IP Library › Granted Patent US 11,018,444
Granted Patent B2
US 11,018,444 · App. 16/033,141 · Granted May 25, 2021

Multi-mode and/or multi-speed non-volatile memory (NVM) express (NVMe) over fabrics (NVMe-of) device

Inventors: Sompong Paul Olarig (Pleasanton, CA); Fred Worley (San Jose, CA)
Assignee: Samsung Electronics Co., Ltd.
H01R12/737H01R12/721H01R43/205H01R43/26H05K1/181H05K3/303H05K2201/10159H05K2201/10189H05K2201/10212H05K2201/10522H05K2201/10545
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Quick Facts
Patent No.
US 11,018,444
App. No.
16/033,141
Granted
May 25, 2021
Kind
B2
Abstract

In an example, a device includes: a printed circuit board (PCB); at least one solid state drive (SSD) connected at a first side of the PCB via at least one SSD connector; at least one field programmable gate array (FPGA) mounted on the PCB at a second side of the PCB; and at least one connector attached to the PCB at a third side of the PCB, wherein the device is configured to operate in a first speed from a plurality of operating speeds based on a first input received via the at least one connector.

Claims (35)

1. A device comprising:

a printed circuit board (PCB);

at least one solid state drive (SSD) connected at a first side of the PCB via at least one SSD connector;

at least one field programmable gate array (FPGA) mounted on the PCB at a second side of the PCB, the second side of the PCB being different from the first side of the PCB; and

at least one connector attached to the PCB, wherein the device is configured to operate in a first mode or a second mode based on a first input received via the at least one connector, wherein in the first mode the device is configured to operate in a first non-zero operating speed, and wherein in the second mode the device is configured to select a second non-zero operating speed from among a plurality of non-zero operating speeds available in the second mode based on a second input received via the at least one connector, wherein the first mode is a Non-volatile memory (NVM) express (NVMe) mode and the second mode is a NVMe over fabrics (NVMe-oF) mode.

2. The device of claim 1 , wherein the at least one SSD comprises a first SSD and a second SSD and the at least one SSD connector comprises a first SSD connector and a second SSD connector, the first SSD being connected to the PCB at the first side of the PCB via the first SSD connector and the second SSD being connected to the PCB at the first side of the PCB via the second SSD connector, the first SSD and the second SSD each comprising a new form factor 1 (NF1) SSD, wherein the at least one connector comprises an U.2 connector and the first SSD connector and the second SSD connector each comprises a M.2 connector.

3. The device of claim 1 , wherein the at least one SSD connector is electrically connected to the at least one SSD at a first side of the at least one SSD, the at least one SSD connector being attached to the PCB at the first side of the PCB and being positioned perpendicular with respect to the first side of the PCB.

4. The device of claim 1 , further comprising a structural support located between the second side of the PCB and a second side of the at least one SSD, wherein the structural support comprises a support or standoff.

5. The device of claim 1 , wherein a length of the at least one SSD is 110 mm and a length of the PCB is between 110 mm and 142 mm.

6. The device of claim 1 , wherein a first side of the at least one FPGA is attached to the second side of the PCB, the at least one FPGA being electrically connected to the PCB.

7. The device of claim 6 , further comprising a first interface layer attached at a third side of the at least one SSD and a second interface layer attached at a second side of the at least one FPGA, wherein the first interface layer and the second interface layer are used to transfer heat generated by the at least one SSD and the at least one FPGA to outside.

8. The device of claim 1 , wherein the at least one connector comprises a SFF-TA-1008 connector.

9. The device of claim 1 , wherein a length of the PCB is equal to or greater than a length of the at least one SSD.

10. The device of claim 1 , wherein a length of the PCB is equal to or longer than a length of the at least one FPGA, the length of the at least one FPGA is 80 mm.

11. The device of claim 1 , wherein the plurality of non-zero operating speeds of the device are two or more operating speeds at or greater than 10G.

12. The device of claim 1 , wherein the first input is received from a mid-plane via the at least one connector, wherein the first input is controlled by using two general-purpose input/output (GPIO) pins controlled by a baseboard management controller (BMC) of a switch or a local central processing unit (CPU) of a motherboard, or one or more internal registers associated with the FPGA.

13. A system comprising:

a first interface layer;

at least one solid state drive (SSD) attached to the first interface layer at a first side of the at least one SSD;

a printed circuit board (PCB) connected to the at least one SSD at a first side of the PCB via at least one SSD connector;

at least one field programmable gate array (FPGA) mounted on the PCB at a second side of the PCB, wherein a first side of the FPGA is attached to the PCB, the second side of the PCB being different from the first side of the PCB;

a second interface layer attached to the FPGA at a second side of the FPGA; and

at least one connector attached to the PCB, wherein the system is configured to operate in a first mode or a second mode based on a first input received via the at least one connector, wherein in the first mode the system is configured to operate in a first non-zero operating speed, and wherein in the second mode the system is configured to select a second non-zero operating speed from among a plurality of non-zero operating speeds available in the second mode based on a second input received via the at least one connector, wherein the first mode is a Non-volatile memory (NVM) express (NVMe) mode and the second mode is a NVMe over fabrics (NVMe-oF) mode.

14. The system of claim 13 , wherein the at least one connector is an U.2 connector or a SFF-TA-1008 connector and the at least one SSD connector is a M.2 connector, the at least one SSD connector being positioned perpendicular with respect to the first side of the PCB.

15. The system of claim 13 , further comprising a structural support located between the second side of the PCB and a second side of the at least one SSD, wherein the structural support comprises a support or standoff.

16. The system of claim 13 , wherein a length of the at least one SSD is 110 mm, a length of the PCB is between 110 mm and 142 mm, and a length of the at least one FPGA is 80 mm.

17. The system of claim 13 , wherein a length of the PCB is equal to or greater than a length of the at least one SSD, and wherein the length of the PCB is equal to or greater than a length of the at least one FPGA.

18. A method comprising:

attaching a first interface layer at a first side of at least one solid state drive (SSD);

connecting the at least one SSD at a first side of a printed circuit board (PCB) via at least one SSD connector;

mounting at least one field programmable gate array (FPGA) on a second side of the PCB, wherein a first side of the FPGA is attached to the PCB, the second side of the PCB being different from the first side of the PCB;

attaching a second interface layer at a second side of the FPGA; and

attaching at least one connector to the PCB, wherein the at least one SSD is configured to operate in a first mode or a second mode based on a first input received via the at least one connector, wherein in the first mode the at least one SSD is configured to operate in a first non-zero operating speed, and wherein in the second mode the at least one SSD is configured to select a second non-zero operating speed from among a plurality of non-zero operating speeds available in the second mode based on a second input received via the at least one connector, wherein the first mode is a Non-volatile memory (NVM) express (NVMe) mode and the second mode is a NVMe over fabrics (NVMe-oF) mode.

19. The method of claim 18 , further comprising incorporating a structural support between the second side of the PCB and a second side of the at least one SSD, wherein the structural support comprises a support or standoff and the at least one SSD connector is positioned perpendicular with respect to the first side of the PCB.

20. The method of claim 18 , wherein a length of the PCB is equal to or greater than a length of the at least one SSD, and wherein the length of the PCB is equal to or greater than a length of the at least one FPGA.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 9, 2018
From: OLARIG, SOMPONG PAUL; WORLEY, FRED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 047104/0033 →
Continuity (2)
Provisional Application 62641250 · Mar 9, 2018
Related Publication 20190280411A1 · Sep 12, 2019