Inkjet printing OLED display panel and manufacturing method for the same

1. A manufacturing method for an inkjet printing organic light-emitting diode (OLED) display panel, comprising steps of:

sequentially forming a passivation layer and a planarization layer on at least one pair of thin-film transistors on a glass substrate, and the passivation layer covers the at least one pair of thin-film transistors;

forming at least one pair of vias both at the passivation layer and the planarization layer;

forming at least one pair of anodes on the planarization layer, wherein the least one pair of anodes are electrically connected to the least one pair of thin-film transistors through the vias at the passivation layer and the planarization layer;

depositing a pixel definition layer of a single material on the planarization layer, and the pixel definition layer covers the at least one pair of anodes;

using a half-tone mask to pattern the single material and define a pattern of the pixel definition layer by partially removing the single material to form a recessed area that is defined and delimited by a portion of the single material, a part of the single material being preserved in the recessed area and located between the least one pair of the anodes, such that a region of the pixel definition layer located above each of the at least one pair of the anodes forms a notch corresponding to the anode, wherein a height of the part of the single material preserved in the recessed area and located between the least one pair of the anodes is decreased and a top surface of the part of the single material preserved in the recessed area and located between the at least one pair of the anodes is lower than a top surface of the portion of the single material that defines and delimits the recessed area;

using an inkjet printing technology to form a light-emitting layer in the recessed area of the pixel definition layer, wherein the light-emitting layer is in contact with each of the at least one pair of anodes so that the light-emitting layer is in contact with plural anodes of the at least one pair of anodes and extends over and covers the pixel definition layer located between the plural anodes of the at least one pair of anodes, wherein the light-emitting layer is completely received in the recessed area and has a height that is greater than the height of the part of the single material preserved in the recessed area and located between the at least one pair of the anodes and smaller than the height of the portion of the single material that defines and delimits the recessed area, wherein the light-emitting layer covers the part of the single material preserved in the recessed area and located between the at least one pair of the anodes and does not cover the portion of the single material that defines and delimits the recessed area.

2. The manufacturing method for an inkjet printing OLED display panel according to claim 1 , wherein the method further comprises a step of:

manufacturing a cathode on the light-emitting layer.

3. The manufacturing method for an inkjet printing OLED display panel according to claim 1 , wherein the step of using a half-tone mask to define a pattern of the pixel definition layer comprises steps of:

disposing the half-tone mask to be above the pixel definition layer, a partial-light-transmitting region of the half-tone mask is located above the pixel definition layer located between the at least one pair of anodes, a light-transmitting region of the half-tone mask is located above the at least one pair of anodes, and through a yellow light to define the pattern of the pixel definition layer by the half-tone mask.

4. The manufacturing method for an inkjet printing OLED display panel according to claim 1 , wherein the passivation layer includes at least one layer of SiOx and/or at least one layer of SiNx, and a thickness range of the passivation layer is 1000˜5000 angstrom; and

the planarization layer includes at least one photoresist layer having at least one kind of photoresist, and a thickness range of the planarization layer is 10000˜20000 angstrom.

5. The manufacturing method for an inkjet printing OLED display panel according to claim 1 , wherein the step of depositing an ITO (Indium Tin Oxide) material layer on the planarization layer, and utilizing the yellow light for patterning the ITO material layer in order to obtain the at least one pair of anodes, wherein a thickness range of the anode 5 is 500˜1000 angstrom.

6. The manufacturing method for an inkjet printing OLED display panel according to claim 1 , wherein the pixel definition layer includes at least one photoresist layer having at least one kind of photoresist, a thickness range of the pixel definition layer located at two sides of the at least one pair of anodes is 10000˜20000 angstrom.

7. The manufacturing method for an inkjet printing OLED display panel according to claim 1 , wherein using the yellow light to form at least one pair of vias at the passivation layer and the planarization layer.

8. A manufacturing method for an inkjet printing organic light-emitting diode (OLED) display panel, comprising steps of:

sequentially forming a passivation layer and a planarization layer on at least one pair of thin-film transistors on a glass substrate, and the passivation layer covers the at least one pair of thin-film transistors;

forming at least one pair of vias both at the passivation layer and the planarization layer;

forming at least one pair of anodes on the planarization layer, wherein the least one pair of anodes are electrically connected to the least one pair of thin-film transistors through the vias at the passivation layer and the planarization layer;

depositing a pixel definition layer of a single material on the planarization layer, and the pixel definition layer covers the at least one pair of anodes;

using a half-tone mask to pattern the single material and define a pattern of the pixel definition layer by partially removing the single material to form a recessed area that is defined and delimited by a portion of the single material, a part of the single material being preserved in the recessed area and located between the least one pair of the anodes, such that a region of the pixel definition layer located above each of the at least one pair of the anodes forms a notch corresponding to the anode, wherein a height of the part of the single material preserved in the recessed area and located between the least one pair of the anodes is decreased and a top surface of the part of the single material preserved in the recessed area and located between the at least one pair of the anodes is lower than a top surface of the portion of the single material that defines and delimits the recessed area;

