IP Library › Granted Patent US 11,242,475
Granted Patent B2
US 11,242,475 · App. 16/052,615 · Granted Feb 8, 2022

Adhesive resin composition and laminate

Inventors: Hirokazu Iizuka (Tokyo, JP); Kunihiro Takei (Tokyo, JP); Jun Suzuki (Tokyo, JP)
Assignee: FUJIMORI KOGYO CO., LTD.
C09J123/26C09J151/06C08L2205/03Y10T428/28Y10T428/287
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Quick Facts
Patent No.
US 11,242,475
App. No.
16/052,615
Granted
Feb 8, 2022
Kind
B2
Abstract

Provided are an adhesive resin composition having high adhesiveness and high strength in acid resistance, and a laminate including the same. Provided is an adhesive resin composition including an acid-modified polyolefin resin component (A) having a weight average molecular weight of 30,000 or more and 150,000 or less, a resin component (B) having an epoxy group in a molecule, a resin component (C) having an amino group at a molecular end, and a solvent (S), in which a content of the resin component (B) is 1 part by mass or more and 30 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin resin component (A), and a content of the resin component (C) is 0.5 parts by mass or more and 15 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin resin component (A).

Claims (17)

1. An adhesive resin composition consisting essentially of:

an acid-modified polyolefin resin component (A) having a weight average molecular weight of 30,000 or more and 150,000 or less;

a resin component (B) having an epoxy group in a molecule;

a resin component (C) having an amino group at a molecular end; and

a solvent (S),

wherein

a content of said resin component (B) is 1 part by mass or more and 30 parts by mass or less based on 100 parts by mass of said acid-modified polyolefin resin component (A), and

a content of said resin component (C) is 0.5 parts by mass or more and 15 parts by mass or less based on 100 parts by mass of said acid-modified polyolefin resin component (A),

said acid-modified polyolefin resin component (A) is maleic anhydride-modified polypropylene having a melting point of 60° C. or higher and 85° C. or lower,

said resin component (B) is a novolac-modified epoxy resin having a bisphenol A structure in the molecule, and has a weight average molecular weight of 5,000 or more and 100,000 or less, and

said resin component (C) is at least one resin selected from the group consisting of an olefin resin in which a molecular end is modified with an amino group, a polyamine resin, a polyamide resin in which a molecular end is modified with an amino group, and a urea resin, and has a weight average molecular weight of 5,000 or more and 1,000,000 or less.

2. The adhesive resin composition according to claim 1 , wherein said acid-modified polyolefin resin component (A) has an acid addition amount of 0.5% by mass or more and 3.0% by mass or less.

3. The adhesive resin composition according to claim 1 , further comprising an isocyanate compound (D).

4. A laminate comprising:

an adherend; and

an adhesive resin layer laminated on one side of said adherend,

wherein said adhesive resin layer is formed of the adhesive resin composition according to claim 1 .

Assignments (2)
CHANGE OF NAME Recorded Jan 30, 2025
From: FUJIMORI KOGYO CO., LTD.
To: ZACROS CORPORATION
Reel/Frame 070060/0612 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2018
From: IIZUKA, HIROKAZU; TAKEI, KUNIHIRO; SUZUKI, JUN
To: FUJIMORI KOGYO CO., LTD.
Reel/Frame 046688/0482 →
Priority Claims (1)
JP JP2017-160386 · Aug 23, 2017 · national
Continuity (1)
Related Publication 20190062604A1 · Feb 28, 2019