Implantable device for the brain
The present invention consists of an implantable device with at least one package that houses electronics that receives input data or signals, and optionally, power, from an external system through at least one coil attached to the at least one package, processes the input data and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that is/are attached to the at least one package. The invention, or components thereof, is/are intended to be installed in the head, or on or in the cranium, or on the dura, or on or in the brain.
1. An implantable device comprising:
a biocompatible hermetic package enclosing an electronic circuit adapted to be implanted within a human head and within a void in a cranium, the biocompatible hermetic package being less than 5 mm in height, shaped in a manner than permits the scalp to rest atop the biocompatible hermetic package, the biocompatible hermetic package made of metal and including a metal flange surrounding the biocompatible hermetic package, adapted to extend beyond the void in the cranium, and defining voids adapted for mounting the biocompatible hermetic package to the cranium;
a molded body attaching the biocompatible hermetic package to a secondary coil, the secondary coil receiving power and data for the electronic circuit;
a flexible circuit forming a plurality of separate electrode arrays, each electrode array including a plurality of stimulating electrodes, the flexible circuit electrically coupled to the electronic circuit and adapted to interface with neural tissue of the brain; and
a wireless transceiver electrically coupled to the electronic circuit for sending and receiving data.
2. The implantable device according to claim 1 , further comprising a plurality of biocompatible hermetic packages, including electronic circuits, coupled to the flexible circuit.
3. The implantable device according to claim 1 , wherein at least one of the plurality of electrode arrays includes penetrating electrodes.
4. The implantable device according to claim 2 , wherein at least one of the plurality of biocompatible hermetic packages includes a battery.
5. The implantable device according to claim 1 , wherein voids in the flange are configured to accept screws for attaching the biocompatible hermetic package to a cranium.
6. The implantable device according to claim 1 , wherein the flexible circuit comprises:
a polymer base layer forming array portions, cable portions, and a bond pad portion, the bond pad portion connected to the electronic circuit;
patterned metal traces deposited on the polymer base layer,
a polymer top layer deposited on the polymer base layer and the metal traces, the polymer top layer defining voids for the electrodes.
7. The implantable device according to claim 1 , wherein at least one of the electrode arrays is divided into fingers.
8. The implantable device according to claim 7 , wherein at least one of the fingers are curved.
9. The implantable device according to claim 7 , wherein at least one of the fingers are pointed.