Assembled wire, method of producing the same, and electrical equipment using the same
An assembled wire, having: an assembled conductor composed of a plurality of conductor strands each having a rectangular cross-section, stacked and arranged each other across an interlayer insulating layer; an insulating outer layer that coats the assembled conductor including the interlayer insulating layer; and an adhesion layer composed of a thermoplastic resin having a thickness of 3 μm or more and 10 μm or less between the assembled conductor and the insulating outer layer.
1. A high-frequency assembled wire, comprising:
an assembled conductor composed of a plurality of conductor strands each having a rectangular cross-section, stacked and arranged each other across an interlayer insulating layer;
an insulating outer layer that coats the assembled conductor including the interlayer insulating layer; and
an adhesion layer comprising a thermoplastic resin having a thickness of 3 μm or more and 8 μm or less between the assembled conductor and the insulating outer layer,
wherein
the adhesion layer is composed of a resin comprising polyetherimide, polyethersulfone, or polyphenyl sulfone, and
the interlayer insulating layer is composed of a resin comprising polyethylene terephthalate, polyethylene naphthalate, polyamide 6T, or polyamide 9T, and
the insulating outer layer is composed of a resin comprising a thermoplastic resin having a melting point of 270° C. or more selected from polyphenylenesulfide, polyetheretherketone, modified polyetheretherketone, or thermoplastic polyimide.
2. The high-frequency assembled wire according to claim 1 , wherein the resin of the adhesion layer comprises a thermoplastic resin having a tensile modulus at 250° C. of 10 MPa or more and 1,000 MPa or less.
3. The high-frequency assembled wire according to claim 1 , wherein the adhesion layer is comprised of a single layer or a plurality of layers.
4. The high-frequency assembled wire according to claim 1 , wherein the interlayer insulating layer is composed of a thermoplastic resin having a melting point of 250° C. or more and 350° C. or less.
5. The high-frequency assembled wire according to claim 1 , wherein the number of stacked layers of conductor strands is two layers or more and six layers or less.
6. A method of producing a high-frequency assembled wire according to claim 1 , comprising:
a step of forming an assembled conductor, by stacking, in a thickness direction, each of conductor strands having a rectangular cross-section and having an interlayer insulating layer of a thermoplastic resin of an amorphous resin having no melting point or a thermoplastic resin of a crystalline resin having an amide bond, formed on one side thereof by performing bake-finishing;
a step of coating an adhesion layer of a thermoplastic resin on the outer periphery of the assembled conductor; and
a step of coating an insulating outer layer on the outer periphery of the adhesion layer,
wherein, before coating the insulating outer layer, the adhesion layer, which has a thickness of 3 μm or more and 10 μm or less, is formed on the outer periphery of the assembled conductor.
7. An electrical equipment, having wirings,
wherein at least a part of the wirings comprises high-frequency assembled wire according to claim 1 .