SEMICONDUCTOR PACKAGE WITH CONTINUOUS LEAD FRAME
A semiconductor package includes a semiconductor die, a tab, a first lead, and a continuous lead frame. The semiconductor die includes a first terminal, a second terminal, and a third terminal. The tab is electronically coupled to the first terminal. The semiconductor die is mounted on the tab. The first lead is electronically coupled to the second terminal. The continuous lead frame is electronically coupled to the third terminal and includes a second lead and a third lead.
1 . A semiconductor package comprising:
a semiconductor die comprising a first terminal, a second terminal, and a third terminal;
a tab electronically coupled to the first terminal, wherein the semiconductor die is mounted on the tab;
a first lead electronically coupled to the second terminal; and
a continuous lead frame electronically coupled to the third terminal, the continuous lead frame comprising a second lead and a third lead.
2 . The semiconductor package of claim 1 ,
wherein the first terminal comprises a drain of the semiconductor die,
wherein the second terminal comprises a gate of the semiconductor die, and
wherein the third terminal comprises a source of the semiconductor die.
3 . The semiconductor package of claim 1 ,
wherein the first terminal comprises a source of the semiconductor die,
wherein the second terminal comprises a gate of the semiconductor die, and
wherein the third terminal comprises a drain of the semiconductor die.
4 . The semiconductor package of claim 1 , further comprising:
one or more first wire bonds electronically coupling the second terminal to the first lead; and
one or more second wire bonds electronically coupling the third terminal to the continuous lead frame.
5 . The semiconductor package of claim 4 , wherein the one or more second wire bonds comprises a plurality of second wire bonds, the plurality of second wire bonds having a greater number of wire bonds than the one or more first wire bonds.
6 . The semiconductor package of claim 4 , wherein the one or more second wire bonds comprises 5 or more wire bonds.
7 . The semiconductor package of claim 4 , wherein each wire bond of the one or more second wire bonds comprises a diameter greater than a diameter of the one or more first wire bonds.
8 . The semiconductor package of claim 1 , wherein the tab includes a hole for mounting the semiconductor package to a heatsink.
9 . The semiconductor package of claim 1 , wherein the semiconductor package is a TO-220 package.
10 . The semiconductor package of claim 1 , further comprising:
a mold compound formed over at least a portion of the tab, the semiconductor die, at least a portion of the first lead, and at least a portion of the continuous lead frame.
11 . A method comprising:
mounting a semiconductor die to a tab, the semiconductor die comprising a first terminal, a second terminal, and a third terminal, wherein mounting the semiconductor die to the tab electronically couples the first terminal to the tab;
electronically coupling the second terminal to a first lead; and
electronically coupling the third terminal to a continuous lead frame, the continuous lead frame comprising a second lead and a third lead.
12 . The method of claim 11 ,
wherein the first terminal comprises a drain of the semiconductor die,
wherein the second terminal comprises a gate of the semiconductor die, and
wherein the third terminal comprises a source of the semiconductor die.
13 . The method of claim 11 ,
wherein the first terminal comprises a source of the semiconductor die,
wherein the second terminal comprises a gate of the semiconductor die, and
wherein the third terminal comprises a drain of the semiconductor die.
14 . The method of claim 11 ,
wherein electronically coupling the second terminal comprises electronically coupling one or more first wire bonds to the second terminal and to the first lead, and
wherein electronically coupling the third terminal comprises electronically coupling one or more second wire bonds to the third terminal and to the continuous lead frame.
15 . The method of claim 14 , wherein the one or more second wire bonds comprises a plurality of second wire bonds, the plurality of second wire bonds having a greater number of wire bonds than the one or more first wire bonds.
16 . The method of claim 14 , wherein each wire bond of the one or more second wire bonds comprises a diameter greater than a diameter of the one or more first wire bonds.
17 . The method of claim 11 , further comprising:
forming a mold compound over at least a portion of the tab, the semiconductor die, at least a portion of the first lead, and at least a portion of the continuous lead frame.
18 . A semiconductor package comprising:
a semiconductor die comprising a first terminal, a second terminal, and a third terminal;
a tab electronically coupled to the first terminal, wherein the semiconductor die is mounted on the tab;
a first lead;
one or more first wire bonds electronically coupling the second terminal to the first lead;
a continuous lead frame comprising a lead connection region, a second lead, and a third lead; and
one or more second wire bonds electronically coupling the third terminal to the lead connection region of the continuous lead frame.
19 . The semiconductor package of claim 18 ,
wherein the first terminal comprises a drain of the semiconductor die,
wherein the second terminal comprises a gate of the semiconductor die, and
wherein the third terminal comprises a source of the semiconductor die.
20 . The semiconductor package of claim 18 ,
wherein the first terminal comprises a source of the semiconductor die,
wherein the second terminal comprises a gate of the semiconductor die, and
wherein the third terminal comprises a drain of the semiconductor die.