Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
A microelectronic assembly can include a microelectronic package connected with a circuit panel. The package has a microelectronic element having a front face facing away from a substrate of the package, and electrically connected with the substrate through conductive structure extending above the front face. First terminals provided in first and second parallel grids or in first and second individual columns can be configured to carry address information usable to determine an addressable memory location from among all the available addressable memory locations of the memory storage array. The first terminals in the first grid can have signal assignments which are a mirror image of the signal assignments of the first terminals in the second grid.
1. A microelectronic package, comprising:
a substrate having first and second opposed surfaces, first and second opposed edges extending between the first and second surfaces, and a plurality of substrate contacts exposed at the first surface, the second surface having a central region containing a central axis of the microelectronic package located equidistant from the first and second edges, and first and second peripheral regions located between the central region and the respective first and second edges;
first and second microelectronic elements each having memory storage array function, each microelectronic element having a rear face facing the first surface, a front face opposite the rear face, and contacts on the front face electrically connected with the substrate contacts through conductive structure extending above the front face; and
a plurality of terminals exposed at the second surface and configured for connecting the microelectronic package with at least one component external to the microelectronic package, the terminals electrically connected with the substrate contacts and including a plurality of first terminals including a first set of the first terminals disposed in the first peripheral region and configured to carry address information and a second set of the first terminals disposed in the second peripheral region and configured to carry address information, the first set of the first terminals being symmetrically situated about the central axis with respect to the second set of the first terminals,
wherein the first set of the first terminals is electrically connected with the first microelectronic element and not electrically connected with the second microelectronic element, and the second set of the first terminals is electrically connected with the second microelectronic element and not electrically connected with the first microelectronic element.
2. The microelectronic package of claim 1 , wherein the terminals further include second terminals disposed in the central region and configured to carry second information, the second information being other than the information carried by the first terminals, the second information including data signals.
3. The microelectronic package of claim 2 , wherein the second terminals include a first set thereof disposed on a first side of the central axis and a second set thereof disposed on a second side of the central axis opposite from the first side, each of the first and second sets configured to carry the same data signals.
4. The microelectronic package of claim 3 , wherein the signal assignments of corresponding ones of the second terminals in the first and second sets are symmetric about the central axis.
5. The microelectronic package of claim 3 , wherein the second terminals of the first and second sets are disposed at positions within respective first and second grids, and columns of the second terminals in the first and second grids extend in a direction parallel to the first and second opposed edges of the substrate.
6. The microelectronic package of claim 1 , wherein the first terminals are configured to carry all of the address information usable by circuitry within the microelectronic package.
7. The microelectronic package of claim 1 , wherein the first set of first terminals and the second set of first terminals are each configured to carry all of the same signals.
8. The microelectronic package of claim 1 , wherein the signal assignments of corresponding ones of the first terminals in the first and second sets are symmetric about the central axis.
9. The microelectronic package of claim 1 , wherein the first terminals of the first and second sets are disposed at positions within respective first and second grids, and columns of the first terminals in the first and second grids extend in a direction parallel to the first and second opposed edges of the substrate.
10. The microelectronic package of claim 1 , wherein each of the microelectronic elements embodies a greater number of active devices to provide memory storage array function than any other function.
11. A microelectronic assembly, comprising:
a circuit panel having first and second opposed surfaces and first and second panel contacts exposed at the first and second surfaces, respectively; and
first and second microelectronic packages each having terminals mounted to the respective first and second panel contacts,
each of the first and second microelectronic packages including:
a substrate having first and second opposed surfaces, first and second opposed edges extending between the first and second surfaces, and a plurality of substrate contacts exposed at the first surface, the second surface having a central region containing a central axis located equidistant from the first and second edges, and first and second peripheral regions located between the central region and the respective first and second edges;
first and second microelectronic elements each having memory storage array function, each microelectronic element having a rear face facing the first surface, a front face opposite the rear face, and contacts on the front face electrically connected with the substrate contacts through conductive structure extending above the front face; and
the terminals exposed at the second surface and connected with the circuit panel, the terminals electrically connected with the substrate contacts and including a plurality of first terminals including a first set of the first terminals disposed in the first peripheral region and configured to carry address information and a second set of the first terminals disposed in the second peripheral region and configured to carry address information, the first set of the first terminals being symmetrically situated about the central axis with respect to the second set of the first terminals,
wherein the first set of the first terminals is electrically connected with the first microelectronic element and not electrically connected with the second microelectronic element within the respective microelectronic package, and the second set of the first terminals is electrically connected with the second microelectronic element and not electrically connected with the first microelectronic element within the respective microelectronic package.
12. The microelectronic assembly of claim 11 , wherein the terminals of each microelectronic package further include second terminals disposed in the respective central region and configured to carry second information, the second information being other than the information carried by the first terminals, the second information including data signals.
13. The microelectronic assembly of claim 12 , wherein the second terminals of each microelectronic package include a first set thereof disposed on a first side of the respective central axis and a second set thereof disposed on a second side of the respective central axis opposite from the first side, each of the first and second sets configured to carry the same data signals.
14. The microelectronic assembly of claim 13 , wherein the signal assignments of corresponding ones of the second terminals in the first and second sets of each microelectronic package are symmetric about the respective central axis.
15. The microelectronic assembly of claim 13 , wherein the second terminals of the first and second sets of each microelectronic package are disposed at positions within respective first and second grids, and columns of the second terminals in the first and second grids extend in a direction parallel to the first and second opposed edges of the respective substrate.
16. The microelectronic assembly of claim 11 , wherein the first terminals of each microelectronic package are configured to carry all of the address information usable by circuitry within the respective microelectronic package.
17. The microelectronic assembly of claim 11 , wherein the first set of first terminals and the second set of first terminals of each microelectronic package are each configured to carry all of the same signals.
18. The microelectronic assembly of claim 11 , wherein the signal assignments of corresponding ones of the first terminals in the first and second sets of each microelectronic package are symmetric about the respective central axis.
19. The microelectronic assembly of claim 11 , wherein the first terminals of the first and second sets of each microelectronic package are disposed at positions within respective first and second grids, and columns of the first terminals in the first and second grids extend in a direction parallel to the first and second opposed edges of the substrate.
20. The microelectronic assembly of claim 11 , wherein each of the microelectronic elements embodies a greater number of active devices to provide memory storage array function than any other function.