Semiconductor device
A semiconductor device has transistors formed on a substrate and including first and second impurity regions of a first conductivity type, a guard ring of a second conductivity type formed on the substrate and surrounding the transistors in a plan view, a wiring formed on and electrically connected to the guard ring, and a ground wiring faulted on the wiring and electrically connected to the wiring and the second impurity region. In a plan view, the transistor includes a first part having a distance that is a first distance from the guard ring, and a second part having a distance that is a second distance shorter than the first distance from the guard ring. In a plan view, the first part is located at a position separated from the ground wiring, and the second part is located at a position overlapping the ground wiring.
1. A semiconductor device comprising:
a substrate;
a first transistor which includes a first impurity region of a first conductivity type formed in the substrate, and which includes a second impurity region of the first conductivity type formed in the substrate;
a first guard ring of a second conductivity type different from the first conductivity type, formed in the substrate, the first guard ring surrounding the first transistor in a plan view;
a first wiring formed on the first guard ring and electrically connected to the first guard ring; and
a ground wiring formed on the first wiring, the ground wiring being electrically connected to the first wiring and the second impurity region,
wherein
the first transistor includes a first part and a second part which are respectively arranged in a first direction in a plan view,
the first part of the first transistor is separated with a first distance from the first guard ring in a second direction which is perpendicular to the first direction in a plan view,
the second part of the first transistor is separated with a second distance from the first guard ring in the second direction in a plan view,
the second distance is shorter than the first distance,
the first part is separated from the ground wiring in a plan view, and
the second part is overlapped with the ground wiring in a plan view.
2. The semiconductor device as claimed in claim 1 , further comprising:
a power supply wiring,
wherein the first impurity region is electrically connected to the power supply wiring.
3. The semiconductor device as claimed in claim 1 , further comprising:
a plurality of first vias connecting the first guard ring and the first wiring,
wherein a density of the plurality of first vias which are overlapped with the ground wiring in a plan view, along a direction in which the first guard ring extends, is higher than a density of the plurality of first vias which are separated from and not overlapped with the ground wiring in a plan view, along the direction in which the first guard ring extends.
4. The semiconductor device as claimed in claim 1 , wherein
the first transistor includes a third part,
the third part is separated with a third distance from the first guard ring in a plan view,
the third distance is shorter than the first distance, and
the second part is positioned between the first part and the third part in a plan view.
5. The semiconductor device as claimed in claim 1 , wherein distance between the first transistor and the first guard ring increases in steps between the first part and the second part in a plan view.
6. The semiconductor device as claimed in claim 1 , wherein the first transistor is a Fin FET (Field-Effect-Transistor) or a nanowire FET.
7. A semiconductor device comprising:
a substrate;
a first transistor, which includes a first impurity region of a first conductivity type formed in the substrate, and which includes a second impurity region of the first conductivity type formed in the substrate;
a first guard ring of a second conductivity type different from the first conductivity type, formed in the substrate, the first guard ring surrounding the first transistor in a plan view;
a first wiring formed on the first guard ring and electrically connected to the first guard ring; and
a power supply wiring formed on the first wiring, the power supply wiring being electrically connected to the first wiring and the first impurity region,
wherein
the first transistor includes a first part and a second part which are respectively arranged in a first direction in a plan view,
the first part of the first transistor is separated with a first distance from the first guard ring in a second direction which is perpendicular to the first direction in a plan view,
the second part of the first transistor is separated with a second distance from the first guard ring in the second direction in a plan view,
the second distance is shorter than the first distance,
the first part is separated from the power supply wiring in a plan view, and
the second part is overlapped with the power supply wiring in a plan view.
8. The semiconductor device as claimed in claim 7 , further comprising:
a plurality of first vias connecting the first guard ring and the first wiring,
wherein a density of the plurality of first vias which are overlapped with the power supply wiring in a plan view, along a direction in which the first guard ring extends, is higher than a density of the plurality of first vias which are separated from and not overlapped with the power supply wiring in a plan view, along the direction in which the first guard ring extends.
9. The semiconductor device as claimed in claim 7 , wherein
the first transistor includes a third part,
the third part is separated with a third distance from the first guard ring in a plan view, and
the second part is positioned between the first part and the third part.
10. The semiconductor device as claimed in claim 7 , wherein distance between the first transistor and the first guard ring increases in steps between the first part and the second part in a plan view.
