connection section of the electric terminal is disposed inside the module housing, and wherein the press-fit section of the electric terminal is routed through a passage opening of the module housing so that the press-fit section is disposed outside the module housing.

11. A method, comprising:

providing an electronic module comprising an electric terminal, the electric terminal including a press-fit section that comprises one of the following alloys: CuFeP; CuZr; CuCrZr; CuMg; CuCrTiSi; CuCrAgFeTiSi; and CuNiSiMg;

providing an electric part comprising a contact hole; and

pressing the press-fit section into the contact hole so that the press-fit section is plastically deformed, and both mechanically and electrically contacts the electric part.

12. The method of claim 11 , wherein:

the contact hole has, prior to pressing the press-fit section in a pressing direction into the contact hole, perpendicularly to the pressing direction, a minimum diameter;

the press-fit section has, prior to pressing the press-fit section into the contact hole, perpendicularly to the pressing direction, a maximum circumcircle diameter; and

a ratio between the maximum circumcircle diameter and the minimum diameter is selected to be greater than 1 and less than or equal to 1.3.

13. The method of claim 11 , wherein the contact hole has, prior to pressing the press-fit section into the contact hole, perpendicularly to the pressing direction, a minimum diameter of at least 0.9 mm and of less than or equal to 1.1 mm.

14. The method of claim 11 , wherein the electric terminal or at least the press-fit section comprises:

a core region comprising one of the following alloys: CuFeP; CuZr; CuCrZr; CuMg; CuCrTiSi; CuCrAgFeTiSi; CuNiSiMg; and

at least in the press-fit section, a surface coating applied to the core region.

15. The method of claim 14 , wherein the press-fit section comprises a first leg and a second leg enclosing an angle of at least 85° and of less than or equal to 95°.

16. The method of claim 11 , wherein:

the electronic module comprises a substrate with a dielectric layer and a substrate metallization layer attached to the dielectric layer; and

the electric terminal comprises a module connection section at which it is electrically connected to the substrate metallization layer by one of:

inserting the module connection section in an electrically conductive sleeve mounted on and electrically connected to the substrate metallization layer;

electrically and mechanically connecting the module connection section to the substrate metallization layer using a joining layer that adjoins both the module connection section and the substrate metallization layer; or

welding the module connection section to the substrate metallization layer.

17. The method of claim 11 , wherein the electric part is or comprises a circuit board or a metal plate.

18. The method of claim 11 , wherein the electric terminal comprises a straight shaft having at least one of:

a tensile strength in a range from 520 MPa to 720 MPa;

an ultimate strain elongation at break in a range from 2% to 8%.

19. The method of claim 11 ,

wherein CuFeP means Cu a Fe b P c R d with:

a≥96.82 weight %;

b=2.1 to 2.6 weight %;

c=0.015 to 0.15 weight %;

d=0 to 0.43 weight %;

a+b+c+d=100 weight %; and

R designates one or more additional alloying constituents,

wherein CuZr means Cu a Zr b R c with:

a≥99.7 weight %;

b=0.1 to 0.2 weight %;

c=0 to 0.1 weight %;

a+b+c=100 weight %; and

R designates one or more additional alloying constituents,

wherein CuCrZr means Cu a Cr b Zr c R d with:

a≥98.32 weight %;

b=0.5 to 1.2 weight %;

c=0.03 to 0.3 weight %;

d=0 to 0.18 weight %;

a+b+c+d=100 weight %; and

R designates one or more additional alloying constituents,

wherein CuMg means Cu a Mg b R c with:

a≥98.6 weight %;

b=0.08 to 0.8 weight %;

c=0 to 0.6 weight %;

a+b+c=100 weight %; and

R designates one or more additional alloying constituents,

wherein CuCrTiSi means Cu a Cr b Ti c Si d R e with:

a≥99.0 weight %;

b=0.15 to 0.4 weight %;

c=0.1 to 0.4 weight %;

d=0.02 to 0.07 weight %;

e=0 to 0.82 weight %;

a+b+c+d+e=100 weight %; and

R designates one or more additional alloying constituents,

wherein Cu a Cr b Ag c Fe d Ti e Si f R g with:

a≥98.73 weight %;

b=0.2 to 0.7 weight %;

c=0.01 to 0.3 weight %;

d=0.02 to 0.2 weight %;

e=0.01 to 0.15 weight %;

f=0.01 to 0.1 weight %;

g=0 to 0.2 weight %;

a+b+c+d+e+f+g=100 weight %; and

R designates one or more additional alloying constituents,

wherein CuNiSiMg means Cu a Ni b Si c Mg d R e with:

a≥93.25 weight %;

b=2.2 to 4.2 weight %;

c=0.25 to 1.2 weight %;

d=0.05 to 0.3 weight %;

e=0 to 3.75 weight %;

a+b+c+d+e=100 weight %; and

R designates one or more additional alloying constituents.

20. The method of claim 11 , further comprising:

electrically connecting a module connection section of the electric terminal to a substrate metallization layer of a substrate of the electronic module,

wherein the module connection section and the press-fit section of the electric terminal comprise the same material.

21. The method of claim 20 , wherein the module connection section of the electric terminal is disposed inside a module housing of the electronic module, and wherein the press-fit section of the electric terminal is routed through a passage opening of the module housing so that the press-fit section is disposed outside the module housing.