Apparatus for direct transfer of semiconductor device die
An apparatus for performing a direct transfer of a die. The apparatus includes a first frame to hold the first substrate and a second frame to hold the second substrate. The apparatus further includes a transfer mechanism disposed adjacent to the first frame. The transfer mechanism includes a needle configured to press against the first substrate at a location collinear with the die. A controller, including one or more processors communicatively coupled with the first frame, the second frame, and the transfer mechanism, has executable instructions, which when executed, cause the one or more processors to perform operations including: determining a transfer position of the die on the first substrate via one or more sensors, and aligning the transfer position of the die with the needle of the transfer mechanism via movement of at least two of the first frame, the second frame, and the transfer mechanism.
1. An apparatus for performing a direct transfer of a semiconductor device die (“die”) from a first substrate to a second substrate, the first substrate having a first side and a second side, and the die being disposed on the first side of the first substrate, the apparatus comprising:
a first frame to hold the first substrate;
a second frame to hold the second substrate adjacent to the first side of the first substrate;
a transfer mechanism disposed adjacent to the first frame, the transfer mechanism including a needle configured to press against the first substrate at a location collinear with the die; and
a controller including one or more processors communicatively coupled with the first frame, the second frame, and the transfer mechanism, and the controller having executable instructions,
wherein the controller is configured to cause the one or more processors to perform operations including:
receiving die map data to assist in locating a location of the die on the first substrate,
determining a transfer position of the die on the first substrate via one or more sensors and the die map data, and
aligning the transfer position of the die with the needle of the transfer mechanism via movement of at least two of the first frame, the second frame, and the transfer mechanism.
2. The apparatus of claim 1 , wherein the controller is further configured such that, while aligning the controller controls the movement of at least the first frame and the second frame.
3. The apparatus of claim 1 , wherein the controller is further configured such that, while aligning the controller controls the movement of at least the first frame and the transfer mechanism.
4. The apparatus of claim 1 , wherein the controller is further configured such that, while aligning the controller controls the movement of at least the second frame and the transfer mechanism.
5. The apparatus of claim 1 , wherein the controller is further configured such that, while aligning the controller controls the movement of the first frame, the second frame, and the transfer mechanism.
6. The apparatus of claim 1 , wherein, the controller is further configured such that, during the aligning, the controller controls the transfer mechanism to remain in a fixed position.
7. The apparatus of claim 1 , wherein, the controller is further configured such that, during the aligning, the controller controls the first frame to remain in a fixed position.