IP Library Granted Patent US 10,825,933
Granted Patent B2
US 10,825,933 · App. 16/005,631 · Granted Nov 3, 2020

Gate-all-around structure and manufacturing method for the same

Inventors: Meng-Hsuan Hsiao (Hsinchu, TW); Wei-Sheng Yun (Taipei, TW); Winnie Victoria Wei-Ning Chen (Milpitas, CA); Tung Ying Lee (Hsinchu, TW); Ling-Yen Yeh (Hsinchu, TW)
Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
H01L29/78696H01L27/092H01L29/0673H01L29/16H01L29/42392H01L29/66545H01L29/66742
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Quick Facts
Patent No.
US 10,825,933
App. No.
16/005,631
Granted
Nov 3, 2020
Kind
B2
Abstract

Present disclosure provides gate-all-around structure including a semiconductor fin having a top surface, a first nanowire over the top surface, a first space between the top surface and the first nanowire, an N th nanowire and an (N+1) th nanowire over the first nanowire, and a second space between the N th nanowire and the (N+1) th nanowire. The first space is greater than the second space. Present disclosure also provides a method for manufacturing the gate-all-around structure described herein.

Claims (45)

1. A gate-all-around structure, comprising:

a semiconductor fin having a top surface;

a first nanowire over the top surface;

a first space between the top surface and the first nanowire;

an N th nanowire and an (N+1) th nanowire over the first nanowire, N being an integer greater than 1;

a second space between the N th nanowire and the (N+1) th nanowire, wherein the first space is greater than the second space; and

a third space between the first nanowire and the N th nanowire, wherein the third space is greater than the second space.

2. The structure of claim 1 , wherein a thickness of the first nanowire is identical to a thickness of the N th and a thickness of the (N+1) th nanowire.

3. The structure of claim 1 , further comprising a gate filling the first space, the second space and the third space.

4. The structure of claim 1 , further comprising a source or a drain filling the first space, the second space and the third space.

5. The structure of claim 1 , wherein the first nanowire is composed of silicon.

6. The structure of claim 1 , further comprising:

an (N+2) th nanowire over the (N+1) th nanowire, wherein a fourth space is between the (N+1) th nanowire and the (N+2) th nanowire, and the second space is greater than the fourth space.

7. A semiconductor structure, comprising:

a P-type transistor, comprising:

a semiconductor fin having a top surface;

a first SiGe nanowire over the top surface of the semiconductor fin;

a second SiGe nanowire, an N th SiGe nanowire, and an (N+1) th SiGe nanowire over the first SiGe nanowire, N being an integer greater than 1;

a first space between the first SiGe nanowire and the second SiGe nanowire; and

a second space between the N th SiGe nanowire and the (N+1) th SiGe nanowire;

wherein the first space is greater than the second space.

8. The semiconductor structure of claim 7 , wherein a thickness of the first SiGe nanowire is identical to a thickness of the second SiGe nanowire, the N th SiGe nanowire, and the (N+1) th SiGe nanowire.

9. The semiconductor structure of claim 7 , wherein the first space is greater than the second space by a range of from about 0.5 nm to about 1.5 nm.

10. The semiconductor structure of claim 7 , further comprising a first gate filling the first space and the second space.

11. The semiconductor structure of claim 7 , further comprising a first source or a first drain filling the first space and the second space.

12. The semiconductor structure of claim 7 , further comprising:

an N-type transistor, comprising:

a first Si nanowire over the top surface of the semiconductor fin;

a third space between the top surface and the first Si nanowire;

an N th Si nanowire, and an (N+1) t Si nanowire over the first Si nanowire, N being an integer greater than 1; and

a fourth space between the N th Si nanowire and the (N+1) th Si nanowire;

wherein the third space is greater than the fourth space.

13. The semiconductor structure of claim 12 , wherein a thickness of the first Si nanowire is identical to a thickness of the N th Si nanowire and the (N+1) th Si nanowire.

14. The semiconductor structure of claim 12 , further comprising a second gate filling the third space and the fourth space.

15. The semiconductor structure of claim 12 , further comprising a second source or a second drain filling the third space and the fourth space.

16. A semiconductor structure, comprising:

a semiconductor fin having a top surface;

a first nanowire over the top surface;

an N th nanowire over the first nanowire, N being an integer greater than 1; and

an (N+1) th nanowire over the N th nanowire, wherein a thickness of the first nanowire is identical to a thickness of the N th nanowire, a first space is between the top surface of the semiconductor fin and the first nanowire, a second space is between the N th nanowire and the (N+1) th nanowire, the first space and the second space are filled with a doped material or a gate material; and

an (N+2) th nanowire over the (N+1) th nanowire, wherein a third space is between the (N+1) th nanowire and the (N+2) th nanowire, the second space being greater than the third space.

17. The semiconductor structure of claim 16 , wherein the first space is greater than the second space.

18. The semiconductor structure of claim 16 , wherein the first space is at least greater than the second space by a range of from about 0.5 nm to about 1.5 nm.

19. The semiconductor structure of claim 16 , wherein a concentration of germanium of the N th nanowire of the first transistor is in a range from 20% to 75%.

20. The semiconductor structure of claim 16 , wherein the third space is filled with the doped material or the gate material.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 25, 2018
From: HSIAO, MENG-HSUAN; YUN, WEI-SHENG; CHEN, WINNIE VICTORIA WEI-NING; LEE, TUNG YING; YEH, LING-YEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Reel/Frame 046456/0075 →
Continuity (1)
Related Publication 20190378934A1 · Dec 12, 2019
Cited By (1)
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