Structure and method for testing three-dimensional memory device
Embodiments of structures and methods for testing three-dimensional (3D) memory devices are disclosed. In one example, a 3D memory device includes a memory array structure, a peripheral device structure, and an interconnect layer in contact with a front side of the memory array structure and a front side of the peripheral device structure, and a conductive pad at a back side of the memory array structure and that overlaps the memory array structure. The memory array structure includes a memory array stack, a through array contact (TAC) extending vertically through at least part of the memory array stack, and a memory array contact. The peripheral device structure includes a test circuit. The interconnect layer includes an interconnect structure. The conductive pad, the TAC, the interconnect structure, and at least one of the test circuit and the memory array contact are electrically connected.
1. A memory device, comprising:
a memory array structure comprising:
a memory array stack;
a through array contact (TAC) extending vertically through at least part of the memory array stack; and
one or more memory array contacts;
a first dielectric layer at a front side of the memory array structure;
a plurality of first contacts in the first dielectric layer;
a plurality of conductive pads at a backside of the memory array structure;
a complementary metal-oxide-semiconductor (CMOS) structure;
a metal layer at a front side of the CMOS structure, the metal layer comprising a plurality of metal patterns;
a second dielectric layer on the metal layer; and
a plurality of second contacts in the second dielectric layer,
wherein the metal layer is between the second dielectric layer and the CMOS structure,
wherein the first dielectric layer and the second dielectric layer are joined face to face, such that the memory array structure is above the CMOS structure, and one or more electrical connections are formed by at least the plurality of conductive pads, the TAC, the plurality of first contacts, the plurality of second contacts, the plurality of metal patterns in the metal layer, and at least one of the one or more memory array contacts.
2. The memory device of claim 1 , wherein at least one of the plurality of first contacts and at least one of the plurality of second contacts form a contact signal path.
3. The memory device of claim 2 , wherein the one or more memory array contacts comprise at least one of a word line contact and a bit line contact.
4. The memory device of claim 3 , wherein the plurality of conductive pads, the TAC, the plurality of first contacts, the plurality of second contacts, the plurality of metal patterns in the metal layer, and the word line contact are electrically connected to form a first one of the one or more electrical connections to test a plurality of contact signal paths.
5. The memory device of claim 3 , wherein the plurality of conductive pads, the TAC, the plurality of first contacts, the plurality of second contacts, the plurality of metal patterns in the metal layer, and the bit line contact are electrically connected to form a second one of the one or more electrical connections to test a plurality of contact signal paths.
6. The memory device of claim 4 , wherein the plurality of contact signal paths are connected in series.
7. The memory device of claim 4 , wherein at least some of the plurality of contact signal paths are connected in parallel.
8. The memory device of claim 7 , wherein at least one half of the plurality of contact signal paths are connected in parallel.
9. The memory device of claim 1 , wherein the CMOS structure comprises a test circuit electrically connected to the metal layer.
10. The memory device of claim 9 , wherein the test circuit comprises at least one of a memory array structure test circuit and a contact signal path test circuit.
11. The memory device of claim 10 , wherein the memory array structure test circuit comprises at least one of a memory plane test circuit, a memory block test circuit, a bit line test circuit, and a word line test circuit.
12. The memory device of claim 1 , wherein the memory array structure further comprises a third contact, wherein at least one of the plurality of conductive pads is electrically connected to the TAC by the third contact.
13. A method for forming a memory device, comprising:
forming a memory array structure comprising a memory array stack and one or more memory array contacts;
forming a through array contact (TAC) extending vertically through at least part of the memory array stack of the memory array structure;
forming a first dielectric layer at a front side of the memory array structure;
forming a plurality of first contacts in the first dielectric layer;
forming a plurality of conductive pads at a backside of the memory array structure;
forming a complementary metal-oxide-semiconductor (CMOS) structure;
forming a metal layer at a front side of the CMOS structure, the metal layer comprising a plurality of metal patterns;
forming a second dielectric layer on the metal layer, wherein the metal layer is between the second dielectric layer and the CMOS structure;
forming a plurality of second contacts in the second dielectric layer; and
joining the first dielectric layer and the second dielectric layer face to face, such that the memory array structure is above the CMOS structure, and one or more electrical connections are formed by at least the plurality of conductive pads, the TAC, the plurality of first contacts, the plurality of second contacts, the plurality of metal patterns in the metal layer, and at least one of the one or more memory array contacts.
14. The method of claim 13 , further comprising, prior to forming a metal layer at a front side of the CMOS structure, forming a test circuit, wherein the metal layer is electrically connected to the test circuit.
15. The method of claim 13 , further comprising, prior to forming a plurality of conductive pads at a backside of the memory array structure, forming a third contact from the backside of the memory array structure, wherein:
at least one of the plurality of conductive pads is electrically connected to the TAC by the third contact; and
the at least one of the plurality of conductive pads is formed above the third contact.