Silicon-containing compositions and their methods of use

1. A compound of Formula (I-A-iv)

or a salt thereof, wherein:

z is an integer from 1 to 6;

t is an integer from 0 to 1;

q1 is an integer from 1 to 4;

q2 is an integer from 1 to 3;

each of R 4A , R 4B , R 4C , and R 4D is independently for each occurrence hydrogen or alkyl; and each occurrence of R 5A is independently alkyl, cycloalkyl, aryl, or —OR C , wherein R C is alkyl, cycloalkyl, heterocyclyl, alkenyl, alkynyl, cycloalkenyl, aryl or heteroaryl, provided that the sum of t, q1, and q2 is 4.

2. The compound of claim 1 , wherein the compound of Formula (I-A) is a compound of Formula (I-A-ii-1)

3. The compound of claim 1 , wherein the compound is:

4. The compound of claim 3 , wherein the compound is:

5. A composition comprising the reaction product of:

an epoxy resin; and

a compound of Formula (I-A-iv):

wherein:

z is an integer from 1 to 6;

t is an integer from 0 to 1;

q1 is an integer from 1 to 4;

q2 is an integer from 0 to 3;

each of R 4A , R 4B , R 4C , and R 4D is independently for each occurrence hydrogen or alkyl;

and each occurrence of R 5A is independently alkyl, cycloalkyl, aryl, or —OR C , wherein R C is alkyl, cycloalkyl, heterocyclyl, alkenyl, alkynyl, cycloalkenyl, aryl or heteroaryl, provided that the sum of t, q1, and q2 is 4.

6. The composition of claim 5 , wherein the compound of Formula (I-A) is a compound of Formula (I-A-ii-1):

7. The composition of claim 5 , wherein the compound of Formula (I-A) is:

8. The composition of claim 7 , wherein the compound of Formula (I-A) is:

9. The composition of claim 5 , wherein the epoxy resin comprises a diepoxide resin.

10. A composition comprising the reaction product of:

an epoxy resin;

a compound of Formula (I-A);

(R 5 ) t —Si O—W—NH 2 ) q    Formula (I-A)

wherein:

q is 4, 3, 2, or 1;

t is 0, 1, 2, or 3;

the sum of q and t is 4;

each occurrence of W is independently alkylene, cycloalkylene, heterocyclylene, alkenylene, alkynylene, cycloalkenylene, arylene, or heteroarylene; and

each occurrence of R 5 is independently hydrogen, alkyl, cycloalkyl, heterocyclyl, alkenyl, alkynyl, cycloalkenyl, aryl, heteroaryl or —OR C , wherein R C is alkyl, cycloalkyl, heterocyclyl, alkenyl, alkynyl, cycloalkenyl, aryl or heteroaryl; and

a compound having the Formula (II-A-1):

wherein: each of R 6A and R 6B is independently hydrogen or alkyl;

each of R 7A , R 7B , R 8A , R 8B , R 8C and R 8D is independently for each occurrence hydrogen or alkyl; and

each of n1 and n2 is independently 1 or 2.

11. A method for recycling the composition of claim 10 , comprising contacting the composition with an acid.

12. The composition of claim 1 , wherein the compound of Formula (I-A) is a compound of Formula (I-A-iv)

wherein:

z is an integer from 1 to 6; t is an integer from 0 to 1;

q1 is an integer from 0 to 4; q2 is an integer from 0 to 4;

each of R 4A , R 4B , R 4C , and R 4D is independently for each occurrence hydrogen or alkyl; and

each occurrence of R 5A is independently alkyl, cycloalkyl, aryl, or —OR C , wherein R C is alkyl, cycloalkyl, heterocyclyl, alkenyl, alkynyl, cycloalkenyl, aryl or heteroaryl,

provided that the sum of t, q1, and q2 is 4, and the sum of q1 and q2 is not 0.

13. The composition of claim 10 , wherein the compound of Formula (I-A) is a compound of Formula (I-A-i-1) or (I-A-ii-1):

wherein:

z is an integer from 1 to 6; each of R 4A , R 4B , R 4C , and R 4D is independently for each occurrence hydrogen or alkyl; and

each occurrence of R 5A is independently alkyl, cycloalkyl, aryl, or —OR C , wherein R C is alkyl, cycloalkyl, heterocyclyl, alkenyl, alkynyl, cycloalkenyl, aryl or heteroaryl.

14. The composition of claim 10 , wherein the compound of Formula (I-A) is a compound of Formula (I-A-iii):

wherein:

each of X 1 , X 2 , X 3 , and X 4 is independently alkylene, cycloalkylene, heterocyclylene, alkenylene, alkynylene, cycloalkenylene, arylene, or heteroarylene.

15. The composition of claim 10 , wherein the compound of Formula (I-A) is:

16. The composition of claim 10 , wherein the compound of Formula (I-A) is:

17. The composition of claim 16 , wherein the compound of Formula (I-A) is:

18. The composition of claim 10 , wherein the compound of Formula (II-A-1) is:

19. The composition of claim 10 , wherein the composition comprises a chain extender.

20. The composition of claim 10 , wherein the epoxy resin comprises a diepoxide resin.