Thermally conductive sheet, production method for thermally conductive sheet, heat dissipation member, and semiconductor device
A thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein a mass ratio (insulating-coated carbon fibers/binder resin) of the insulating-coated carbon fibers to the binder resin is less than 1.30, and wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.
1. A thermal conducting sheet, comprising:
a binder resin;
insulating-coated carbon fibers; and
a thermal conducting filler other than the insulating-coated carbon fibers,
wherein a mass ratio (insulating-coated carbon fibers/binder resin) of the insulating-coated carbon fibers to the binder resin is less than 1.30, and
wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.
2. The thermal conducting sheet according to claim 1 ,
wherein an amount of the thermal conducting filler is from 48% by volume through 75% by volume.
3. The thermal conducting sheet according to claim 1 ,
wherein compressibility of the thermal conducting sheet at a load of 0.5 kgf/em 2 is 3% or more.
4. The thermal conducting sheet according to claim 1 , wherein the polymerizable material includes a compound including two or more radically polymerizable double bonds.
5. The thermal conducting sheet according to claim 1 ,
wherein the thermal conducting filler includes at least one selected from the group consisting of aluminum oxide, aluminum nitride, and zinc oxide.
6. The thermal conducting sheet according to claim 1 ,
wherein the binder resin is a silicone resin.
7. A method for producing the thermal conducting sheet according to claim 1 , the method comprising:
obtaining a molded body of a thermal conducting resin composition containing the binder resin, the insulating-coated carbon fibers, and the thermal conducting filler by molding the thermal conducting resin composition into a predetermined shape and curing the thermal conducting resin composition; and
obtaining a molded body sheet by cutting the molded body so as to have a sheet shape.
8. The method for producing the thermal conducting sheet according to claim 7 ,
wherein the polymerizable material is a radically polymerizable material.
9. The method for producing the thermal conducting sheet according to claim 7 , further comprising:
obtaining the insulating-coated carbon fibers by applying energy to a mixture obtained by mixing the polymerizable material, the carbon fibers, a polymerization initiator, and a solvent to activate the polymerization initiator, and form a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of the polymerizable material.
10. A heat dissipation member, comprising:
a heat spreader configured to dissipate heat generated by an electronic part; and
the thermal conducting sheet according to claim 1 provided on the heat spreader and interposed between the heat spreader and the electronic part.
11. A semiconductor device, comprising:
an electronic part;
a heat spreader configured to dissipate heat generated by the electronic part; and
the thermal conducting sheet according to claim 1 provided on the heat spreader and interposed between the heat spreader and the electronic part.
12. The semiconductor device according to claim 11 , further comprising:
a heat sink,
wherein a thermal conducting sheet is interposed between the heat spreader and the heat sink,
wherein the thermal conducting sheet comprises a binder resin, insulating-coated carbon fibers, and a thermal conducting filler other than the insulating-coated carbon fibers,
wherein a mass ratio (insulating-coated carbon fibers/binder resin) of the insulating-coated carbon fibers to the binder resin is less than 1.30, and
wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.
13. The thermal conducting sheet according to claim 1 ,
wherein a mass ratio (insulating-coated carbon fibers/binder resin) of the insulating-coated carbon fibers to the binder resin is 0.30 or more but less than 1.30.