Integrated mounting solution for solid-state spin sensors used for bulk detection and imaging
Solid-state spin sensor systems and methods of manufacturing are disclosed. A mounting structure may be provided in thermal contact with a solid-state spin sensor having a plurality of color center defects such that thermal energy flows from the solid-state spin sensor to the mounting structure. A microwave application structure may be disposed on a face of the mounting structure or a face of the solid-state spin sensor for applying microwave radiation to the solid-state spin sensor.
1. A solid-state spin sensor system, comprising:
a solid-state spin sensor having a plurality of color center defects; a mounting structure, wherein the mounting structure is in thermal contact with the solid-state spin sensor such that thermal energy flows from the solid-state spin sensor to the mounting structure; and
a microwave application structure, disposed on a face of the mounting structure or a face of the solid-state spin sensor for applying microwave radiation to the solid-state spin sensor.
2. The solid-state spin sensor system of claim 1 , wherein the mounting structure is positioned and arranged to mechanically support the solid-state spin sensor.
3. The solid-state spin sensor system of claim 1 , wherein the mounting structure is a thin layer having a thickness between 50 micrometers to 2 centimeters.
4. The solid-state spin sensor system of claim 1 , wherein the microwave application structure is disposed on the face of the mounting structure that is proximal to the solid-state spin sensor.
5. The solid-state spin sensor system of claim 4 , wherein a first side of the microwave application structure is fixed to a face of the mounting structure, and the solid-state spin sensor is fixed to a second side of the microwave application structure opposite the first side of the microwave application structure,
the solid-state spin sensor system further comprising:
a light collection element configured to collect light emitted from the color center defects in the solid-state spin sensor traveling in a direction moving away from the second side of the microwave application structure.
6. The solid-state spin sensor system of claim 5 , wherein the mounting structure further comprises a hole, and wherein the microwave application structure and the solid-state spin sensor are disposed such that they cover at least a part of the hole.
7. The solid-state spin sensor system of claim 6 , wherein the microwave application structure has a thickness of 10 nanometers to 20 micrometers.
8. The solid-state spin sensor system of claim 1 , wherein the mounting structure and the microwave application structure are on opposing sides of the solid-state spin sensor.
9. The solid-state spin sensor system of claim 1 , further comprising a glass coupling element for delivery of light to the solid-state spin sensor.
10. The solid-state spin sensor system of claim 9 , further comprising:
immersion oil contacting an emission face of the solid-state spin sensor; and
an imaging element contacting the immersion oil opposite the emission face of the solid-state spin sensor,
wherein the imaging element is configured to collect light emitted by the color center defects in the solid-state spin sensor.
11. The solid-state spin sensor system of claim 1 , wherein the microwave application structure or portions thereof are reflective to decrease the quantity of light exits one side of the solid-state spin sensor and increases the quantity of light which exits another side of the solid-state spins sensor.
12. The solid-state spin sensor system of claim 1 , wherein the mounting structure is secured to the solid-state sensor using a high thermal conductive bond.
13. The solid-state spin sensor system of claim 1 , further comprising a spatially resolved imaging device configured to capture at least one image of light emitted by the solid-state spin sensor, wherein the image provides spatially resolved information about a physical quantity.
14. The solid-state spin sensor system of claim 13 , wherein the solid-state spin sensor comprises color center defects located in a layer on one surface of the solid-state spin sensor.
15. The solid-state spin sensor system of claim 1 , wherein the solid-state spin sensor system is configured for use as a bulk detector.
16. The solid-state spin sensor system of claim 1 , wherein the solid-state spin sensor comprises color center defects located throughout approximately the entire thickness of the spin sensor.
17. The solid-state spin sensor system of claim 1 , wherein the mounting structure comprises at least one of diamond, semi-insulating silicon carbide, zinc oxide, silicon, gallium nitride, magnesium oxide, magnesium fluoride, and sapphire.
18. A method of manufacturing a solid-state spin sensor system comprising:
providing a solid-state spin sensor having a plurality of color center defects;
providing a mounting structure in thermal contact with the solid-state spin sensor; and
disposing a microwave application structure on a face of the mounting structure or a face of the solid-state spin sensor for applying microwave radiation to the solid-state spin sensor.
19. The method of claim 18 , wherein said disposing the microwave application structure on a face of the mounting structure or a face of the solid-state spin sensor comprises printing the microwave application structure on the face of the mounting structure or the face of the solid-state spin sensor.
20. The solid-state spin sensor system of claim 18 , wherein the microwave application structure is disposed on a face of the mounting structure that is proximal to the solid-state spin sensor.