POLYPHENYLENE ETHER RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
A polyphenylene ether resin composition contains a modified polyphenylene ether copolymer and a high-molecular-weight compound. The modified polyphenylene ether copolymer is obtained by modifying a polyphenylene ether copolymer at a phenolic hydroxy group of a molecular chain end with a substituent having a carbon-carbon unsaturated double bond. The high-molecular-weight compound has a glass transition temperature (Tg) measured by differential scanning calorimetry of 20° C. or lower and has a number-average molecular weight Mn ranging from 1000 to 10000, inclusive. In a cured state of the polyphenylene ether resin composition, the modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound.
1 . A polyphenylene ether resin composition comprising:
a modified polyphenylene ether copolymer that a phenolic hydroxy group at a molecular chain end of a polyphenylene ether copolymer is substituted with a substituent having a carbon-carbon unsaturated double bond; and
a high-molecular-weight compound having a number-average molecular weight Mn ranging from 1000 to 10000, inclusive and having a glass transition temperature (Tg) of 20° C. or lower, the glass transition temperature being measured by differential scanning calorimetry, wherein
the modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound in a cured state of the polyphenylene ether resin composition.
2 . The polyphenylene ether resin composition according to claim 1 , further comprising a crosslinking agent for the modified polyphenylene ether copolymer, the crosslinking agent having at least two carbon-carbon unsaturated double bonds per molecule.
3 . The polyphenylene ether resin composition according to claim 1 , wherein the high-molecular-weight compound has a structure of at least one selected from a polybutadiene skeleton and a (meth)acrylate skeleton.
4 . The polyphenylene ether resin composition according to claim 1 , wherein the modified polyphenylene ether copolymer has a weight-average molecular weight ranging from 500 to 5000, inclusive and includes 1 to 3 functional groups.
5 . The polyphenylene ether resin composition according to claim 1 , wherein the substituent at a molecular chain end of the modified polyphenylene ether copolymer is represented by following formula (1):
where n represents an integer of 0 to 10, Z represents an arylene group, and R 1 to R 3 independently represent a hydrogen atom or an alkyl group, wherein Z represents either the arylene group or a carbonyl group when n equals 0.
6 . The polyphenylene ether resin composition according to claim 2 , wherein the crosslinking agent is a compound represented by a following formula:
where m represents an integer of 1 to 3, n represents 0 or 1, R 1 to R 3 independently represent a hydrogen atom or an alkyl group, X represents any one of an arylene group, a group having a tricyclodecane skeleton, and an isocyanurate group, and Y represents
where L represents an integer of 1 or more.
7 . The polyphenylene ether resin composition according to claim 1 , further comprising an inorganic filler.
8 . The polyphenylene ether resin composition according to claim 2 , further comprising an inorganic filler.
9 . The polyphenylene ether resin composition according to claim 8 , wherein a content ratio of the inorganic filler ranges from 40 parts by mass to 200 parts by mass, inclusive, relative to 100 parts by mass of a total of the modified polyphenylene ether copolymer, the high-molecular-weight compound, and the crosslinking agent.
10 . The polyphenylene ether resin composition according to claim 1 , further comprising a reaction initiator.
11 . The polyphenylene ether resin composition according to claim 1 , further comprising a flame retardant.
12 . A prepreg comprising:
a resin layer including a half-cured product of the polyphenylene ether resin composition according to claim 1 ; and
a fibrous substrate provided in the resin layer.
13 . A metal-clad laminate comprising:
a cured product of the prepreg according to claim 12 ; and
a metal foil provided on at least one surface of the cured product.
14 . A printed wiring board comprising:
a cured product of the prepreg according to claim 12 ; and
a conductor pattern provided as a circuit on a surface of the cured product.