IP Library › Granted Patent US 10,748,708
Granted Patent B2
US 10,748,708 · App. 16/003,968 · Granted Aug 18, 2020

Multilayer ceramic capacitor

Inventors: Jeong Bong Park (Suwon-Si, KR); Se Hwan Bong (Suwon-Si, KR); Mi Ok Park (Suwon-Si, KR); Kyeong Jun Kim (Suwon-Si, KR); Hang Kyu Cho (Suwon-Si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H01G4/012H01G4/1227H01G4/232H01G4/248H01G4/30H01G4/12
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Quick Facts
Patent No.
US 10,748,708
App. No.
16/003,968
Granted
Aug 18, 2020
Kind
B2
Abstract

A multilayer ceramic capacitor includes a body, and first and second external electrodes respectively disposed on opposing surfaces of the body in a longitudinal direction. The body includes a capacitive portion including an internal electrode layer including first and second internal electrodes respectively exposed to the opposing surfaces of the body in the longitudinal direction and a floating electrode layer including a floating electrode, the internal electrode layer and the floating electrode layer being alternately stacked with a first dielectric layer interposed therebetween, a cover part disposed on the capacitive portion and having stacked second dielectric layers, a dummy part disposed below the capacitive portion and including a dummy electrode layer including a dummy electrode and a third dielectric layer, the dummy electrode layer and the third dielectric layer being alternately stacked, and an identification layer disposed below the dummy part and having a color distinguished from the cover part.

Claims (52)

1. A multilayer ceramic capacitor including a body and first and second external electrodes respectively disposed on opposing surfaces of the body in a longitudinal direction, wherein

the body includes:

a capacitive portion including an internal electrode layer including first and second internal electrodes respectively exposed to the opposing surfaces of the body in the longitudinal direction and a floating electrode layer including a floating electrode, wherein the internal electrode layer and the floating electrode layer are alternately stacked with a first dielectric layer interposed therebetween;

a cover part disposed on the capacitive portion and having stacked second dielectric layers;

only one dummy part; and

an identification layer disposed below the dummy part and having a color different from the cover part,

the only one dummy part is disposed between the capacitive portion and the identification layer and includes a third dielectric layer and a dummy electrode layer including a dummy electrode, the dummy electrode layer and the third dielectric layer being alternately stacked, and

each dummy electrode in the only one dummy part is disposed at a center portion of the body in the longitudinal direction so as to be spaced apart from the first and second external electrodes.

2. The multilayer ceramic capacitor of claim 1 , wherein

the internal electrode layer further includes a first electrode pattern between the first and second internal electrodes, and the first electrode pattern is arranged to be spaced apart from the first and second internal electrodes.

3. The multilayer ceramic capacitor of claim 1 , wherein

the floating electrode layer further includes second and third electrode patterns spaced apart from the floating electrode and respectively exposed to the opposing surfaces of the body in the longitudinal direction.

4. The multilayer ceramic capacitor of claim 1 , wherein

the dummy electrode has the same shape as that of the floating electrode layer or the internal electrode layer.

5. The multilayer ceramic capacitor of claim 1 , wherein

the third dielectric layer included in the dummy part is thinner than the first dielectric layer included in the capacitive portion.

6. The multilayer ceramic capacitor of claim 1 , wherein

the identification layer has a thickness of 30 μm or greater.

7. The multilayer ceramic capacitor of claim 1 , wherein

the identification layer is white.

8. The multilayer ceramic capacitor of claim 1 , wherein a thickness of the identification layer is less than a thickness of the cover part.

9. The multilayer ceramic capacitor of claim 8 , wherein the thickness of the identification layer is 30 μm or greater.

10. A multilayer ceramic capacitor including a body and first and second external electrodes respectively disposed on opposing surfaces of the body in a longitudinal direction, wherein

the body includes:

a capacitive portion including an internal electrode layer including first and second internal electrodes respectively exposed to the opposing surfaces of the body in the longitudinal direction and a floating electrode layer including a floating electrode, wherein the internal electrode layer and the floating electrode layer are alternately stacked with a first dielectric layer interposed therebetween;

a cover part disposed on the capacitive portion and having stacked second dielectric layers;

a dummy part disposed below the capacitive portion and including a third dielectric layer and a dummy electrode layer including a dummy electrode, the dummy electrode layer and the third dielectric layer being alternately stacked; and

an identification layer disposed below the dummy part and having a color different from the cover part, and

the identification layer includes a compound represented by ABO 3 as a main component, A includes Ba or Ba and at least one of Ca, Zr, and Sr, and B includes Ti or Ti and at least one of Zr and Hf and includes 0.1 to 30 moles of Si and Al with respect to 100 moles of the main component, as an accessory component.

11. A multilayer ceramic capacitor including a body and first and second external electrodes respectively disposed on opposing surfaces of the body in a longitudinal direction, wherein

the body includes:

a capacitive portion including first and second internal electrodes alternately arranged with a first dielectric layer interposed therebetween and respectively exposed to the opposing surfaces of the body in the longitudinal direction;

a cover part disposed on the capacitive portion and including stacked second dielectric layers;

only one dummy part; and

an identification layer disposed below the dummy part and having a color distinguished from the cover part,

the only one dummy part is disposed between the capacitive portion and the identification layer and includes a third dielectric layer and a dummy electrode layer including a dummy electrode, the dummy electrode layer and the third dielectric layer being alternately stacked,

a thickness of the identification layer is less than a thickness of the cover part, and

the thickness of the identification layer is 30 μm or greater.

12. The multilayer ceramic capacitor of claim 11 , wherein

when a layer including the first internal electrode is defined as a first internal electrode layer and a layer including the second internal electrode is defined as a second internal electrode layer,

the first internal electrode layer further includes a first electrode pattern exposed to a surface opposing the surface to which the first internal electrode is exposed, and

the second internal electrode layer further includes a second electrode pattern exposed to a surface opposing the surface to which the second internal electrode is exposed.

13. The multilayer ceramic capacitor of claim 12 , wherein

the dummy electrode layer has the same shape as that of the first internal electrode layer or the second internal electrode layer.

14. The multilayer ceramic capacitor of claim 11 , wherein

the third dielectric layer included in the dummy part is thinner than the first dielectric layer included in the capacitive portion.

15. The multilayer ceramic capacitor of claim 11 , wherein

the identification layer has a thickness of 30 μm or greater.

16. The multilayer ceramic capacitor of claim 11 , wherein

the identification layer is white.

17. The multilayer ceramic capacitor of claim 11 , wherein

the identification layer includes a compound represented by ABO 3 as a main component, A includes Ba or Ba and at least one of Ca, Zr, and Sr, and B includes Ti or Ti and at least one of Zr and Hf and includes 0.1 to 30 moles of Si and Al with respect to 100 moles of the main component, as an accessory component.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 11, 2018
From: PARK, JEONG BONG; BONG, SE HWAN; PARK, MI OK; KIM, KYEONG JUN; CHO, HANG KYU
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 046040/0890 →
Priority Claims (1)
KR 10-2017-0156510 · Nov 22, 2017 · national
Continuity (1)
Related Publication 20190157004A1 · May 23, 2019