IP Library Granted Patent US 10,978,316
Granted Patent B2
US 10,978,316 · App. 16/045,786 · Granted Apr 13, 2021

Semiconductor processing device

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Quick Facts
Patent No.
US 10,978,316
App. No.
16/045,786
Granted
Apr 13, 2021
Kind
B2
Abstract

A semiconductor processing device according to an embodiment includes a processing tank configured to store a chemical therein to allow a semiconductor substrate to be immersed in the chemical. A gas supply part is provided below the semiconductor substrate accommodated in the processing tank and is configured to supply air bubbles to the chemical from below the semiconductor substrate. A chemical supply part is provided above the gas supply part and below the semiconductor substrate and is configured to discharge the chemical caused to circulate from the processing tank, towards the air bubbles appearing from the gas supply part.

Claims (9)

1. A semiconductor processing device comprising:

a processing tank configured to store a chemical to allow a semiconductor substrate to be immersed in the chemical;

a gas supply part provided below the semiconductor substrate accommodated in the processing tank and configured to supply air bubbles to the chemical from below the semiconductor substrate; and

a first and a second chemical supply parts provided above the gas supply part and below the semiconductor substrate and configured to discharge the chemical into the processing tank in a substantially horizontal direction, towards air bubbles appearing from the gas supply part, wherein

the first and second chemical supply parts are arranged on both sides above the gas supply part substantially symmetrically,

the first chemical supply part is arranged at a position shifted from immediately above the gas supply part to one side in a substantially horizontal direction, and

the second chemical supply part is arranged at a position shifted from immediately above the gas supply part to the other side in a substantially horizontal direction.

2. The device of claim 1 , wherein

the first and second chemical supply parts alternately discharge the chemical.

Assignments (4)
CHANGE OF NAME AND ADDRESS Recorded Feb 4, 2022
From: K.K PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 058957/0124 →
CHANGE OF NAME AND ADDRESS Recorded Jan 31, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 058905/0582 →
MERGER Recorded Jan 31, 2022
From: TOSHIBA MEMORY CORPORATION
To: K.K PANGEA
Reel/Frame 058946/0675 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2018
From: NAKAOKA, SATOSHI; SUGITA, TOMOHIKO; KIMURA, SHINSUKE; ASHIDATE, HIROAKI; SATO, KATSUHIRO
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 046463/0706 →