High thermal release interposer
An integrated circuit package having an interposer with increased thermal conductivity and techniques for fabricating such an integrated circuit package are provided. One example integrated circuit package generally includes a package substrate, at least one semiconductor die disposed above the package substrate, and an interposer disposed above the at least one semiconductor die. The interposer includes a dielectric layer, and a metallic plate disposed adjacent to a first portion of the dielectric layer. The height of the metallic plate is greater than a height of the dielectric layer.
1. An integrated circuit package, comprising:
a package substrate;
at least one semiconductor die disposed above the package substrate; and
an interposer disposed above the at least one semiconductor die, the interposer comprising:
a dielectric layer;
a first metallic layer disposed below the dielectric layer;
a second metallic layer disposed above the dielectric layer;
a first solder resist layer disposed below the first metallic layer;
a second solder resist layer disposed above the second metallic layer; and
a metallic plate disposed adjacent to a first portion of the dielectric layer, a first portion of the first solder resist layer, and a first portion of the second solder resist layer, wherein a height of the metallic plate is greater than a height of the dielectric layer.
2. The integrated circuit package of claim 1 , wherein the metallic plate is further disposed between the first portion of the dielectric layer and a second portion of the dielectric layer.
3. The integrated circuit package of claim 2 , further comprising:
a first set of metallic core balls disposed above the package substrate and below the first portion of the dielectric layer; and
a second set of metallic core balls disposed above the package substrate and below the second portion of the dielectric layer.
4. The integrated circuit package of claim 1 , wherein the metallic plate is further disposed adjacent to a first portion of the first metallic layer and a first portion of the second metallic layer.
5. The integrated circuit package of claim 4 , wherein the height of the metallic plate is greater than a sum of heights of the first metallic layer, the dielectric layer, and the second metallic layer.
6. The integrated circuit package of claim 4 , wherein the metallic plate is further disposed between:
the first portion of the first metallic layer and the first portion of the second metallic layer; and
a second portion of the first metallic layer and a second portion of the second metallic layer.
7. The integrated circuit package of claim 1 , wherein the height of the metallic plate is equal to a sum of heights of the first metallic layer, the first solder resist layer, the dielectric layer, the second metallic layer, and the second solder resist layer.
8. The integrated circuit package of claim 1 , wherein the metallic plate is further disposed between the first portion of the second solder resist layer and a second portion of the second solder resist layer.
9. The integrated circuit package of claim 1 , wherein the metallic plate is further disposed between:
the first portion of the first solder resist layer and the first portion of the second solder resist layer; and
a second portion of the first solder resist layer and a second portion of the second solder resist layer.
10. The integrated circuit package of claim 1 , further comprising at least one adhesive layer disposed above the at least one semiconductor die and below the metallic plate.
11. The integrated circuit package of claim 1 , wherein the metallic plate overlaps at least a portion of the at least one semiconductor die.
12. The integrated circuit package of claim 1 , further comprising a plurality of metallic core balls disposed below the package substrate.
13. The integrated circuit package of claim 1 , wherein the metallic plate is exposed at a bottom surface of the interposer for thermal coupling with the at least one semiconductor die.
14. The integrated circuit package of claim 1 , wherein the metallic plate is exposed at an upper surface of the interposer.
15. A method for fabricating an integrated circuit package, comprising:
forming a package substrate;
forming at least one semiconductor die above the package substrate; and
forming an interposer above the at least one semiconductor die, comprising:
forming a dielectric layer;
forming a first metallic layer below the dielectric layer;
forming a second metallic layer above the dielectric layer;
forming a first solder resist layer below the first metallic layer;
forming a second solder resist layer above the second metallic layer; and
forming a metallic plate adjacent to a portion of the dielectric layer, a first portion of the first solder resist layer, and a first portion of the second solder resist layer, wherein a height of the metallic plate is greater than a height of the dielectric layer.
16. The method of claim 15 , wherein the metallic plate is formed adjacent to a portion of the first metallic layer and a portion of the second metallic layer.
17. The method of claim 15 , wherein the height of the metallic plate is greater than a sum of heights of the first metallic layer, the dielectric layer, and the second metallic layer.
18. The method of claim 15 , wherein the height of the metallic plate is equal to a sum of heights of the first metallic layer, the first solder resist layer, the dielectric layer, the second metallic layer, and the second solder resist layer.
19. The method of claim 15 , wherein the metallic plate is formed between the first portion of the second solder resist layer and a second portion of the second solder resist layer.
20. The method of claim 15 , wherein the metallic plate is disposed between:
the first portion of the first solder resist layer and the first portion of the second solder resist layer; and
a second portion of the first solder resist layer and a second portion of the second solder resist layer.