Vertical transistors having improved control of top source or drain junctions
Embodiments of the invention are directed to a method of forming a semiconductor device. A non-limiting example of the method includes forming a channel fin over a substrate and forming a top spacer region around a top portion of the channel fin, wherein the top spacer region includes a dopant. A dopant drive-in process is applied, wherein the dopant drive-in process is configured to drive the dopant from the top spacer region into the top portion of the channel fin to create a doped top portion of the channel fin and a top junction between the doped top portion of the channel fin and a main body portion of the channel fin.
1. A method of forming a semiconductor device, the method comprising:
forming a channel fin over a substrate, the channel fin configured to conduct current between a top doped source or drain (S/D) region and a bottom doped S/D region, the channel fin having a top portion comprising a channel fin semiconductor material, wherein the top portion of the channel fin comprises a first portion of the channel fin semiconductor material and a second portion of the channel fin semiconductor material;
forming a top spacer region around sidewalls of the first portion of the top portion of the channel fin while leaving sidewalls of the second portion of the top portion of the channel fin exposed, wherein the top spacer region comprises a dopant; and
forming a first portion of the top doped source or drain (S/D) region by applying a dopant drive-in process, wherein the dopant drive-in process is configured to drive the dopant, while the sidewalls of the second portion are exposed, from the top spacer region through the sidewalls of the first portion of the channel fin and into the first portion and the second portion of the top portion of the channel fin to create the first portion of the doped top S/D region and a top junction between the first portion of the top S/D region and a main body portion of the channel fin; and
forming a second portion of the top doped S/D region by epitaxially growing the second portion of the top doped S/D region from exposed surfaces of the first portion of the top doped S/D region.
2. The method of claim 1 further comprising forming a gate structure across from the substrate and around a central portion of the channel fin.
3. The method of claim 2 , wherein the gate structure laterally overlaps the top junction.
4. The method of claim 1 , wherein the top spacer region comprises a low-k dielectric material.
5. The method of claim 1 wherein the location of the top junction is controlled based at least in part on a thickness dimension of the top spacer region.
6. The method of claim 5 wherein the location of the top junction is controlled based at least in part on a temperature of the dopant drive-in process.
7. The method of claim 6 wherein the location of the top junction is controlled based at least in part on a duration of the dopant drive-in process.
8. The method of claim 1 , wherein the dopant comprises an n-type dopant.
9. The method of claim 1 , wherein the dopant comprises a p-type dopant.
10. A semiconductor device comprising:
a channel fin formed over a substrate, the channel fin configured to conduct current between a top doped source or drain (S/D) region and a bottom doped S/D region, the channel fin having a top portion comprising a channel fin semiconductor material, wherein the top portion of the channel fin comprises a first portion of the channel fin semiconductor material and a second portion of the channel fin semiconductor material;
a top spacer region formed around sidewalls of the first portion of the top portion of the channel fin and not formed on sidewalls of the second portion of the top portion of the channel fin, wherein the top spacer region comprises a dopant;
wherein a first portion of the top doped source or drain (S/D) region comprises top doped portion dopants that were driven, while the sidewalls of the second portion were exposed, from the top spacer region through the sidewalls of the first portion of the channel fin and into the first portion and the second portion of the top portion of the channel fin to create the first portion of the doped top S/D region and a top junction between the first portion of the top S/D region and a main body portion of the channel fin; and
a second portion of the top doped S/D region epitaxially grown from the first portion of the top doped S/D region.
11. The device of claim 10 further comprising a gate structure formed across from the substrate and around a central portion of the channel fin.
12. The device of claim 11 , wherein the gate structure laterally overlaps the top junction.
13. The device of claim 10 , wherein the top spacer region comprises a low-k dielectric material.
14. The device of claim 10 wherein the location of the top junction is controlled based at least in part on a thickness dimension of the top spacer region.
15. The device of claim 14 wherein the location of the top junction is controlled based at least in part on a temperature of a dopant drive-in process used to drive dopants from the top spacer region through sidewalls of the first portion of the channel fin and into the first portion and the second portion of the top portion of the channel fin.
16. The device of claim 15 wherein the location of the top junction is controlled based at least in part on a duration of the dopant drive-in process.