Decoupled via fill
View Patent ↗Techniques are disclosed for providing a decoupled via fill. Given a via trench, a first barrier layer is conformally deposited onto the bottom and sidewalls of the trench. A first metal fill is blanket deposited into the trench. The non-selective deposition is subsequently recessed so that only a portion of the trench is filled with the first metal. The previously deposited first barrier layer is removed along with the first metal, thereby re-exposing the upper sidewalls of the trench. A second barrier layer is conformally deposited onto the top of the first metal and the now re-exposed trench sidewalls. A second metal fill is blanket deposited into the remaining trench. Planarization and/or etching can be carried out as needed for subsequent processing. Thus, a methodology for filling high aspect ratio vias using a dual metal process is provided. Note, however, the first and second fill metals may be the same.
1. An integrated circuit structure, comprising:
a dielectric layer;
a trench in the dielectric layer, the trench having a bottom and sidewalls;
a first barrier layer along and in contact with the bottom and lower portions of the sidewalls of the trench, the first barrier layer comprising tantalum;
a first fill material in the trench, the first fill material on the first barrier layer, and the first fill material comprising a metal selected from the group consisting of copper, aluminum and nickel;
a second barrier layer in the trench, the second barrier layer on the first fill material, and the second barrier layer comprising ruthenium; and
a second fill material in the trench, the second fill material on the second barrier layer, and the second fill material comprising cobalt, wherein the second barrier layer is along sidewalls of the second fill material.
2. The integrated circuit structure of claim 1 , wherein the dielectric layer further comprises an etch stop layer, the trench in the etch stop layer.
3. The integrated circuit structure of claim 1 , wherein the second barrier layer has a top surface co-planar with a top surface of the dielectric layer.
4. The integrated circuit structure of claim 1 , wherein the metal of the first fill material is copper.
5. The integrated circuit structure of claim 1 , wherein the metal of the first fill material is aluminum.
6. The integrated circuit structure of claim 1 , wherein the metal of the first fill material is nickel.
7. The integrated circuit structure of claim 1 , wherein the sidewalls of the trench are substantially vertical.
8. An integrated circuit structure, comprising:
a dielectric layer;
an opening in the dielectric layer, the opening having a bottom and sidewalls;
a first barrier layer along and in contact with the bottom and lower portions of the sidewalls of the opening, the first barrier layer comprising tantalum;
a first fill material in the opening, the first fill material on the first barrier layer, and the first fill material comprising a metal selected from the group consisting of copper, aluminum and nickel;
a second barrier layer in the opening, the second barrier layer on the first fill material, and the second barrier layer comprising ruthenium; and
a second fill material in the opening, the second fill material on the second barrier layer, and the second fill material comprising cobalt, wherein the second barrier layer is along sidewalls of the second fill material.
9. The integrated circuit structure of claim 8 , wherein the dielectric layer further comprises an etch stop layer, the opening through the etch stop layer.
10. The integrated circuit structure of claim 8 , wherein the second barrier layer has a top surface co-planar with a top surface of the dielectric layer.
11. The integrated circuit structure of claim 8 , wherein the metal of the first fill material is copper.
12. The integrated circuit structure of claim 8 , wherein the metal of the first fill material is aluminum.
13. The integrated circuit structure of claim 8 , wherein the metal of the first fill material is nickel.
14. The integrated circuit structure of claim 8 , wherein the sidewalls of the opening are substantially vertical.
15. A computing device, comprising:
a board; and
a component coupled to the board, the component including an integrated circuit structure, comprising:
a dielectric layer;
a trench in the dielectric layer, the trench having a bottom and sidewalls;
a first barrier layer along and in contact with the bottom and lower portions of the sidewalls of the trench, the first barrier layer comprising tantalum;
a first fill material in the trench, the first fill material on the first barrier layer, and the first fill material comprising a metal selected from the group consisting of copper, aluminum and nickel;
a second barrier layer in the trench, the second barrier layer on the first fill material, and the second barrier layer comprising ruthenium; and
a second fill material in the trench, the second fill material on the second barrier layer, and the second fill material comprising cobalt, wherein the second barrier layer is along sidewalls of the second fill material.
16. The computing device of claim 15 , further comprising:
a memory coupled to the board.
17. The computing device of claim 15 , further comprising:
a communication chip coupled to the board.
18. The computing device of claim 15 , further comprising:
a battery coupled to the board.
19. The computing device of claim 15 , wherein the component is a packaged integrated circuit die.
20. The computing device of claim 15 , wherein the computing device is selected from the group consisting of a mobile phone, a laptop, a desk top computer, a server, and a set-top box.