Chip electronic component

1. A chip electronic component comprising:

a magnetic body including first magnetic metal particles;

internal coil parts embedded within the magnetic body; and

insulation resistance layers disposed on opposing upper and lower surfaces of the magnetic body, and including second magnetic, conductive metal particles,

wherein at least one of the first magnetic metal particles includes an oxide layer, and

wherein at least one of the at least one of the first magnetic metal particles does not include a same oxide layer as an oxide coating of the second magnetic, conductive metal particles.

2. The chip electronic component of claim 1 , wherein

each of the second magnetic, conductive metal particles includes the oxide coating and a core covered with the oxide coating,

the oxide coating includes a chromium oxide, and

an Fe content of the core is 85% or greater.

3. The chip electronic component of claim 1 , wherein

a D50 of the first magnetic metal particles and a D50 of the second magnetic, conductive metal particles are the same.

4. The chip electronic component of claim 1 , wherein

the insulation resistance layers cover the entire upper surface and the entire lower surface of the magnetic body.

5. The chip electronic component of claim 1 , wherein

the insulation resistance layers are further disposed on opposing side surfaces of the magnetic body.

6. The chip electronic component of claim 5 , wherein

the insulation resistance layers cover an entirety of the opposing side surfaces of the magnetic body.

7. The chip electronic component of claim 1 , further comprising:

first and second external electrodes disposed on outer surfaces of the magnetic body to be connected to end portions of the internal coil parts,

wherein the first and second external electrodes each include an external electrode layer and a plating layer disposed on the external electrode layer.

8. The chip electronic component of claim 7 , wherein

the insulation resistance layers are disposed on portions of upper and lower surfaces of the magnetic body not covered by the external electrode layers.

9. The chip electronic component of claim 7 , wherein

the insulation resistance layers are further disposed on portions of opposing side surfaces of the magnetic body not covered with the external electrode layers.

10. The chip electronic component of claim 7 , wherein

the plating layer includes at least one selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn).

11. The chip electronic component of claim 1 , wherein the oxide coating includes a chromium oxide.