Packaged MEMS device with disturbance compensation

1. An apparatus comprising:

a MEMS device comprising:

a first measurement arrangement for capturing a measurement variable (X 1 ) based on a physical variable,

the measurement variable (X 1 ) having a useful variable component (N 1 ) and a first disturbance variable component (Z 1 ), and

a second measurement arrangement for capturing a second disturbance variable component (Z 2 ), and

a disturbance compensation circuit configured to reduce the measurement variable (X 1 ) by an absolute value of the second disturbance variable component (Z 2 ) to obtain a disturbance-compensated measurement variable (X comp ),

wherein the MEMS device is arranged in a housing, and

wherein the MEMS device is in immediate mechanical contact with the housing by way of at least 50% of a surface of the MEMS device.

2. The apparatus as claimed in claim 1 , wherein the housing has a material having a modulus of elasticity of at least 100 MPa.

3. The apparatus as claimed in claim 1 , wherein the MEMS device is in direct mechanical contact entirely with the housing by way of all surfaces of the MEMS device.

4. The apparatus as claimed in claim 1 , wherein the disturbance compensation circuit is further configured to:

compensate mechanical stress that is acting on the MEMS device, by capturing the mechanical stress by way of the second measurement arrangement and excluding its expected influence on the measurement variable (X 1 ) from the measurement variable (X 1 ).

5. The apparatus as claimed in claim 1 , wherein no additional elastic material for mechanical decoupling of mechanical stress that is acting on the MEMS device is arranged between the MEMS device and the housing.

6. The apparatus as claimed in claim 1 , wherein the MEMS device has a mechanically deflectable movable measurement structure for capturing the physical variable, and

wherein an absolute value of a mechanical deflection of the mechanically deflectable movable measurement structure is capturable by way of the first measurement arrangement.

7. The apparatus as claimed in claim 6 , wherein the first measurement arrangement is arranged at the mechanically deflectable movable measurement structure, and

wherein the second measurement arrangement is arranged at an immovable reference region adjacent to the mechanically deflectable movable measurement structure.

8. The apparatus as claimed in claim 1 , wherein the MEMS device is a pressure sensor.

9. The apparatus as claimed in claim 1 , wherein the first measurement arrangement has a first quantity of piezoresistive elements.

10. The apparatus as claimed in claim 9 , wherein the second measurement arrangement has a second quantity of piezoresistive elements, which are configured to capture, in an environment around the first measurement arrangement, mechanical stress that acts in a region of the first measurement arrangement, and

wherein the mechanical stress that is captured in the environment represents the second disturbance variable component (Z 2 ).

11. The apparatus as claimed in claim 1 , wherein the first measurement arrangement has a first quantity of piezoresistive elements and the second measurement arrangement has a second quantity of piezoresistive elements, and

wherein the first quantity of piezoresistive elements is arranged relative to the second quantity of piezoresistive elements such that the first disturbance variable component (Z 1 ) and the second disturbance variable component (Z 2 ) lie within a tolerance range of ±50%, ±10%, or ±1%.

12. The apparatus as claimed in claim 11 , wherein the second quantity of piezoresistive elements are connected in a Wheatstone bridge circuit.

13. The apparatus as claimed in claim 12 , wherein the Wheatstone bridge circuit has a first branch, in which a first piezoresistive element and a second piezoresistive element are arranged in a shape of an L, and a second branch, in which a third piezoresistive element and a fourth piezoresistive element are arranged in the shape of an L.

14. The apparatus as claimed in claim 13 , wherein the first piezoresistive element and the fourth piezoresistive element are arranged in a manner such that the first piezoresistive element and the fourth piezoresistive element are oriented in a first direction, and

wherein the second piezoresistive element and the third piezoresistive element are arranged in each case in a manner such that the second piezoresistive element and the third piezoresistive element are oriented in a second direction, which differs from the first direction.

15. The apparatus as claimed in claim 1 , wherein the first measurement arrangement has a first quantity of piezoresistive elements and the second measurement arrangement has a second quantity of piezoresistive elements, and

wherein the first quantity of piezoresistive elements is arranged relative to the second quantity of piezoresistive elements such that the first disturbance variable component (Z 1 ) and the second disturbance variable component (Z 2 ) are identical.

16. The apparatus as claimed in claim 1 , further comprising:

a temperature measurement circuit configured to:

measure a temperature acting on the first measurement arrangement and/or the second measurement arrangement,

determine a temperature correction factor (T x ),

wherein the temperature correction factor (T x ) represents a temperature dependence of the first measurement arrangement and/or the second measurement arrangement, and

combine the temperature correction factor (T x ), the second disturbance variable component (Z 2 ), and the measurement variable (X 1 ) to obtain a measurement variable (X 3 ).

17. An apparatus comprising:

a pressure sensor comprising:

a first measurement arrangement to capture a measurement variable (X 1 ) based on a physical variable,

the measurement variable (X 1 ) having a useful variable component (N 1 ) and a first disturbance variable component (Z 1 ),

a second measurement arrangement to capture a second disturbance variable component (Z 2 ), and

a disturbance compensation circuit configured to reduce the measurement variable (X 1 ) by an absolute value of the second disturbance variable component (Z 2 ) to obtain a disturbance-compensated measurement variable (X comp ),

wherein the pressure sensor is arranged in a housing, and

wherein the pressure sensor is in immediate mechanical contact with the housing by way of at least 50% of a surface of the pressure sensor.

18. An apparatus comprising:

a pressure sensor comprising:

a first set of piezoresistive elements to capture a measurement variable (X 1 ) based on a physical variable,

the measurement variable (X 1 ) having a useful variable component (N 1 ) and a first disturbance variable component (Z 1 ),

a second set of piezoresistive elements to capture a second disturbance variable component (Z 2 ), and

a disturbance compensation circuit configured to reduce the measurement variable (X 1 ) by an absolute value of the second disturbance variable component (Z 2 ) to obtain a disturbance-compensated measurement variable (X comp ),

wherein the pressure sensor is arranged in a housing, and

wherein the pressure sensor is in immediate mechanical contact with the housing by way of a surface of the pressure sensor.

19. The apparatus as claimed in claim 18 , wherein the first set of piezoresistive elements is arranged relative to the second set of piezoresistive elements such that the first disturbance variable component (Z 1 ) and the second disturbance variable component (Z 2 ) lie within a tolerance range of ±50%, ±10% or ±1%.

20. The apparatus as claimed in claim 18 , wherein the first set of piezoresistive elements is arranged relative to the second set of piezoresistive elements such that the first disturbance variable component (Z 1 ) and the second disturbance variable component (Z 2 ) are identical.