Solution composition and method for single-bath post treatment of substrate
Disclosed is a solution composition which may be used for a single-bath electrochemical passivation and a method using the same. The solution composition includes a metal cation, a metal-oxide anion; and an organic ligand, and optionally includes a non-metallic oxide anion or a polymer. The solution composition may prevent undesired precipitation of metal oxides before performing passivation. In addition, the method of passivation using the solution composition in a single-bath use is also provided.
1. A solution composition for a single-bath passivation, consisting of:
a metal cation selected from the group consisting of Ce 3+ , Y 3+ , La 3+ , Pr 3+ , Sm 3+ and mixtures thereof;
a metal-oxide anion selected from the group consisting of VO 3− , MoO 4 2− , WO 4 2− and mixtures thereof;
an organic ligand;
an optional non-metallic oxide anion;
an optional polymer;
an optional pH adjustment agent; and one or more counterions for the foregoing ions.
2. The solution composition of claim 1 , wherein the organic ligand forms a complex with the metal cation.
3. The solution composition of claim 1 , wherein the organic ligand is acetic acid, lactic acid, citric acid, ocalic acid, salicylic acid, tartaric acid, ethylenediaminetetraacetic acid (EDTA), or mixtures thereof.
4. The solution composition of claim 1 , wherein the non-metallic oxide anion is PO 4 3− , SiO 3 − , B 2 O 4 2− or mixtures thereof.
5. The solution composition of claim 1 , the polymer is polyacrylic acid, polyol, polyethylene glycol, or mixtures thereof.
6. The solution composition of claim 1 , wherein pH of the solution composition is in a range of about pH 7.0 to about pH 11.0.