Coil component and method for manufacturing the same
A coil component includes a body including a plurality of pattern layers and a via electrode layer connecting the respective conductive pattern layers to each other, and external electrodes disposed on an external surface of the body. A cross-sectional shape of the via electrode layer is divided into an upper region and a lower region, a side surface of the upper region has a tapered shape, and a lower surface of the lower region includes a curved portion.
1. A coil component comprising:
a body having a multilayer structure in which a plurality of pattern layers are stacked in a stacking direction; and
external electrodes disposed on an external surface of the body;
wherein each of the plurality of pattern layers includes a conductive pattern, a via electrode connected to the conductive pattern, and an insulating material surrounding the conductive pattern and the via electrode, the via electrode includes an upper region in a position higher than that of the conductive pattern in a same pattern layer and a lower region in contact with the conductive pattern, a lower surface of the lower region includes a curved portion having a maximum width less than a width of a lower portion of the upper region, and a lowermost portion of the curved portion is arranged between the conductive pattern and the upper region in the stacking direction.
2. The coil component of claim 1 , wherein the insulating material is a photosensitive insulating material.
3. The coil component of claim 1 , wherein the insulating material is a thermosetting insulating material.
4. The coil component of claim 1 , wherein a radius of curvature of the curved portion is half or more to 5 times or less a length of an upper surface of the via electrode.
5. The coil component of claim 1 , wherein a side surface of the upper region is a tapered inclined surface.
6. The coil component of claim 5 , wherein an angle of the inclined surface is 5 degrees or more to 90 degrees or less.
7. The coil component of claim 5 , wherein a radius of curvature of the side surface of the upper region is one third or more to half or less a length of an upper surface of the via electrode.
8. The coil component of claim 1 , wherein a boundary surface of the conductive pattern in direct contact with the via electrode is disposed in a position lower than an uppermost surface of the conductive pattern in the same pattern layer.
9. The coil component of claim 1 , wherein the upper and lower regions of the via electrode are integrally formed without a boundary surface.
10. The coil component of claim 1 , wherein the upper region includes at least one interface, and a conductive material having a different composition is included based on the interface.
11. The coil component of claim 10 , wherein the upper region includes a Cu layer and a Sn layer on the Cu layer.
12. The coil component of claim 1 , wherein the lower surface of the lower region has a shape to complement a boundary surface of the conductive pattern in direct contact with the via electrode.