using an inkjet printing technology to form a light-emitting layer in the recessed area of the pixel definition layer, wherein the light-emitting layer is in contact with each of the at least one pair of anodes so that the light-emitting layer is in contact with plural anodes of the at least one pair of anodes and extends over and covers the pixel definition layer located between the plural anodes of the at least one pair of anodes, wherein the light-emitting layer is completely received in the recessed area and has a height that is greater than the height of the part of the single material preserved in the recessed area and located between the at least one pair of the anodes and smaller than the height of the portion of the single material that defines and delimits the recessed area, wherein the light-emitting layer covers the part of the single material preserved in the recessed area and located between the at least one pair of the anodes and does not cover the portion of the single material that defines and delimits the recessed area; and

manufacturing a cathode on the light-emitting layer.

9. The manufacturing method for an inkjet printing OLED display panel according to claim 8 , wherein the step of using a half-tone mask to define a pattern of the pixel definition layer comprises steps of:

disposing the half-tone mask to be above the pixel definition layer, a partial-light-transmitting region of the half-tone mask is located above the pixel definition layer located between the at least one pair of anodes, a light-transmitting region of the half-tone mask is located above the at least one pair of anodes, and through a yellow light to define the pattern of the pixel definition layer by the half-tone mask.

10. The manufacturing method for an inkjet printing OLED display panel according to claim 8 , wherein the passivation layer includes at least one layer of SiOx and/or at least one layer of SiNx, and a thickness range of the passivation layer is 1000˜5000 angstrom; and

the planarization layer includes at least one photoresist layer having at least one kind of photoresist, and a thickness range of the planarization layer is 10000˜20000 angstrom.

11. The manufacturing method for an inkjet printing OLED display panel according to claim 8 , wherein the step of depositing an ITO (Indium Tin Oxide) material layer on the planarization layer, and utilizing the yellow light for patterning the ITO material layer in order to obtain the at least one pair of anodes, wherein a thickness range of the anode is 500˜1000 angstrom.

12. The manufacturing method for an inkjet printing OLED display panel according to claim 8 , wherein the pixel definition layer includes at least one photoresist layer having at least one kind of photoresist, a thickness range of the pixel definition layer located at two sides of the at least one pair of anodes is 10000˜20000 angstrom.

13. The manufacturing method for an inkjet printing OLED display panel according to claim 8 , wherein using the yellow light to form at least one pair of vias at the passivation layer and the planarization layer.

14. An inkjet printing organic light-emitting diode (OLED) display panel, comprising:

at least one pair of thin-film transistors;

a passivation layer and a planarization layer which are disposed sequentially and stacked above the at least one pair of thin-film transistors, wherein the passivation layer and the planarization layer both provide with at least one pair of vias, the vias at the passivation layer and the vias at the planarization layer are exactly corresponded, and are all located above the at least one pair of thin-film transistors;

at least one pair of anodes disposed on the planarization layer, wherein the least one pair of anodes are electrically connected to the least one pair of thin-film transistors through the vias at the passivation layer and the vias at the planarization layer;

a pixel definition layer of a single material disposed on the planarization layer, wherein the single material is partially removed to form a recessed area that is defined and delimited by a portion of the single material such that the pixel definition layer includes at least one pair of notches, the at least one pair of notches being respectively located above the at least one pair of anodes, a part of the single material being preserved in the recessed area and located between the least one pair of the anodes such that a height of the part of the single material preserved in the recessed area and located between the least one pair of anodes is less than a height of the portion of the single material that defines and delimits the recessed area and a top surface of the part of the single material preserved in the recessed area and located between the least one pair of the anodes is lower than a top surface of the portion of the single material that defines and delimits the recessed area; and

a light-emitting layer disposed in the recessed area of the pixel definition layer, wherein the light-emitting layer is in contact with each of the at least one pair of anodes so that the light-emitting layer is in contact with plural anodes of the at least one pair of anodes and extends over and covers the pixel definition layer located between the plural anodes of the at least one pair of anodes wherein the light-emitting layer is completely received in the recessed area and has a height that is greater than the height of the part of the single material preserved in the recessed area and located between the at least one pair of the anodes and smaller than the height of the portion of the single material that defines and delimits the recessed area, wherein the light-emitting layer covers the part of the single material preserved in the recessed area and located between the at least one pair of the anodes and does not cover the portion of the single material that defines and delimits the recessed area.

15. The inkjet printing OLED display panel according to claim 14 , wherein a cathode is disposed on the light-emitting layer.

16. The inkjet printing OLED display panel according to claim 14 , wherein the passivation layer includes at least one layer of SiOx and/or at least one layer of SiNx, and a thickness range of the passivation layer is 1000˜5000 angstrom;

the planarization layer includes at least one photoresist layer having at least one kind of photoresist, and a thickness range of the planarization layer is 10000˜20000 angstrom; and

the pixel definition layer includes at least one photoresist layer having at least one kind of photoresist, a thickness range of the pixel definition layer located at two sides of the at least one pair of anodes is 10000˜20000 angstrom.