Packages with through-vias having tapered ends
A package includes a device die, a molding material molding the device die therein, a through-via substantially penetrating through the molding material, wherein the through-via has an end. The end of the through-via is tapered and has rounded sidewall surfaces. The package further includes a redistribution line electrically coupled to the through-via.
1. A package comprising:
a device die;
a molding material molding the device die therein, wherein the molding material comprises a first top surface;
a conductive through-via molded in the molding material, the conductive through-via comprising a second top surface recessed from the first top surface; and
a redistribution line electrically coupling to the conductive through-via, wherein a via portion of the redistribution line extends into the molding material, and the conductive through-via comprises a first end in contact with the via portion of the redistribution line, wherein the first end is tapered and comprises rounded sidewall surfaces.
2. The package of claim 1 , wherein the conductive through-via has a tapered top end.
3. The package of claim 1 further comprising a dielectric layer over the molding material, wherein the dielectric layer comprises:
a first portion over the molding material; and
a second portion extending into the molding material.
4. The package of claim 3 , wherein the second portion of the dielectric layer contacts the conductive through-via.
5. The package of claim 3 , wherein the via portion of the redistribution line extends into the second portion of the dielectric layer, with the second portion of the dielectric layer comprising portions on opposite sides of the via portion of the redistribution line.
6. The package of claim 1 , wherein the via portion of the redistribution line forms a rounded interface with the conductive through-via.
7. The package of claim 1 , wherein the conductive through-via further comprises:
a second end opposite to the first end, wherein the second end has substantially straight edges, and the first end is narrower than the second end.
8. The package of claim 7 , wherein the substantially straight edges extend to a majority of the conductive through-via, and the rounded sidewall surfaces of the first end taper starting from the substantially straight edges.
9. A package comprising:
at least one first dielectric layer;
a first plurality of redistribution lines in the at least one first dielectric layer;
a device die over and electrically coupling to the first plurality of redistribution lines;
a molding material molding the device die therein;
a conductive through-via in the molding material, wherein a top surface of the conductive through-via is lower than a top surface of the molding material;
a second dielectric layer over the device die, wherein the second dielectric layer extends into the molding material to contact the top surface of the conductive through-via; and
a second plurality of redistribution lines extending into the second dielectric layer, wherein one of the second plurality of redistribution lines is electrically coupled to one of the first plurality of redistribution lines through the conductive through-via.
10. The package of claim 9 , wherein the conductive through-via comprises a rounded top surface, and the device die comprises a metal pillar in contact with a bottom surface of the second dielectric layer, with a top surface of the metal pillar being rounded.
11. The package of claim 9 , wherein the one of the second plurality of redistribution lines comprises a via portion penetrating through the second dielectric layer, wherein the via portion is in contact with the top surface of the conductive through-via.
12. The package of claim 11 , wherein a lower portion of the second dielectric layer extends into the molding material, and the lower portion of the second dielectric layer comprises portions on opposite sides of the via portion.
13. The package of claim 12 , wherein the lower portion of the second dielectric layer has a bottom surface contacting the top surface of the conductive through-via to form a rounded interface.
14. The package of claim 9 , wherein the conductive through-via comprises tapered sidewalls.
15. A package comprising:
a metal post comprising a rounded top surface;
an encapsulating material encapsulating the metal post therein;
a dielectric layer over and contacting the encapsulating material;
a redistribution line comprising a conductive via extending into the dielectric layer and the encapsulating material to electrically couple to the metal post; and
a device die encapsulated in the encapsulating material, wherein the device die comprises metal pillars having top surfaces coplanar with a surface of the encapsulating material.
16. The package of claim 15 , wherein the metal post is in physical contact with the dielectric layer.
17. The package of claim 15 , wherein the metal post forms a rounded interface with the conductive via and the dielectric layer.
18. The package of claim 15 , wherein the metal post comprises:
a first portion having first sidewalls, wherein the first sidewalls are substantially vertical and straight; and
a second portion having second sidewalls continuously connected to the first sidewalls, wherein the second sidewalls are rounded and tapered.
19. The package of claim 15 , wherein the metal post has a bottom end portion having sidewalls substantially perpendicular to an interface between the dielectric layer and the encapsulating material.
20. The package of claim 15 , wherein an entirety of the metal post is in the encapsulating material.