Digital embossing
A method of forming a digital embossing on a surface by bonding hard press particles to a carrier. A liquid binder pattern is applied on the carrier by a digital drop application head. Hard press particles are applied on the carrier and the binder pattern such that some hard press particles are bonded to the carrier by the liquid pattern and non-bonded press particles are removed. The carrier with the bonded hard press particles is pressed to the surface and an embossing is formed when the carrier with the hard press particles is removed.
1. A press matrix for forming an embossed structure on a panel, wherein the press matrix comprises:
a carrier being a paper or a foil, the carrier having a planar front surface over a longitudinal extent, and a rear surface, wherein the front and rear surfaces of the carrier are arranged on opposite sides of the carrier; and
hard press particles arranged in a pattern and bonded to the planar front surface of the carrier, the hard press particles extending over only a first portion of the longitudinal extent of the planar front surface such that a second portion of the longitudinal extent of the planar front surface is free of hard press particles, and such that, when a press table having a planar surface is pressed against the planar front surface of the carrier over the longitudinal extent of the planar front surface, the hard press particles deform the rear surface of the carrier at a location of the hard press particles.
2. The press matrix as claimed in claim 1 , the rear surface being arranged on an opposite side of the carrier, wherein the hard press particles are arranged on the front surface of the carrier and a print is arranged on the opposite, rear surface of the carrier.
3. The press matrix as claimed in claim 2 , wherein the hard press particles and the print are coordinated such that an in-register embossed printed surface is obtained when the press matrix is pressed against a panel surface of the panel.
4. The press matrix as claimed in claim 2 , wherein the print is configured to be bonded to a panel surface of the panel after pressing the press matrix against the panel surface.
5. The press matrix as claimed in claim 2 , wherein the print is a binder and powder, BAP, print.
6. The press matrix as claimed in claim 1 , wherein the hard press particles are bonded to the carrier with a binder.
7. The press matrix as claimed in claim 1 , wherein at least some of the hard press particles are coated with a thermosetting resin or a thermoplastic resin.
8. The press matrix as claimed in claim 1 , wherein the carrier is substantially planar throughout the front surface and throughout rear surface of the carrier, the front surface and the rear surface being arranged on opposite sides of the carrier.
9. The press matrix as claimed in claim 1 , wherein the rear surface of the carrier that contacts the panel when forming the embossed surface is a non-planar surface.
10. The press matrix as claimed in claim 1 , wherein the pattern of hard press particles is raised from a remainder of the rear surface of the carrier.
11. The press matrix as claimed in claim 1 , wherein the hard press particles are configured to essentially maintain their shape during a pressing operation of the press matrix.
12. The press matrix as claimed in claim 1 , wherein the hard press particles comprises at least one of mineral particles, aluminum oxide, sand and stone powder.
13. The press matrix as claimed in claim 1 , further comprising a coating for forming a microstructure in the panel when the press matrix is pressed against a panel surface of the panel, wherein the microstructure provides a gloss level.
14. The press matrix as claimed in claim 1 , wherein the carrier is a coated paper.
15. The press matrix as claimed in claim 1 , wherein the press surface is pre-pressed.
16. The press matrix as claimed in claim 1 , wherein the press matrix is configured to be used several times for forming substantially the same embossed structure.
17. The press matrix as claimed in claim 1 , wherein the carrier comprises protrusions for forming cavities in the press matrix.