Semiconductor device
A leadframe of a semiconductor device includes a die pad, first and second suspension leads, and a frame. The main surfaces of the die pad and the frame are located on different planes, and the die pad and the frame are connected to each other by the first and second suspension leads. A first boundary line between the first suspension lead and the die pad runs on a straight line different from a second boundary line between the second suspension lead and the die pad. A third boundary line between the first suspension lead and the frame runs on a straight line different from a fourth boundary line between the second suspension lead and the frame.
1. A semiconductor device comprising:
a semiconductor element; and
a leadframe on which the semiconductor element is mounted,
the leadframe including a die pad on which the semiconductor element is mounted, a first suspension lead, a second suspension lead, and a frame, a main surface of the die pad and a main surface of the frame being located on different planes, the die pad and the frame being connected to each other by the first and second suspension leads,
a first boundary line between the first suspension lead and the die pad running on a straight line different from a second boundary line between the second suspension lead and the die pad,
a third boundary line between the first suspension lead and the frame running on a straight line different from a fourth boundary line between the second suspension lead and the frame.
2. The semiconductor device according to claim 1 , wherein
in the leadframe, the first suspension lead, the second suspension lead, and the frame are located at one side on the main surface of the die pad,
the first boundary line and the second boundary line are located on the main surface of the die pad, and
the third boundary line and the fourth boundary line are located on the main surface of the frame.
3. The semiconductor device according to claim 1 , wherein
the first boundary line and the second boundary line are parallel to each other, and
the third boundary line and the fourth boundary line are parallel to each other.
4. The semiconductor device according to claim 1 , wherein
the leadframe includes a third suspension lead,
the first boundary line between the first suspension lead and the die pad runs on a straight line different from a fifth boundary line between the third suspension lead and the die pad, and
the third boundary line between the first suspension lead and the frame runs on a straight line different from a sixth boundary line between the third suspension lead and the frame.
5. The semiconductor device according to claim 4 , wherein a main surface of the first suspension lead and a main surface of the second suspension lead form an angle of 10° or more, and the main surface of the first suspension lead and a main surface of the third suspension lead form an angle of 10° or more.
6. The semiconductor device according to claim 1 , wherein the first and second suspension leads have an equal length in a direction in which the first and second suspension leads run.
7. The semiconductor device according to claim 1 , wherein a hole portion penetrating the main surface of the frame or the main surface of the die pad is provided in part of the main surface.
8. The semiconductor device according to claim 4 , wherein at least part of the first, second, and third suspension leads are covered with a hard plating film.