Printed circuit boards and methods for manufacturing thereof for RF connectivity between electro-optic phase modulator and digital signal processor

1. A Printed Circuit Board (PCB) having a plurality of dielectric layers distributed between a plurality of conductive layers, the PCB including a Radio Frequency (RF) signal transition at a RF signal pad comprising:

a RF signal transmission trace in a conductive signal layer other than a top and bottom conductive layers;

a blind via providing electrical conductivity across at least one dielectric layer between the RF signal transmission trace and the RF signal pad; and

a ground cage structure within the PCB around the RF signal pad and the RF signal transmission trace, wherein the plurality of conductive layers other than the conductive signal layer and conductive portions of the conductive signal layer not in electrical contact with the RF signal transmission trace have common ground connections.

2. The PCB as claimed in claim 1 , the ground connections comprising ground stitching vias arranged in a concentric pattern around the signal pad.

3. The PCB as claimed in claim 1 , the ground connections comprising ground stitching vias arranged along the signal transmission trace.

4. The PCB as claimed in claim 1 , the ground cage structure comprising a group of conductive layers of the plurality of conductive layers, other than the bottom conductive layer, contoured with corresponding anti-pad diameters such that contoured inner conductive layer edges collectively form one of a spherical-shaped and a conical shaped ground cage structure, wherein dielectric layer material of the plurality of dielectric layers provides RF signal insulation in the RF signal transition.

5. The PCB as claimed in claim 4 , wherein at least one conductive layer adjacent the conductive signal layer comprises a conductive layer material extension into the ground cage structure, the conductive layer material extension being configured to compensate an impedance discontinuity of the one of the spherical-shaped and a conical shaped ground cage structure.

6. The PCB as claimed in claim 5 , each conductive material extension comprising an edge perpendicular to the RF signal transmission trace.

7. The PCB as claimed in claim 1 , the RF signal transmission trace having a width and the RF signal pad having a pad diameter, the RF signal transmission trace comprising a taper providing an impedance matched transition between the RF signal transmission trace and the RF signal pad.

8. The PCB as claimed in claim 1 , wherein the conductive portions of the conductive signal layer not in electrical contact with the RF signal transmission trace are spaced apart from the RF signal transmission trace to provide constant transmission line impedance along the RF signal transmission trace.

9. An electrical component including a Printed Circuit Board (PCB) having a Radio Frequency (RF) signal pad, the electrical component comprising:

a RF connector having a signal pin oriented perpendicularly to the RF signal pad on the PCB; and

the PCB having a plurality of dielectric layers distributed between a plurality of conductive layers, the PCB including a RF signal transition at the RF signal pad including:

a RF signal transmission trace in a conductive signal layer other than a top and bottom conductive layers;

a blind via providing electrical conductivity across at least one dielectric layer between the signal transmission trace and the signal pad; and

a ground cage structure within the PCB around the RF signal pad and the RF signal transmission trace, wherein the plurality of conductive layers other than the conductive signal layer and conductive portions of the conductive signal layer not in electrical contact with the RF signal transmission trace have common ground connections,

wherein the RF connector signal pin is connected perpendicularly to the RF signal pad.

10. The electrical component as claimed in claim 9 , the ground connections comprising ground stitching vias arranged in a concentric pattern around the signal pad.

11. The electrical component as claimed in claim 9 , the ground connections comprising ground stitching vias arranged along the signal transmission trace.

12. The electrical component as claimed in claim 9 , the ground cage structure comprising a group of conductive layers of the plurality of conductive layers, other than the bottom conductive layer, contoured with corresponding anti-pad diameters such that contoured inner conductive layer edges collectively form one of a spherical-shaped and a conical shaped ground cage structure, wherein dielectric layer material of the plurality of dielectric layers provides RF signal insulation in the RF signal transition.

13. The electrical component as claimed in claim 12 , wherein at least one conductive layer adjacent the conductive signal layer comprises a conductive layer material extension into the ground cage structure, the conductive layer material extension being configured to compensate an impedance discontinuity of the one of the spherical-shaped and a conical shaped ground cage structure.

14. The electrical component as claimed in claim 13 , each conductive material extension comprising an edge perpendicular to the RF signal transmission trace.

15. The electrical component as claimed in claim 9 , the RF signal transmission trace having a width and the RF signal pad having a pad diameter, the RF signal transmission trace comprising a taper providing an impedance matched transition between the RF signal transmission trace and the RF signal pad.

16. The electrical component as claimed in claim 9 , wherein the conductive portions of the conductive signal layer not in electrical contact with the RF signal transmission trace are spaced apart from the RF signal transmission trace to provide constant transmission line impedance along the RF signal transmission trace.