IP Library › Granted Patent US 10,490,507
Granted Patent B1
US 10,490,507 · App. 15/994,351 · Granted Nov 26, 2019

Electronic components for soft, flexible circuitry layers and methods therefor

Inventors: Madison Thea Maxey (New York, NY); Ezgi Uçar (Istanbul, TR); Janett Martinez (Queens, NY)
Assignee: LOOMIA Technologies, Inc.
H01L23/5387H01L23/50H01L23/5386H01L33/62H01R12/77
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,490,507
App. No.
15/994,351
Granted
Nov 26, 2019
Kind
B1
Abstract

A flexible circuitry layer may comprise a conductive mesh including a circuitry trace; and an interfacing component, comprising: a flexible substrate; a terminal electrically connected to the circuitry trace; and a connector configured to be detachably connected to an external device.

Claims (27)

1. A flexible circuitry layer, comprising:

a conductive mesh including at least one high-pitch circuitry trace; and

an interfacing component, comprising:

a flexible substrate;

a terminal electrically connected to the circuitry trace;

circuitry for transitioning between the at least one high-pitch circuitry trace of the conductive mesh and at least one low-pitch element of the interfacing component; and

a connector configured to be detachably connected to an external device.

2. The flexible circuitry layer of claim 1 , wherein the connector is one of a USB connector, a magnetic pogo pin connector, a JST connector, and a headphone jack.

3. The flexible circuitry layer of claim 1 , wherein the interfacing component includes an integrated circuit.

4. The flexible circuitry layer of claim 1 , wherein the interfacing component includes a MOSFET.

5. The flexible circuitry layer of claim 1 , further comprising an insulative layer.

6. The flexible circuitry layer of claim 1 , wherein a urethane, or polymer overmold is formed over at least a portion of the interfacing component.

7. The flexible circuitry layer of claim 1 , further comprising an electrical component fixed to the circuitry layer.

8. The flexible circuitry layer of claim 7 , wherein the electrical component includes a printed LED.

9. A flexible circuitry layer, comprising:

a conductive mesh including at least one high-pitch circuitry trace; and

an interfacing component electronically coupled to the circuitry trace, comprising:

a flexible substrate;

a low-pitch integrated circuit configured to control operations of the circuitry trace;

circuitry for transitioning between the at least one high-pitch circuitry trace and the low-pitch integrated circuit; and

a connector configured to be detachably connected to an external device.

10. The flexible circuitry layer of claim 9 , wherein the connector is one of a USB connector, a magnetic pogo pin connector, a JST connector, and a headphone jack.

11. The flexible circuitry layer of claim 9 , wherein the interfacing component includes a MOSFET.

12. The flexible circuitry layer of claim 9 , further comprising an insulative layer.

13. The flexible circuitry layer of claim 9 , wherein a urethane or polymer overmold is formed over at least a portion of the interfacing component.

14. The flexible circuitry layer of claim 9 , further comprising an electrical component fixed to the circuitry layer.

15. The flexible circuitry layer of claim 14 , wherein the electrical component includes a printed LED.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 12, 2018
From: MAXEY, MADISON THEA; UÇAR, EZGI; MARTINEZ, JANETT
To: LOOMIA TECHNOLOGIES, INC.
Reel/Frame 046056/0222 →