Thin-film transistor including oxide semiconductor layer, method of manufacturing the same, and display apparatus including the same
A thin-film transistor is disclosed. The thin-film transistor includes a gate electrode disposed on a substrate, an oxide semiconductor layer disposed so as to overlap at least a portion of the gate electrode in the state of being isolated from the gate electrode, a gate insulation film disposed between the gate electrode and the oxide semiconductor layer, a source electrode connected to the oxide semiconductor layer, and a drain electrode connected to the oxide semiconductor layer in the state of being spaced apart from the source electrode, wherein the oxide semiconductor layer includes indium (In), gallium (Ga), zinc (Zn), tin (Sn), and oxygen (O), the content of indium (In) in the oxide semiconductor layer is greater than the content of gallium (Ga), the content of indium (In) is substantially equal to the content of zinc (Zn), and the content ratio (Sn/In) of tin (Sn) to indium (In) is 0.1 to 0.25.
1. A thin-film transistor, comprising:
an oxide semiconductor layer comprising indium (In), gallium (Ga), zinc (Zn), tin (Sn), and oxygen (O), wherein
a content of In in the oxide semiconductor layer is greater than a content of Ga,
a content of In in the oxide semiconductor layer is greater than a content of Sn,
the oxide semiconductor layer has a first layer and a second layer, the second layer being stacked on the first layer, and
an O content of the second layer is greater than an O content of the first layer.
2. The thin-film transistor according to claim 1 , wherein a content ratio (Sn/In) of Sn to In is 0.1 to 0.25.
3. The thin-film transistor according to claim 1 , wherein the content of In is substantially equal to a content of Zn.
4. The thin-film transistor according to claim 1 , wherein the oxide semiconductor layer has a thickness of 20 nm or more.
5. The thin-film transistor according to claim 1 , wherein the oxide semiconductor layer has a mobility of 18 cm 2 /V·s or more.
6. The thin-film transistor according to claim 1 , wherein the oxide semiconductor layer has a carrier concentration of 5×10 17 EA/cm 3 or more.
7. The thin-film transistor according to claim 1 , wherein the oxide semiconductor layer has a packing density of 6.5 g/cm 3 or more.
8. The thin-film transistor according to claim 1 , wherein the oxide semiconductor layer has a spin density of 2.0×10 17 spins/cm 3 or less.
9. The thin-film transistor according to claim 1 , further comprising a gate electrode, wherein the first layer is disposed closer to the gate electrode than the second layer.
10. The thin-film transistor according to claim 1 , wherein a content ratio of each of In, Ga, Zn and Sn based on total amount of In, Ga, Zn and Sn is substantially same in the first layer and the second layer.
11. The thin-film transistor according to claim 1 , wherein the second layer has a thickness equivalent to 5 to 20% of a thickness of the oxide semiconductor layer.
12. The thin-film transistor according to claim 1 , further comprising a source electrode and a drain electrode connected to the oxide semiconductor layer, the source electrode and the drain electrode being disposed so as to be spaced apart from each other,
wherein a thickness of a region of the second layer that does not overlap the source electrode and the drain electrode is greater than a thickness of a region of the second layer that overlaps at least one of the source electrode or the drain electrode.
13. The thin-film transistor according to claim 1 , wherein the content of In is 1.5 to 5 times the content of Ga.
14. A thin-film transistor, comprising:
an oxide semiconductor layer comprising indium (In), gallium (Ga), zinc (Zn), tin (Sn), and oxygen (O), wherein,
wherein the content of In is substantially equal to the content of Zn,
the content of In in the oxide semiconductor layer is greater than the content of Ga, and
the content of In in the oxide semiconductor layer is greater than the content of Sn.
15. The thin-film transistor of claim 14 wherein
the oxide semiconductor layer has a first layer and a second layer, the second layer being stacked on the first layer, and
an O content of the second layer is greater than an O content of the first layer.
16. The thin-film transistor according to claim 15 , further comprising a gate electrode, wherein the first layer is disposed closer to the gate electrode than the second layer.
17. The thin-film transistor according to claim 15 , wherein a content ratio of each of In, Ga, Zn and Sn based on total amount of In, Ga, Zn and Sn is substantially same in the first layer and the second layer.
18. A thin-film transistor, comprising:
an oxide semiconductor layer comprising indium (In), gallium (Ga), zinc (Zn), tin (Sn), and oxygen (O), wherein,
the oxide semiconductor layer has a packing density of 6.5 g/cm 3 or more,
a content of In in the oxide semiconductor layer is greater than a content of Ga, and
a content of In in the oxide semiconductor layer is greater than a content of Sn.
19. The thin-film transistor of claim 18 wherein
the oxide semiconductor layer has a first layer and a second layer, the second layer being stacked on the first layer, and
an O content of the second layer is greater than an O content of the first layer.
20. The thin-film transistor according to claim 19 , wherein a content ratio of each of In, Ga, Zn and Sn based on total amount of In, Ga, Zn and Sn is substantially same in the first layer and the second layer.