IP Library › Granted Patent US 11,441,011
Granted Patent B2
US 11,441,011 · App. 16/074,335 · Granted Sep 13, 2022

Thermally conductive molded resin article

Inventors: Fumihiro Mukai (Kobe, JP); Kotaro Yamaura (Kobe, JP); Hiroki Naito (Kobe, JP); Yasuhiro Sako (Kobe, JP)
Assignee: BANDO CHEMICAL INDUSTRIES, LTD.
C08K3/38C08K3/22C08K2003/2227C08K2003/382C08K2201/001C08K2201/005C08K2201/014C08K2201/016H01L23/3737H01L33/641
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Quick Facts
Patent No.
US 11,441,011
App. No.
16/074,335
Granted
Sep 13, 2022
Kind
B2
Abstract

Provided is a thermally conductive molded resin article that can be inexpensively mass-produced and that exhibits a low thermal resistance value as a result of reducing internal thermal resistance by high filling and reducing interfacial thermal resistance by improving cutting precision. The thermally conductive molded resin article is characterized by comprising a resin and thermally conductive fillers including a first thermally conductive filler and a second thermally conductive filler having a smaller particle size than the first thermally conductive filler. The thermally conductive molded resin article is also characterized in that: the first thermally conductive filler has an aspect ratio of 10 or more and is oriented approximately in the thickness direction of the thermally conductive molded resin article; the resin is a silicone resin, an acrylic rubber, or a fluororubber; and the second thermally conductive filler has a thermal conductivity surpassing 5 W/mK.

Claims (22)

1. A thermally conductive molded resin sheet article having a length, a width, and a thickness perpendicular to the length and width, which comprises

a resin and

thermally conductive fillers including

a first thermally conductive filler and

a second thermally conductive filler having a smaller particle size than the first thermally conductive filler;

the first thermally conductive filler has an aspect ratio of 10 or more and is oriented in the thickness direction of the thermally conductive molded resin article;

the resin is a silicone resin, an acrylic rubber, or a fluororubber; and

the second thermally conductive filler has a thermal conductivity of more than 5 W/mK;

wherein a weld line of the resin is formed in the thickness direction of the thermally conductive molded resin article.

2. A method of forming a thermally conductive molded resin sheet article having a length, a width, and a thickness perpendicular to the length and width, comprising the steps of

providing a composition that comprises

a resin and

thermally conductive fillers including

a first thermally conductive filler and

a second thermally conductive filler having a smaller particle size than the first thermally conductive filler;

wherein

the first thermally conductive filler has an aspect ratio of 10 or more;

the resin is a silicone resin, an acrylic rubber, or a fluororubber; and

the second thermally conductive filler has a thermal conductivity of more than 5 W/mK, and

conducting extrusion molding of the composition to form a thermally conductive molded resin article,

wherein the first thermally conductive filler is oriented in the thickness direction of the thermally conductive molded resin article, and

wherein a weld line of the resin is formed in the thickness direction of the thermally conductive molded resin article.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 31, 2018
From: MUKAI, FUMIHIRO; YAMAURA, KOTARO; NAITO, HIROKI; SAKO, YASUHIRO
To: BANDO CHEMICAL INDUSTRIES, LTD.
Reel/Frame 046516/0186 →
Priority Claims (1)
JP JP2016-016956 · Feb 1, 2016 · national
Continuity (1)
Related Publication 20210163708A1 · Jun 3, 2021