Semiconductor capacitor and power supply module
A semiconductor capacitor includes a semiconductor substrate having a first and second principal surfaces. A first set of one or more trenches is formed on the first principal surface and a second set of one or more trenches formed on the second principal surface. A first dielectric film is located on the first principal surface and least inner walls of the first set of one or more trenches. A second dielectric film is located on the second principal surface and least inner walls of the second set of one or more trenches. A first conductor film located on the first dielectric film. A second conductor film located on the second dielectric film. The semiconductor substrate is formed of Si, SiC, GaN, or the like. The dielectric film has a two-layer structure of SiO 2 and Si 3 N 4 .
1. A semiconductor capacitor comprising:
a semiconductor substrate having a first and second principal surfaces;
a first set of one or more trenches formed on the first principal surface;
a second set of one or more trenches formed on the second principal surface;
a first dielectric film located on the first principal surface and least inner walls of the first set of one or more trenches, the first dielectric film covering the entire first principal surface and all inner walls of the first set of one or more trenches;
a second dielectric film located on the second principal surface and least inner walls of the second set of one or more trenches, the second dielectric film covering the entire second principal surface and all inner walls of the second set of one or more trenches;
a first conductor film located on the first dielectric film;
a second conductor film located on the second dielectric film; and
first and second external electrodes located on the first and second conductive films, respectively;
wherein the first and second conductor films and the first and second external electrodes do not extend to outer peripheral edges of the semiconductor capacitor.
2. The semiconductor capacitor according to claim 1 , wherein the semiconductor substrate is made of any one of Si, SiC and GaN.
3. The semiconductor capacitor according to claim 1 , wherein each of the dielectric films comprises a plurality of layers.
4. The semiconductor capacitor according to claim 1 , wherein each of the dielectric films comprises a first layer made of SiO 2 and the second layer made of Si 3 N 4 .
5. The semiconductor capacitor according to claim 1 , wherein the first and second principal surfaces oppose one another.
6. The semiconductor capacitor according to claim 5 , wherein the first and second principal surfaces are parallel to and spaced from one another.
7. The semiconductor capacitor according to claim 1 , further comprising respective insulating films located on the first and second dielectric films, respectively and at locations between the first and second external electrodes and the outer peripheral edges of the semiconductor capacitor, respectively.
8. A power supply module comprising:
a semiconductor switching element; and
a capacitor in accordance with claim 1 connected in parallel to the semiconductor switching element.
9. The power supply module according to claim 8 , wherein the semiconductor substrate is made of any one of Si, SiC and GaN.
10. The power supply module according to claim 8 , wherein each of the dielectric films comprises a plurality of layers.
11. The power supply module according to claim 8 , wherein each of the dielectric films comprises a first layer made of SiO 2 and the second layer made of Si 3 N 4 .
12. The power supply module according to claim 8 , wherein the first and second principal surfaces oppose one another.
13. The power supply module according to claim 12 , wherein the first and second principal surfaces are parallel to and spaced from one another.