IP Library › Granted Patent US 10,188,000
Granted Patent B2
US 10,188,000 · App. 16/055,207 · Granted Jan 22, 2019

Component mounting board

Inventor: Kuniaki Yosui (Nagaokakyo, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H05K3/34H05K1/141H05K1/18H05K3/28H05K3/323H05K3/361H05K2201/0129
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Quick Facts
Patent No.
US 10,188,000
App. No.
16/055,207
Granted
Jan 22, 2019
Kind
B2
Abstract

An insulating board includes a first portion that is relatively thick and a second portion that is relatively thin. The first and second portions have different thicknesses so that a step is provided therebetween. The insulating board includes a first land conductor on a first mounting surface of the first portion at a side at which the step is provided, a second land conductor on a second mounting surface of the second portion at the side at which the step is provided, and an insulating protection film on the first mounting surface so that a portion of the first land conductor is exposed and another portion of the first land conductor is covered. An electronic component is soldered to the first land conductor. Another electronic component is joined to the second land conductor by an anisotropic conductive film that covers the second land conductor.

Claims (12)

1. A component mounting board comprising: an insulating board; and a first electronic component and a second electronic component mounted on the insulating board; wherein the insulating board includes: a first portion that is relatively thick and a second portion that is relatively thin, the first portion and the second portion having different thicknesses so that a step is provided therebetween; a first land conductor provided on a first mounting surface of the first portion at a side at which the step is provided; a second land conductor provided on a second mounting surface of the second portion at the side at which the step is provided; and an insulating protection film provided on the first mounting surface so that a portion of the first land conductor is exposed and another portion of the first land conductor is covered by the insulating protection film; the first electronic component is soldered to the first land conductor; the second electronic component is joined to the second land conductor by an anisotropic conductive film that covers the second land conductor; and no insulating protection film that differs from the anisotropic conductive film is disposed on the second mounting surface, wherein the insulating board further includes a third portion that is thinner than the first portion; the component mounting board includes a third electronic component that is mounted on the third portion; and the third portion is thicker than the second portion.

2. The component mounting board according to claim 1 , wherein the second portion is flexible.

3. The component mounting board according to claim 1 , wherein the insulating board includes a plurality of insulating sheets that are laminated together in a thickness direction, and each of the plurality of insulating sheets is made of a thermoplastic resin.

4. The component mounting board according to claim 1 , wherein the second portion is surrounded by the first portion.

5. The component mounting board according to claim 1 , wherein an object is disposed in the first portion of the insulating board, and the object has a hardness greater than a hardness of the insulating board.

6. The component mounting board according to claim 3 , wherein each of the plurality of insulating sheets includes a liquid crystal polymer as a main material.

7. The component mounting board according to claim 1 , wherein another insulating protection film is provided on a surface of the insulating board at a side at which the step is not provided.

8. The component mounting board according to claim 1 , wherein the insulating protection film is made of an epoxy-resin-based paste.

9. The component mounting board according to claim 1 , wherein the second portion of insulating board includes a plurality of insulating sheets having the same or substantially the same area.

10. The component mounting board according to claim 1 , wherein the first portion of the insulating board has an area that is smaller than an area of the second portion of the insulating board.

11. The component mounting board according to claim 1 , wherein the insulating protection film includes at least one hole through which the first land conductor is exposed.

12. The component mounting board according to claim 11 , wherein the insulating protection film extends over an entirety of or substantially an entirety of the first mounting surface, except for the at least one hole.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 6, 2018
From: YOSUI, KUNIAKI
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 046558/0836 →
Priority Claims (1)
JP 2016-061220 · Mar 25, 2016 · national
Continuity (2)
Continuation PCTJP2017011576 · Mar 23, 2017
Related Publication 20180343747A1 · Nov 29, 2018