Shieldings for metal detector heads and manufacturing methods thereof
View Patent ↗Systems and methods for shielding a metal detector head include placement of conductive shielding around the coils of the head to reduce the effects of capacitance variation between the coils and their surroundings.
1. A metal detector head comprising:
a transmit-receive coil assembly;
shielding comprising at least one wiring pattern formed on at least one printed circuit board; and
a layer of planar elements covering at least one area of the shielding and forming a unitary structural relation with the at least one area of the shielding;
wherein the transmit-receive coil assembly comprises at least one receive coil and at least one transmit coil, the transmit coil positioned in spaced relation with the receive coil;
wherein the shielding is positioned between the transmit-receive coil assembly and an external environment;
wherein the shielding is configured to stabilize capacitance between the shielding and the at least one receive coil and the at least one transmit coil; and
wherein the shielding is configured to reduce effect on the metal detector head from changing capacitance caused by objects in the external environment.
2. The apparatus of claim 1 wherein the at least one wiring pattern comprises at least one of: fingers and interdigitated traces.
3. The apparatus of claim 1 wherein the at least one wiring pattern is placed in a geometric arrangement, the geometric arrangement configured to provide a fixed electric field between the at least one wiring pattern and the at least one receive coil and the at least one transmit coil.
4. The apparatus of claim 1 wherein the at least one wiring pattern is placed in a geometric arrangement wherein no current eddies and no current loops form in the shielding.
5. The apparatus of claim 1 wherein the wiring pattern includes tracings with spacing therebetween, wherein a width size of at least one of the tracings and the spacing therebetween is one of: between about 0.005 inch and 0.015 inch, between about 0.01 inch and 0.02 inch, between about 0.005 inch and 0.025 inch, about 0.01 inch, and about 0.015 inch.
6. The apparatus of claim 1 wherein the printed circuit board has a thickness, the thickness being one of: between about 0.01 inch and 0.1 inch, between about 0.01 inch and 0.04 inch, and about 0.02 inch.
7. The apparatus of claim 1 wherein the wiring pattern is arranged in parallel curved lines.
8. A method for manufacturing a shielded metal detector head, the method comprising:
assembling a metal detector head including a housing having a transmit-receive coil assembly, the transmit-receive coil assembly comprising at least one receive coil and at least one transmit coil, the transmit coil positioned in spaced relation with the receive coil;
placing shielding between the transmit-receive coil assembly and an external environment; and
forming a unitary structure including a layer of planar elements and at least one area of the shielding;
wherein the shielding comprises wiring patterns formed on at least one printed circuit board;
wherein the shielding is fixed between the transmit-receive coil assembly and the external environment to stabilize capacitance between the shielding and the at least one receive coil and at least one transmit coil;
wherein the shielding is configured to reduce effect on the metal detector head from changing capacitance caused by objects in the external environment.
9. The method of claim 8 wherein the at least one wiring pattern comprises at least one of the set of: fingers and interdigitated traces.
10. The method of claim 8 wherein the at least one wiring pattern is placed in a geometric arrangement, the geometric arrangement configured to provide a fixed electric field between the at least one wiring pattern and the at least one receive coil and the at least one transmit coil.
11. The method of claim 8 wherein the at least one wiring pattern is placed in a geometric arrangement wherein no current eddies and no current loops form in the shielding.
12. The method of claim 8 wherein the wiring pattern includes tracings with spacing therebetween, wherein a width size of at least one of the tracings and the spacing therebetween is one of: between about 0.005 inch and 0.015 inch, between about 0.01 inch and 0.02 inch, between about 0.005 inch and 0.025 inch, about 0.01 inch, and about 0.015 inch.
13. The method of claim 8 wherein the printed circuit board has a thickness, the thickness being one of: between about 0.01 inch and 0.1 inch, between about 0.01 inch and 0.04 inch, and about 0.02 inch.
14. The method of claim 8 wherein the wiring pattern is arranged in parallel curved lines.