Method for producing polyimide film, polyimide film, polyamic acid solution, and photosensitive composition
A method for producing a polyimide film includes: obtaining a polyamic acid solution having a viscosity of 5 to 150 cps by preparing a raw material mixture liquid containing a solvent, a tetracarboxylic dianhydride represented by a specific general formula, and an aromatic diamine represented by a specific general formula, and has a total content of the tetracarboxylic dianhydride and aromatic diamine of 15% by mass or less, and reacting the tetracarboxylic dianhydride and aromatic diamine with each other in the raw material mixture liquid forming a polyamic acid having a repeating unit represented by a specific general formula; obtaining a polyimide-forming mixture liquid by adding a compound represented by a specific general formula to the polyamic acid solution; and obtaining a polyimide film represented by a specific general formula by forming a film made of the polyimide-forming mixture liquid, followed by imidization of the polyamic acid in the film.
1. A method for producing a polyimide film, comprising the steps of:
obtaining a polyamic acid solution having a viscosity of 5 to 150 cps by preparing a raw material mixture liquid that contains
a solvent,
a tetracarboxylic dianhydride represented by the following general formula (1):
[in the formula (1), R 1 , R 2 , and R 3 each independently represent one selected from the group consisting of a hydrogen atom, alkyl groups having 1 to 10 carbon atoms, and a fluorine atom, and n represents an integer of 0 to 12], and
an aromatic diamine represented by the following general formula (2):
[Chem 2]
H 2 N—R 10 —NH 2 (2)
[in the formula (2), R 10 represents an arylene group having 6 to 50 carbon atoms], and that has a total content of the tetracarboxylic dianhydride and the aromatic diamine of 15% by mass or less, and reacting the tetracarboxylic dianhydride and the aromatic diamine with each other in the raw material mixture liquid to form a polyamic acid having a repeating unit represented by the following general formula (3):
[in the formula (3), R 1 , R 2 , and R 3 each independently represent one selected from the group consisting of a hydrogen atom, alkyl groups having 1 to 10 carbon atoms, and a fluorine atom, R 10 represents an arylene group having 6 to 50 carbon atoms, and n represents an integer of 0 to 12];
obtaining a polyimide-forming mixture liquid by adding, to the polyamic acid solution, a compound represented by the following general formula (4):
[in the formula (4), R 11 represents one selected from the group consisting of a hydrogen atom and alkyl groups, R 12 represents an optionally substituted aromatic group, R 13 represents an optionally substituted alkylene group, R 14 s each independently represent one selected from the group consisting of halogen atoms, a hydroxy group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphonato group, and organic groups, and m represents an integer of 0 to 3]; and
obtaining a film made of a polyimide having a repeating unit represented by the following general formula (5):
[in the formula (5), R 1 , R 2 , and R 3 each independently represent one selected from the group consisting of a hydrogen atom, alkyl groups having 1 to 10 carbon atoms, and a fluorine atom, R 10 represents an arylene group having 6 to 50 carbon atoms, and n represents an integer of 0 to 12]
by forming a film made of the polyimide-forming mixture liquid, followed by imidization of the polyamic acid in the film.
2. The method for producing a polyimide film according to claim 1 , wherein
the polyamic acid solution has a viscosity of 10 to 100 cps.
3. The method for producing a polyimide film according to claim 1 , wherein
the tetracarboxylic dianhydride and the aromatic diamine are reacted with each other in the raw material mixture liquid by stirring the raw material mixture liquid under a temperature condition of 0 to 50° C. for 0.5 to 24 hours.
4. A polyimide film, which is obtained by the method for producing a polyimide film according to claim 1 .
5. The polyimide film according to claim 4 , wherein
the polyimide film has a surface arithmetic mean roughness Ra of 0.01 to 2.0 nm.
6. A polyamic acid solution, comprising:
a solvent;
a polyamic acid having a repeating unit represented by the following general formula (3):
[in the formula (3), R 1 , R 2 , and R 3 each independently represent one selected from the group consisting of a hydrogen atom, alkyl groups having 1 to 10 carbon atoms, and a fluorine atom, R 10 represents an arylene group having 6 to 50 carbon atoms, and n represents an integer of 0 to 12]; and
a compound represented by the following general formula (4):
[in the formula (4), R 11 represents one selected from the group consisting of a hydrogen atom and alkyl groups, R 12 represents an optionally substituted aromatic group, R 13 represents an optionally substituted alkylene group, R 14 s each independently represent one selected from the group consisting of halogen atoms, a hydroxy group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphonato group, and organic groups, and m represents an integer of 0 to 3], wherein
the polyamic acid solution has a viscosity of 5 to 150 cps.
7. A photosensitive composition, comprising:
the polyamic acid solution according to claim 6 ; and
a photosensitive agent.