Flash memory components and methods
Flash memory technology is disclosed. In one example, a flash memory component can include a plurality of conductive layers vertically spaced apart from one another and separated by voids, each of the plurality of conductive layers forming a word line. The memory component can also include a vertically oriented conductive channel extending through the plurality of conductive layers. In addition, the flash memory component can include a plurality of memory cells coupling the plurality of conductive layers to the conductive channel. Each word line can be associated with one of the plurality of memory cells. Associated devices, systems, and methods are also disclosed.
1. A flash memory component, comprising:
a plurality of conductive layers vertically spaced apart from one another and separated by voids, each of the plurality of conductive layers forming a word line and having a height in a vertical direction;
a vertically oriented conductive channel extending through the plurality of conductive layers, wherein the voids provide a vacuum insulating medium between wordlines corresponding to the plurality of conductive layers;
a plurality of memory cells coupling the plurality of conductive layers to the conductive channel, wherein each word line is associated with one of the plurality of memory cells, each of the memory cells including a charge storage structure having a height in the vertical direction smaller than the height of a corresponding polysilicon conductive layer and protruding in a direction away from the conductive channel, and a blocking dielectric layer conformal to and adjacent to the charge storage structure, wherein charge storage structures of respective ones of the memory cells are distinct from one another, and blocking dielectric layers of respective ones of the memory cells are distinct from one another; and
a vertically oriented support column in a staircase region of the plurality of conductive layers, the vertically oriented support column extending through, and mechanically coupled with, at least two of the plurality of conductive layers, wherein the plurality of conductive layers comprises polysilicon, and wherein at least one of the plurality of conductive layers has a SiGe residue on a top surface, a bottom surface, or both.
2. The flash memory component of claim 1 , wherein the conductive layers are vertically spaced apart from one another by a distance of from about 5 nm to about 50 nm.
3. The flash memory component of claim 1 , wherein each of the conductive layers has a thickness of from about 10 nm to about 40 nm.
4. The flash memory component of claim 1 , wherein the support column forms at least a portion of a non-functional memory pillar that is electrically isolated from one or both of a source line and a drain line.
5. The flash memory component of claim 4 , further comprising a plurality of non-functional memory cells adjacent to the non-functional memory pillar and mechanically coupling the non-functional memory pillar to the at least two of the plurality of conductive layers.
6. The flash memory component of claim 1 , further comprising a vertically oriented wall extending through, and mechanically coupled with, the plurality of conductive layers.
7. The flash memory component of claim 6 , wherein the vertically oriented wall comprises a dielectric material.
8. The flash memory component of claim 1 , further including a tunnel dielectric layer extending along the conductive channel and disposed between the charge storage structure and the blocking dielectric layer of each of the memory cells, wherein the charge storage structure of each of the memory cells has a surface adjacent to the tunnel dielectric layer and remaining surfaces conformally covered by a corresponding blocking dielectric layer.
9. The flash memory component of claim 8 , wherein the blocking dielectric layer of each of the memory cells is a first blocking dielectric layer, the flash memory component further comprising a second blocking dielectric layer extending in a direction of the conductive channel between the conductive layers and corresponding first blocking dielectric layers.
10. The flash memory component of claim 9 , wherein the at least one of the first blocking dielectric layer or the second blocking dielectric layers comprises a nitride material, an oxide material, or a combination thereof.
11. The flash memory component of claim 8 , wherein the charge storage structure is a floating gate or a charge trap.
12. The flash memory component of claim 1 , wherein the conductive channel comprises polysilicon, Ge, SiGe, or a combination thereof.
13. A flash memory component, comprising:
a plurality of polysilicon conductive layers vertically spaced apart from one another and separated by voids, each of the plurality of polysilicon conductive layers forming a word line and having a height in a vertical direction, wherein at least one of the plurality of polysilicon conductive layers has a SiGe residue on a top surface, a bottom surface, or both, wherein the voids provide a vacuum insulating medium between wordlines corresponding to the plurality of conductive layers;
a vertically oriented conductive channel extending through the plurality of polysilicon conductive layers; and
a plurality of memory cells coupling the plurality of polysilicon conductive layers to the conductive channel, wherein each word line is associated with one of the memory cells, each of the memory cells including a charge storage structure having a height in the vertical direction smaller than the height of a corresponding polysilicon conductive layer and protruding in a direction away from the conductive channel, and a blocking dielectric layer conformal to and adjacent to the charge storage structure, wherein charge storage structures of respective ones of the memory cells are distinct from one another, and blocking dielectric layers of respective ones of the memory cells are distinct from one another.