Liquid ejection head and liquid ejection apparatus
A liquid ejection head includes a substrate including an electrically insulating film, an energy generating element provided on the substrate and configured to generate energy used to eject a liquid, a flow path formed through the substrate and communicating with an ejection port configured to eject a liquid, and a wiring layer formed in the electrically insulating film of the substrate, used to drive the energy generating element, provided apart from a wall defining the flow path, and provided to surround the flow path in a plan view of the substrate.
1. A liquid ejection head comprising:
a substrate including an electrically insulating film;
an energy generating element provided on the substrate and configured to generate energy used to eject a liquid;
a flow path formed through the substrate and communicating with an ejection port configured to eject the liquid; and
a wiring layer formed in the electrically insulating film of the substrate and used to drive the energy generating element, the wiring layer being provided apart from a wall defining the flow path and provided to surround the flow path with respect to a plan view of the substrate.
2. The liquid ejection head according to claim 1 , wherein the wiring layer is connected to a leak detection mechanism configured to detect a leak current flowing from the wiring layer.
3. The liquid ejection head according to claim 1 , wherein the wiring layer is a power source wiring configured to supply a power source potential to the energy generating element.
4. The liquid ejection head according to claim 1 , wherein the wiring layer is a power source wiring configured to supply a power source potential to a logic circuit that is configured to drive the energy generating element.
5. The liquid ejection head according to claim 1 , further comprising an additional wiring layer that is formed in the electrically insulating film, apart from the wiring layer in a thickness direction of the substrate and is used to drive the energy generating element, the additional wiring layer being provided apart from the wall defining the flow path, wherein
the wiring layer is provided more closely to the wall defining the flow path than the additional wiring layer.
6. The liquid ejection head according to claim 5 , wherein the wiring layer is a power source wiring configured to supply a power source potential to the energy generating element.
7. The liquid ejection head according to claim 1 , wherein two wiring layers are formed in the electrically insulating film, apart from each other in a thickness direction of the substrate.
8. The liquid ejection head according to claim 7 , wherein one of the two wiring layers has a higher electric potential than the other of the two wiring layers.
9. The liquid ejection head according to claim 7 , wherein an additional wiring layer is formed in the electrically insulating film, apart from the two wiring layers in a thickness direction of the substrate, is used to drive the energy generating element, and is provided apart from the wall defining the flow path, and
the two wiring layers are provided more closely to the wall defining the flow path than the additional wiring layer.
10. The liquid ejection head according to claim 9 , wherein one of the two wiring layers includes a power source wiring configured to supply a power source potential to the energy generating element, and the other of the two wiring layers includes a ground wiring configured to supply a reference potential to the energy generating element.
11. The liquid ejection head according to claim 10 , wherein the additional wiring layer includes at least any of a logic signal wiring configured to transmit a signal to a logic circuit that is configured to drive the energy generating element, a power source wiring configured to supply a power source potential to the logic circuit, and a ground wiring configured to supply a reference potential to the logic circuit.
12. The liquid ejection head according to claim 9 , wherein one of the two wiring layers includes a power source wiring configured to supply a power source potential to the energy generating element, and the other of the two wiring layers includes a ground wiring configured to supply a reference potential to a logic circuit that is configured to drive the energy generating element.
13. The liquid ejection head according to claim 9 , wherein one of the two wiring layers includes a power source wiring configured to supply a power source potential to a logic circuit that is configured to drive the energy generating element, and the other of the two wiring layers includes a ground wiring configured to supply a reference potential to the logic circuit that is configured to drive the energy generating element.
14. The liquid ejection head according to claim 1 , wherein an electric potential of 3.0 V or more is applied to the wiring layer.
15. The liquid ejection head according to claim 1 , wherein a liquid supplied to the flow path is connected to a ground potential.
16. A liquid ejection apparatus comprising:
a liquid ejection head, the liquid ejection head including:
a substrate including an electrically insulating film,
an energy generating element provided on the substrate and configured to generate energy used to eject a liquid,
a flow path formed through the substrate and communicating with an ejection port configured to eject the liquid, and
a wiring layer formed in the electrically insulating film of the substrate and used to drive the energy generating element, the wiring layer being provided apart from a wall defining the flow path and provided to surround the flow path with respect to a plan view of the substrate; and
a leak detection mechanism electrically connected to the wiring layer and configured to detect a leak current flowing from the wiring layer.
17. The liquid ejection apparatus according to claim 16 , wherein the wiring layer is a power source wiring configured to supply a power source potential to the energy generating element.
18. The liquid ejection apparatus according to claim 16 , wherein two wiring layers are formed in the electrically insulating film, apart from each other in a thickness direction of the substrate.
19. The liquid ejection apparatus according to claim 18 , further comprising an additional wiring layer that is formed in the electrically insulating film, apart from the two wiring layers in a thickness direction of the substrate, and is used to drive the energy generating element, the additional wiring layer being provided apart from the wall defining the flow path, wherein
the two wiring layers are provided more closely to the wall defining the flow path than the additional wiring layer.
20. The liquid ejection apparatus according to claim 19 , wherein one of the two wiring layers includes a power source wiring configured to supply a power source potential to the energy generating element, and the other of the two wiring layers includes a ground wiring configured to supply a reference potential to the energy generating element.