Semiconductor integrated circuit and control method thereof
The present technology relates to a semiconductor integrated circuit which operates with a low voltage and is capable of preventing destruction of a protection circuit and a control method thereof. The semiconductor integrated circuit includes a resistance element and a capacitance element connected between a power supply line and a ground line in series, an inverter of which an input is connected between the resistance element and the capacitance element, a MOS transistor of which a gate electrode is connected to an output of the inverter and a drain electrode and a source electrode are respectively connected to the power supply line and the ground line, and a current limit element inserted between a well region where the MOS transistor is formed and the gate electrode. The present technology is applied to, for example, the protection circuit for preventing destruction of an internal circuit by ESD and the like.
1. A semiconductor integrated circuit, comprising:
a first resistance element,
a first capacitance element, wherein
the first resistance element and the first capacitance element are connected in series, and
the first resistance element and the first capacitance element are connected between a power supply line and a ground line;
an inverter that includes an input terminal and an output terminal, wherein the input terminal of the inverter is connected between the first resistance element and the first capacitance element;
a well region;
a MOS transistor on the well region, wherein the MOS transistor includes:
a gate electrode connected to the output terminal of the inverter;
a drain electrode connected to the power supply line; and
a source electrode connected to the ground line; and
a current limit element between the well region and the gate electrode.
2. The semiconductor integrated circuit according to claim 1 , wherein
the current limit element includes a second resistance element, and
the second resistance element is different from the first resistance element.
3. The semiconductor integrated circuit according to claim 2 , wherein the gate electrode is the second resistance element.
4. The semiconductor integrated circuit according to claim 2 , wherein
the second resistance element includes a silicide block, and
the silicide block is on the gate electrode.
5. The semiconductor integrated circuit according to claim 2 , wherein
each of both ends of the gate electrode includes a corresponding contact portion,
the output terminal of the inverter is connected to the corresponding contact portion of the each of the both ends of the gate electrode,
the well region is connected to a specific contact portion,
the specific contact portion is at a proximity of a center of the gate electrode, and
the specific contact portion is different from the corresponding contact portion of the each of the both ends of the gate electrode.
6. The semiconductor integrated circuit according to claim 1 , wherein
the current limit element includes a second capacitance element, and
the second capacitance element is different from the first capacitance element.
7. The semiconductor integrated circuit according to claim 6 , wherein the second capacitance element is a MOS capacitor.
8. The semiconductor integrated circuit according to claim 1 , wherein
the current limit element includes a second resistance element and a second capacitance element,
the second resistance element is different from the first resistance element, and
the second capacitance element is different from the first capacitance element.
9. The semiconductor integrated circuit according claim 8 , wherein the second resistance element and the second capacitance element are connected in parallel.
10. The semiconductor integrated circuit according to claim 8 , wherein the gate electrode is the second resistance element.
11. The semiconductor integrated circuit according to claim 8 , wherein
the second resistance element includes a silicide block, and
the silicide block is on the gate electrode.
12. The semiconductor integrated circuit according to claim 8 , wherein the second capacitance element is a MOS capacitor.
13. The semiconductor integrated circuit according to claim 8 , wherein
each of both ends of the gate electrode includes a corresponding contact portion,
the output terminal of the inverter is connected to
the corresponding contact portion of the each of the both ends of the gate electrode, and
a specific contact portion at a proximity of a center of the gate electrode,
the specific contact portion is different from the corresponding contact portion of the each of the both ends of the gate electrode,
the corresponding contact portion of the each of the both ends of the gate electrode is directly connected to the well region, and
the specific contact portion is connected to the well region via the second capacitance element as the current limit element.
14. A semiconductor integrated circuit, comprising:
a resistance element;
a capacitance element, wherein
the resistance element and the capacitance element are connected in series, and
the resistance element and the capacitance element are connected between a power supply line and a ground line;
an inverter that includes an input terminal and an output terminal, wherein the input terminal of the inverter is connected between the resistance element and the capacitance element;
a well region;
a MOS transistor on the well region, wherein the MOS transistor includes:
a gate electrode connected to the output terminal of the inverters;
a drain electrode connected to the power supply line; and
a source electrode connected to the ground line; and
a current limit element between the well region and the gate electrode wherein the current limit element is configured to:
limit a current that flows into the inverters, and
increase a potential in the well region to accelerate an ON operation of the MOS transistor.