11. The semiconductor device as claimed in claim 7 , wherein the first transistor is a Fin FET (Field-Effect-Transistor) or a nanowire FET.
12. A semiconductor device comprising:
a substrate;
a first transistor which includes a first impurity region of a first conductivity type formed in the substrate, and which includes a second impurity region of the first conductivity type formed in the substrate;
a first guard ring of a second conductivity type different from the first conductivity type, formed in the substrate, the first guard ring surrounding the first transistor in a plan view;
a first wiring formed on the first guard ring and electrically connected to the first guard ring;
a ground wiring formed on the first wiring, the ground wiring being electrically connected to the first wiring and the second impurity region;
a second transistor, which includes a third impurity region of the second conductivity type formed in the substrate, and which includes a fourth impurity region of the second conductivity type formed in the substrate;
a second guard ring of the first conductivity type formed in the substrate, the second guard ring surrounding the second transistor in a plan view;
a second wiring formed on the second guard ring and electrically connected to the second guard ring; and
a power supply wiring formed on the second wiring, the power supply wiring being electrically connected to the second wiring and the third impurity region,
wherein
the first transistor includes a first part and a second part,
the first part of the first transistor is separated with a first distance from the first guard ring in a plan view,
the second part of the first transistor is separated with a second distance from the first guard ring in a plan view,
the second distance is shorter than the first distance,
the first part is separated from the ground wiring in a plan view,
the second part is overlapped with the ground wiring in a plan view,
the second transistor includes a third part and a fourth part,
the third part of the second transistor is separated with a third distance from the second guard ring in a plan view,
the fourth part of the second transistor is separated with a fourth distance from the second guard ring in a plan view,
the fourth distance is shorter than the third distance,
the third part is separated from the power supply wiring in a plan view, and
the fourth part is overlapped with the power supply wiring in a plan view.
13. The semiconductor device as claimed in claim 12 , further comprising:
a plurality of first vias connecting the first guard ring and the first wiring,
wherein a density of the plurality of first vias which are overlapped with the ground wiring in a plan view, along a direction in which the first guard ring extends, is higher than a density of the plurality of first vias which are separated from and not overlapped with the ground wiring in a plan view, along the direction in which the first guard ring extends.
14. The semiconductor device as claimed in claim 12 , further comprising:
a plurality of second vias connecting the second guard ring and the second wiring,
wherein a density of the plurality of second vias which are overlapped with the power supply wiring in a plan view, along a direction in which the second guard ring extends, is higher than a density of the plurality of second vias which are separated from and not overlapped with the power supply wiring in a plan view, along the direction in which the second guard ring extends.
15. The semiconductor device as claimed in claim 12 , further comprising:
a plurality of first vias connecting the first guard ring and the first wiring; and
a plurality of second vias connecting the second guard ring and the second wiring,
wherein a density of the plurality of first vias which are overlapped with the ground wiring in a plan view, along a direction in which the first guard ring extends, is higher than a density of the plurality of first vias which are separated from and not overlapped with the ground wiring in a plan view, along the direction in which the first guard ring extends, and
wherein a density of the plurality of second vias which are overlapped with the power supply wiring in a plan view, along a direction in which the second guard ring extends, is higher than a density of the plurality of second vias which are separated from and not overlapped with the power supply wiring in a plan view, along the direction in which the second guard ring extends.
16. The semiconductor device as claimed in claim 12 , further comprising:
an input and output terminal connected to the first impurity region and the fourth impurity region.
17. The semiconductor device as claimed in claim 12 , wherein
the first transistor includes a fifth part,
the fifth part is separated with a third distance from the first guard ring in a plan view,
the third distance is shorter than the first distance, and
the second part is positioned between the first part and the fifth part in a plan view.
18. The semiconductor device as claimed in claim 12 , wherein
distance between the first transistor and the first guard ring increases in steps between the first part and the second part in a plan view, and
distance between the second transistor and the second guard ring increases in steps between the third part and the fourth part in a plan view.
19. The semiconductor device as claimed in claim 12 , wherein
the second transistor includes a sixth part,
the sixth part is separated with a sixth distance from the second guard ring in a plan view, and
the fourth part is positioned between the third part and the sixth part.
20. The semiconductor device as claimed in claim 12 , wherein at least one of the first transistor and the second transistor is a Fin FET (Field-Effect-Transistor) or a nanowire FET.