Attaching printed circuit board to heat exchanger

1. A method, comprising:

providing a heat exchanger comprising a base plate and two ridges attached to the base plate, wherein the ridges form a splayed channel,

wherein a first ridge of the two ridges comprises a first longitudinal overhanging element extending towards a longitudinal axis of a base of the splayed channel, such that a transverse cross-section of the first ridge is a first L-shape, wherein a horizontal element of the first L-shape corresponds to the first longitudinal overhanding element, and

wherein a second ridge of the two ridges comprises a second longitudinal overhanging element extending towards the longitudinal axis of the base of the splayed channel, such that a transverse cross-section of the second ridge is a second L-shape, wherein a horizontal element of the second L-shape corresponds to the second longitudinal overhanding element;

placing a printed circuit board (PCB) into the splayed channel; and

applying, to at least one of the two ridges, a transverse force towards a longitudinal axis of the splayed channel, until a first external surface of the first ridge is substantially parallel to a second external surface of the second ridge.

2. The method of claim 1 , wherein placing the PCB into the splayed channel further comprises:

applying a thermal conductive material to a base of the splayed channel.

3. The method of claim 1 , wherein placing the PCB into the splayed channel further comprises:

bringing the PCB into a spatial vicinity of the splayed channel while the PCB is substantially parallel to the base plate such that a projection of the PCB on the base plate falls within the splayed channel.

4. The method of claim 1 , wherein placing the PCB into the splayed channel further comprises:

applying the transverse force to press the PCB towards a layer of a thermal conductive material applied to the base plate.

5. The method of claim 1 , wherein a first straight line formed by a first intersection of the first ridge with the base plate is substantially parallel to a second straight line formed by a second intersection of the second ridge.

6. The method of claim 1 , wherein the first ridge deviates, by an acute angle not exceeding 15 degrees, from a surface normal of the base plate.

7. The method of claim 6 , wherein the second ridge is parallel to the surface normal of the base plate.

8. The method of claim 7 , wherein placing the PCB into the splayed channel further comprises:

transversely sliding the PCB under the second ridge.

9. The method of claim 1 , wherein applying the transverse force further comprises:

applying a squeezing tool in several positions along the first ridge to ensure a uniform longitudinal alignment of the first ridge and the second ridge.

10. The method of claim 1 , wherein the PCB is provided by a metal core PCB.

11. A method, comprising:

placing a printed circuit board (PCB) into a splayed channel formed by two ridges attached to a base plate of a heat exchanger,

wherein a first ridge of the two ridges comprises a first longitudinal overhanging element extending towards a longitudinal axis of a base of the splayed channel, such that a transverse cross-section of the first ridge is a first L-shape, wherein a horizontal element of the first L-shape corresponds to the first longitudinal overhanding element, and

wherein a second ridge of the two ridges comprises a second longitudinal overhanging element extending towards the longitudinal axis of the base of the splayed channel, such that a transverse cross-section of the second ridge is a second L-shape, wherein a horizontal element of the second L-shape corresponds to the second longitudinal overhanding element;

applying a thermal conductive material to a base of the splayed channel; and

applying, to at least one of the two ridges, a transverse force towards a longitudinal axis of the splayed channel, until a first external surface of the first ridge is substantially parallel to a second external surface of the second ridge.

12. The method of claim 11 , wherein placing the PCB into the splayed channel further comprises:

bringing the PCB into a spatial vicinity of the splayed channel while the PCB is substantially parallel to the base plate such that a projection of the PCB on the base plate falls within the splayed channel.

13. The method of claim 11 , wherein placing the PCB into the splayed channel further comprises:

applying the transverse force to press the PCB towards a layer of a thermal conductive material applied to the base plate.

14. The method of claim 11 , wherein a first straight line formed by a first intersection of the first ridge with the base plate is substantially parallel to a second straight line formed by a second intersection of the second ridge with the base plate.

15. The method of claim 11 , wherein the first ridge deviates, by an acute angle not exceeding 15 degrees, from a surface normal of the base plate.

16. A heat exchanger, comprising:

a base plate;

a plurality of fins attached to the base plate; and

two ridges attached to the base plate, wherein the two ridges form a splayed channel configured to receive a printed circuit board (PCB),

wherein a first external surface of a first ridge of the two ridges is substantially parallel to a second external surface of a second ridge of the two ridges,

wherein the first ridge comprises a first longitudinal overhanging element extending towards a longitudinal axis of a base of the splayed channel, such that a transverse cross-section of the first ridge is a first L-shape, wherein a horizontal element of the first L-shape corresponds to the first longitudinal overhanding element, and

wherein the second ridge comprises a second longitudinal overhanging element extending towards the longitudinal axis of the base of the splayed channel, such that a transverse cross-section of the second ridge is a second L-shape, wherein a horizontal element of the second L-shape corresponds to the second longitudinal overhanding element.

17. The heat exchanger of claim 16 , wherein a first straight line formed by a first intersection of the first ridge with the base plate is substantially parallel to a second straight line formed by a second intersection of the second ridge with the base plate.

18. The heat exchanger of claim 16 , wherein the first ridge deviates, by an acute angle not exceeding 15 degrees, from a surface normal of the base plate.

19. The heat exchanger of claim 16 , wherein a base of the splayed channel is coated with a layer of a thermal conductive material.

20. The heat exchanger of claim 16 , further comprising:

one or more horizontal plates disposed across the plurality of fins.