Multi-Layer Photo Definable Glass with Integrated Devices
The invention relates to eliminating or dramatically reducing the mechanical distortion induced in photo-definable glass as a function of temperature and time processing during metallization that enable multi-layer and single layer photo-definable structures, that can contain electronic, photonic, or MEMS devices to create unique vertically integrated device or system level structures.
1 . A method for producing a fully dense metallized glass substrate where the metal is preferentially heated and or densified relative to the glass substrate comprising:
depositing a metal paste on the single or a multi-layer glass structure;
conducting a metallization thermal cycle with a thermal ramp rate of 10° C./min from 25° C. to 600° C., a 10 min hold at 600° C.; and ramp down from 600° C. to 25° C.; and
annealing the metal to the single or a multi-layer photo-definable glass structure under nitrogen to prevent oxidation of the metal, wherein the metallization thermal cycle induces a permanent random physical distortion and optical transmission change in the glass structure; wherein:
(a) a change in a position of the metal, the single or a multi-layer photo-definable glass structure, and one or more device structures after the metallization thermal cycle is less than 20 μm; and
(b) wherein a color of the glass substrate is not shifted greater than 75 nm, and
(c) wherein a temperature to time ratio does not exceed 70° C./min.
2 . The method of claim 1 , wherein the metal is copper, silver, platinum, gold, or a combination thereof.
3 . The method of claim 1 , wherein the glass is photo-definable.
4 . The method of claim 1 , wherein the glass substrate contains electronic, photonic, or MEMS devices.
5 . A method of integrating two or more glass substrates where the metal structures are preferentially heated and or densified relative to the glass substrate inducing change in the position of structures of less than 20 μm and without significantly altering the color of the glass substrate, wherein a change in a position of structures of less than 20 μm and wherein a color of the glass substrate is not shifted greater than 75 nm, and wherein a temperature time ratio of does not exceed 70° C./min, by a method comprising:
depositing a metal paste on the single or a multi-layer glass structure;
conducting a metallization thermal cycle with a thermal ramp rate of 10° C./min from 25° C. to 600° C., a 10 min hold at 600° C.; and ramp down from 600° C. to 25° C.; and
annealing the metal to the single or a multi-layer photo-definable glass structure under nitrogen to prevent oxidation of the metal, wherein the metallization thermal cycle induces a permanent random physical distortion and optical transmission change in the glass structure.
6 . The method of claim 5 , wherein the metal is copper, silver, platinum, gold, or a combination thereof.
7 . The method of claim 5 , wherein the glass is photo-definable.
8 . The method of claim 5 , wherein the glass substrate contains electronic, photonic, or MEMS devices.
9 . The method of claim 5 , wherein the metals may reside partially through, fully through, in between, or on top of the glass-ceramic material, or a combination thereof.
10 . A method for producing a single or a multi-layer glass structure with one or more devices on each of one or more layers with metal paste metallization comprising:
depositing a metal paste on the single or a multi-layer photo-definable glass structure;
conducting a metallization thermal cycle with a thermal ramp rate of 10° C./min from 25° C. to 600° C., a 10 min hold at 600° C.; and ramp down from 600° C. to 25° C.; and
annealing the metal to the single or a multi-layer photo-definable glass structure under nitrogen to prevent oxidation of the metal, wherein the metallization thermal cycle induces a permanent random physical distortion and optical transmission change in the photo-definable glass structure.
11 . The method of claim 5 , wherein the metal is copper, silver, platinum, gold, or a combination thereof.
12 . The method of claim 10 , wherein the metal is copper, silver, platinum, gold, or a combination thereof.
13 . The method of claim 10 , wherein the glass is photo-definable.
14 . The method of claim 10 , wherein the glass substrate contains electronic, photonic, or MEMS devices.
15 . The method of claim 10 , wherein metallization thermal cycle at least one of: (1) constrains a change in the relative change in position of the metal, the glass, and the one or more device structures to less than 20 μm, (2) wherein a color of the glass substrate is not shifted greater than 75 nm, or (3) wherein a temperature to time ratio does not exceed 70° C./min.