Substrate processing method and substrate processing apparatus
A substrate processing method includes a substrate holding step of horizontally holding a substrate having a first major surface and a second major surface at an opposite side of the first major surface, a coating film forming step of supplying a coating agent to the first major surface to form a sublimating coating film which covers the first major surface, and a coating film cleaning step of cleaning a front surface of the coating film.
1. A substrate processing method comprising:
a substrate holding step of horizontally holding a substrate having a first major surface, on which a metal pattern is formed, and a second major surface at an opposite side of the first major surface;
a coating film forming step of supplying a coating agent to the first major surface to form a sublimating coating film, which covers the first major surface, such that a thickness of the coating film is greater than a height of the metal pattern;
a coating film cleaning step of cleaning a front surface of the coating film; and
a sublimating step of sublimating the coating film by heating the substrate after an end of the coating film cleaning step,
wherein the coating film cleaning step is a step of removing a surface layer of the coating film, such that, even after removing the surface layer, the coating film remains on the first major surface with a thickness greater than the height of the metal pattern and the metal pattern is not exposed, and
the sublimating step is a step of removing all the coating film which remains on the first major surface even after removal of the surface layer of the coating film.
2. The substrate processing method according to claim 1 , further comprising: a second major surface cleaning step of cleaning the second major surface after the end of the coating film forming step,
wherein the coating film cleaning step is started after the end of the second major surface cleaning step or is executed in parallel with the second major surface cleaning step.
3. The substrate processing method according to claim 2 , wherein the coating film cleaning step includes a first cleaning step of starting cleaning of the front surface of the coating film after the end of the second major surface cleaning step.
4. The substrate processing method according to claim 2 , wherein the coating film cleaning step includes a second cleaning step of cleaning the front surface of the coating film in parallel with the second major surface cleaning step.
5. The substrate processing method according to claim 4 , wherein the second cleaning step is ended after the end of the second major surface cleaning step.
6. The substrate processing method according to claim 2 , further comprising: a protective liquid supplying step of supplying a protective liquid, which protects the front surface of the coating film, to the front surface of the coating film,
wherein the protective liquid supplying step is executed in parallel with the second major surface cleaning step before the start of the coating film cleaning step.
7. The substrate processing method according to claim 1 , wherein removal of the surface layer of the coating film in the coating film cleaning step is executed by supplying a cleaning liquid to the front surface of the coating film.
8. The substrate processing method according to claim 1 , wherein the coating film forming step includes a solidifying step of heating the substrate, after the coating agent is supplied to the first major surface, to solidify the coating agent and form the coating film.
9. The substrate processing method according to claim 8 , further comprising: a peripheral edge cleaning step of cleaning a peripheral edge of the second major surface before the start of the solidifying step.
10. The substrate processing method according to claim 1 , wherein removal of the surface layer of the coating film in the coating film cleaning step is executed by scrub-cleaning the first major surface by a brush.
11. The substrate processing method according to claim 8 , wherein a heating temperature of the substrate in the sublimating step is higher than a heating temperature of the heating in the solidifying.
12. The substrate processing method according to claim 11 , wherein the solidifying includes a step of solidifying the coating agent by heating the substrate by a first heater, and the sublimating step includes a step of sublimating the coating film by heating the substrate by a second heater which is hotter than the first heater.
13. The substrate processing method according to claim 12 , wherein the substrate holding step includes a step in which the substrate is held horizontally by a first substrate holding unit and a step in which the substrate is held horizontally by a second substrate holding unit,
the method comprises a first transferring step of transferring the substrate from the first substrate holding unit to the first heater, a second transferring step of transferring the substrate from the first heater to the second substrate holding unit, and a third transferring step of transferring from the second substrate holding unit to the second heater,
the coating film forming step includes a step of supplying the coating agent to the first major surface of the substrate held by the first substrate holding unit, and a step of solidifying the coating agent by heating the substrate by the first heater after transferring the substrate, which holds the coating agent on the first major surface, from the first substrate holding unit to the first heater,
the coating film cleaning step includes a step of cleaning the front surface of the coating film after transferring the substrate in a state where the coating film is formed on the first major surface, from the first heater to the second substrate holding unit, and
the sublimating step includes a step of heating the substrate by the second heater after transferring the substrate in a state where the coating film is cleaned, from the second substrate holding unit to the second heater.
14. The substrate processing method according to claim 1 , further comprising: a second major surface cleaning step of cleaning the second major surface by supplying the cleaning liquid to the second major surface, after finishing the coating film forming step,
a guard positioning step of positioning a guard, which receives the cleaning liquid splashed from the second major surface on the side of the substrate.
15. The substrate processing method according to claim 14 , wherein the coating film cleaning step includes a step of washing away the cleaning liquid which is splashed back from the guard and adhered to the front surface of the coating film.
16. The substrate processing method comprising:
a substrate holding step of horizontally holding a substrate having a first major surface and a second major surface at an opposite side of the first major surface;
a coating film forming step of supplying a coating agent to the first major surface to form a sublimating coating film which covers the first major surface;
a coating film cleaning step of cleaning a front surface of the coating film; and
a second major surface cleaning step of cleaning the second major surface after the end of the coating film forming step,
wherein the coating film cleaning step is started after the end of the second major surface cleaning step or is executed in parallel with the second major surface cleaning step,
the method further comprises a protective liquid supplying step of supplying a protective liquid, which protects the front surface of the coating film, to the front surface of the coating film, and
the protective liquid supplying step is executed in parallel with the second major surface cleaning step before the start of the coating film cleaning step.