Support substrate for transfer of semiconductor devices

1. An apparatus for transferring a semiconductor die from a wafer tape to a product substrate, the apparatus comprising:

a wafer frame configured to secure the wafer tape;

a support frame configured to secure a support substrate having a plurality of holes, the support substrate configured to secure the product substrate; and

an actuator configured to transfer the semiconductor die to a transfer location on the product substrate.

2. The apparatus according to claim 1 , further comprising a controller communicatively coupled to the wafer frame and the support frame, the controller including memory having instructions, which when executed, cause the controller to perform operations comprising:

orienting the wafer frame such that the semiconductor die is aligned with the transfer location,

orienting the support frame such that the product substrate is aligned with the transfer location, and

causing the actuator to transfer the semiconductor die at the transfer location.

3. The apparatus according to claim 1 , further comprising:

a first sensor configured to sense a location of the semiconductor die with respect to the transfer location; and

a second sensor configured to sense a location of the product substrate with respect to the transfer location.

4. The apparatus according to claim 1 , wherein at least one hole of the plurality of holes aligns with the transfer location.

5. The apparatus according to claim 1 , wherein the plurality of holes is a first plurality of holes,

wherein the support substrate includes a second plurality of holes,

wherein the product substrate includes a plurality of protrusions, and

wherein the product substrate is securable to the support substrate via the plurality of protrusions aligning with respective holes of the second plurality of holes.

6. The apparatus according to claim 1 , wherein the support substrate further includes a plurality of protrusions,

wherein the product substrate includes a plurality of holes, and

wherein the product substrate is securable to the support substrate via the plurality of holes in the product substrate aligning with respective protrusions of the plurality of protrusions on the support substrate.

7. The apparatus according to claim 1 , wherein the product substrate includes a plurality of protrusions, and

wherein one or more protrusions of the plurality of protrusions on the product substrate are configured to align with one or more holes, respectively, of the plurality of holes in the support substrate.

8. The apparatus according to claim 1 , wherein the actuator is configured to transfer, simultaneously, a plurality of semiconductor die to respective transfer locations on the product substrate.

9. An apparatus to affix semiconductor die to respective transfer locations on a product substrate, the apparatus comprising:

a support substrate frame to secure a support substrate, the support substrate having a plurality of holes corresponding to the respective transfer locations of the semiconductor die on the product substrate, the product substrate being securable to the support substrate;

a die substrate frame to secure a die substrate including the semiconductor die thereon; and

a die separation device to separate the semiconductor die from the die substrate and transfer the semiconductor die to the respective transfer locations of the semiconductor die on the product substrate.

10. The apparatus according to claim 9 , wherein the die separation device affixes the semiconductor die to a circuit trace on the product substrate.

11. The apparatus according to claim 9 , wherein the die separation device is configured to transfer at least two semiconductor die to the product substrate during a single actuation of the die separation device.

12. The apparatus according to claim 9 , wherein the die substrate frame and the support substrate frame are movable independently of each other and simultaneously.

13. The apparatus according to claim 9 , wherein one or more material characteristics of the support substrate is based at least in part on one or more structural characteristics of the semiconductor die.

14. The apparatus according to claim 9 , wherein the product substrate includes at least one protrusion, and

wherein the at least one protrusion aligns with at least one hole of the plurality of holes in the support substrate when secured thereto.

15. The apparatus according to claim 9 , wherein the product substrate is removably attached to the support substrate.