Porous tin oxide films
Initial film layers prepared from tin(II) chloride spontaneously generate open cavities when the initial film layers are thermally cured to about 400° C. using a temperature ramp of 1° C./minute to 10° C./minute while exposed to air. The openings of the bowl-shaped cavities have characteristic dimensions whose lengths are in a range of 30 nm to 300 nm in the plane of the top surfaces of the cured film layers. The cured film layers comprise tin oxide and have utility in gas sensors, electrodes, photocells, and solar cells.
1. A layered structure comprising:
a cured film layer disposed on a substrate, the cured film layer comprising i) a tin oxide selected from the group consisting of tin(II) oxide (SnO), tin(IV) oxide (SnO 2 ), and combinations thereof and ii) a top surface comprising independent open cavities,
wherein
the open cavities have respective characteristic dimensions whose lengths are in the range of 30 nm to 300 nm at the top surface of the cured film layer, the characteristic dimensions having a mean length, and
80% to 100% of the characteristic dimensions of the open cavities are within 10% of the mean length.
2. The layered structure of claim 1 , wherein the tin oxide of the film layer is substantially tin(II) oxide.
3. The layered structure of claim 1 , wherein the tin oxide of the film layer is substantially tin(IV) oxide.
4. The layered structure of claim 1 , wherein the top surface of the substrate comprises a pattern, the pattern comprising a zero-valent electrically conductive metal, and the cured film layer has contact with the pattern.
5. The layered structure of claim 4 , wherein the pattern comprises interdigitated electrodes.
6. The layered structure of claim 4 , wherein the layered structure is suitable as a component of a device selected from the group consisting of gas sensors, electrodes, photocells, and solar cells.
7. The layered structure of claim 1 , wherein the cured film layer has a thickness between 1 nm and 600 nm.
8. The layered structure of claim 1 , wherein the openings constitute at least 10% of the volume of the cured film layer.
9. The layered structure of claim 1 , wherein the cured film layer comprises an auxiliary ion of a metal selected from the group consisting of Pd, Zn, Ga, In, Pt, Ce, W, Cu, and combinations thereof.
10. The layered structure of claim 9 , wherein the auxiliary ion is indium(III).
11. The layered structure of claim 9 , wherein the cured film layer comprises a tin:indium molar ratio between 50:50 and 100:0 based on total moles of tin and indium present in the cured film layer.
12. A device comprising the layered structure of claim 1 .
13. The device of claim 12 , wherein the device is selected from the group consisting of gas sensors, electrodes, photocells, and solar cells.
14. A structure, comprising:
a film of an oxide given by the formula Sn x Z 1-x O y , wherein Z is a metal other than Sn, x is between 0.75 and 1, and y is at least 1.75; and
a substrate that underlies and is in contact with the film;
wherein:
the film includes interconnected pores that extend from the top surface of the film, the pores having respective characteristic dimensions at the top surface between 30 nm and 300 nm, and
at least 80% of the characteristic dimensions fall within 10% of the mean of the characteristic dimensions.
15. The structure of claim 14 , wherein the top surface of the substrate comprises a patterned conductive metal layer disposed on an insulating layer.
16. The structure of claim 14 , wherein the film is substantially planar.
17. The structure of claim 14 , wherein said pores constitute at least 10% of the film volume.
18. The structure of claim 14 , wherein the thickness of the film is between 1 nm and 600 nm.
19. The structure of claim 14 , wherein Z is selected from the group consisting of Pd, Zn, Ga, In, Pt, Ce, W, and Cu.
20. The structure of claim 19 , wherein Z is In.